Samtec offers a wide variety of board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch. We also offer various options for PC/104-PLUS™ systems.

This video discusses the Samtec AcceleRate® board-to-board and cable systems. It highlights their high-speed performance and ultra-compact designs. These interconnects are optimized for advanced networking, computing, and embedded applications.

Samtec’s FireFly™ Micro Flyover System™ is a future proof, inside-the-box interconnect solution, with performance to 28 Gbps and proven 850 nm VCSEL array technology. Optical cable systems also include PCIe®.

Samtec's Severe Environment Testing (SET) is additional testing of certain Samtec interconnects beyond typical industry standards and specifications to ensure performance and reliability in extreme/harsh environments.

Inside what it's like at our Advanced Interconnect Design center.

In this episode, Tomorrow Lab collaborates Rob Alexander from Silicon Labs to create a product using the MGM 240P— a wireless module ideal for mesh IoT wireless connectivity using Matter, Thread, Zigbee, and Bluetooth protocols.

Samtec's SEARAY™ open-pin-field arrays are high-speed and high-density solutions offering maximum grounding and routing flexibility in 0.80 mm and 1.27 mm pitches.

Samtec’s Signal Integrity Group offers industry-leading SI/PI support locally and around the globe for free! Samtec’s team of technical experts advocates the ideal interconnect solution for your particular application and performance.

Samtec AcceleRate systems are high-speed, high-density board-to-board and cable assembly interconnects.

Precision RF and mm wave are typically for higher frequencies, usually rated at greater than 30 GHz. Samtec RF cable assemblies and board-level connectors are currently rated up to 110 GHz.

Die Flyover-QSFP-Kabelbaugruppen von Samtec verfügen über ein hochkompaktes Design. Es ermöglicht eine Seitenbandsignalisierung über Einpresskontakte, was den Luftstrom verbessert.

The PICMG COM-HPC specification target high performance computing for industrial applications. This new standard defines modules that typically plug into custom carriers.

Samtec Flyover QSFP Cable Assemblies have an ultra-high-density design that includes sideband signaling via press-fit contacts that help increase airflow.

Die robusten diskreten Kabelbaugruppen und Komponenten von Samtec bieten umfangreiche Platzeinsparungen und Designflexibilität bei Kabel-zu-Leiterplatte-, Kabel-zu-Kabel- und Kabel-zu-Panel-Anwendungen.

The Samtec rugged discrete wire cable assemblies and components offer incredible space savings and design flexibility in cable-to-board, cable-to-cable and cable-to-panel applications.

Samtec AcceleRate® HD board-to-board system packs hundreds of I/Os in a compact footprint without sacrificing signal integrity. It is ideal in applications where extreme density and up to 56 Gbps PAM4 performance is required.

mPOWER® is the ultimate micro, high-power interconnect solution with incredible design flexibility for power-only or, power/signal applications by using alongside one of Samtec's high-speed connector systems.

Samtec designs and manufactures our own high-frequency, microwave/millimeter wave cables and connectors. In doing so, we're able to ensure the highest quality products that provide precise, repeatable electrical and mechanical results every time.

Samtec offers a full line of edge card connectivity solutions for industries and applications including datacom, industrial, high-performance computing, and the PCI Express® market, along with a product roadmap to support 56 Gbps speeds and beyond.

High cycle, high speed, high power, and harsh environment solutions that maximize space within a system. This includes IP68 & IP67 Sealed, Flexible Power, Rugged Signal Integrity, and Rugged Contact System designs.