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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD9 - ImmediateView Details
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD14 - ImmediateView Details
CIN::APSE STACKING HARDWRE 25POS3180299353CIN::APSE STACKING HARDWRE 25POS20 - ImmediateView Details
CIN::APSE STACKING HARDWRE 51POS3180299356CIN::APSE STACKING HARDWRE 51POS19 - ImmediateView Details
CIN::APSE STACKING CONNECTOR JUM4631533093CIN::APSE STACKING CONNECTOR JUM0View Details
CIN::APSE STACKING CONNECTOR JUM4631533094CIN::APSE STACKING CONNECTOR JUM21 - ImmediateView Details