Davies Molding has expanded their knob offering with metric sizes of their popular knob styles.

TE Connectivity's heavy duty connectors deliver outstanding performance in harsh environments across a wide range of applications.

TE Connectivity's POD-LOK ergonomic, low insertion force receptacle comes in strip form and can be crimped and applied in one step with an automatic applicator.

Wurth Electronics offers a variety of innovative molded coupled inductor options that include high voltage isolation and low profile with various turn ratios.

Taica Corporation is the manufacturer of Alpha-GEL® silicone anti-vibration and impact-absorbing products, and Lambda-GEL® Thermal Interface Materials (TIMs).

IXYS introduces their power semiconductor product line: 300 V ultra-junction X3-class HiPerFET™ power MOSFETs.

NXP's i.MX 6ULZ is a high-performance, cost-efficient consumer Linux processor featuring a single Arm® Cortex®-A7 core operating at 900 MHz.

Ideal-tek’s precision cutters are available in three cutting blade edges semi-flush, flush, and full-flush.

Parker Chomerics CHO-SEAL 6502 EMI shielding gasket comes in sheet form and is extruded into various profiles allowing for design and manufacturing flexibility.

Nordic's nRF9160 SiP offers a wide selection of general interfaces and peripherals for compact, complete, and energy-efficient cellular IoT solutions.

WIMA SMD series is produced with the proven box technology and covers almost the entire application range of conventional through-hole plastic film capacitors.

Parker Chomerics’ CHO-SEAL 1285 elastomer EMI gasket is available in sheet form and extruded into various profiles for design and manufacturing flexibility.

MEAN WELL's DRP-3200 and DPU-3200 series fully digital intelligent AC-DC power supplies offer models with the DC output highly demanded by the industry.

Parker Chomerics' CHO-TOUCH displays are optically bonded touchscreens and LCD units designed to save assembly time and supply chain logistics.

Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.