Tflex™ SF Product Portfolio Expansion

Product Highlights > Tflex™ SF Product Portfolio Expansion

            Tflex™ SF Product Portfolio Expansion
                    Laird Tflex SF silicone-free gap fillers offer superior thermal performance without overstressing boards and components
    

Laird non-silicone gap filler products now include Tflex SF4 and Tflex SF7. In addition to the Tflex SF10, these soft, non-silicone gap fillers offer superior thermal performance without overstressing boards and components. Featuring 4 W/mk, 7 W/mK, and 10 W/mk thermal conductivity, Laird has a material to fit all performance requirements.

The silicone-free technology provides products with excellent deflection properties and minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thicknesses from 0.5 mm (0.020”) up to 4 mm (0.160”) in 0.5 mm (0.020”) increments are available as standard.

Features

Silicone-free formulation
Thermal conductivity options for all performance needs
Low peak and residual pressure
Excellent surface wetting for low contact resistance
Exceptionally low thermal resistance

Easy handling
Naturally tacky
UL V-0 flammability rating
RoHS and REACH compliant

Applications

Servers
Routers
Network interface cards
Automotive electronics

Optical modules
Cameras
Hard drives