Fansinks for High-Temperature Applications

CTS Electronic Components, Inc., announces the addition of fansinks for high-temperature applications to its electronic components solutions product portfolio. These fansinks can maintain superior thermal dissipation for devices that emit high amount of heat. CTS’ fansinks are available in a wide range of footprints and fin heights which make them suitable for many elevated temperature applications such as component testing, burn-in, high density servers, high-speed computing, and video, and use in areas where the system airflow is constrained.

The FHL series of integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from high temperature devices while offering key features such as an operating temperature range of -10°C to 90°C, calculated MTTF at 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to best fit the application. Thermal resistance values range from 4.07°C/W to as low as 2.52°C/W.

The FHE series of integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from high temperature devices while offering key features such as an operating temperature range of -10°C to 90°C, calculated MTTF at 90°C: 86,858 hours (GEM, 90% confidence) and low profile to fit applications with space constraints. Thermal resistance values range from 1.75°C/W to as low as 1.19°C/W.

The FHP series of integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from high temperature devices while offering key features such as an operating temperature range of -10°C to 90°C, calculated MTTF at 90°C: 86,858 hours (GEM, 90% confidence) and low profile to fit applications with space constraints. Thermal resistance values range from 3.35°C/W to as low as 1.95°C/W.

The FEX series for integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from high temperature devices while offering key features such as an operating temperature range of -10°C to 90°C, calculated MTTF at 90°C: 86,858 hours (GEM, 90% confidence) and low profile to fit applications with space constraints.