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Winbond Electronics Corporation
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Winbond Launches 8Gb DDR4 DRAM Built on Advanced 16nm Process Technology
Despite the increasing adoption of DDR5, many industries continue to rely on DDR4 for its proven stability and well-established ecosystem. Winbond’s 8Gb DDR4 DRAM is designed for customers who depend on the DDR4’s ecosystem but want faster data transfer and improved system competitiveness.
Safeguarding AI Applications: The Role of Secure Flash Technology in Meeting Industry Certifications
As AI adoption grows, security threats like data poisoning and backdoor attacks increase. Winbond Secure Flash, with strong authentication and authorization, protects data integrity and confidentiality. Combined with proper software and lifecycle management, it strengthens hardware security and meets industry standards, ensuring safer, more reliable AI applications.
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
Winbond advances sustainable memory with green fabs powered by 90% renewable energy, ultra-low-power Flash and DRAM, and secure, reliable solutions for AI, automotive, and industrial systems. Through green manufacturing, low voltage innovation, and verified ESG practices, Winbond enables high-performance designs with lower carbon impact across global applications.
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About Winbond Electronics Corporation
Winbond Electronics Corporation is one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. The Company provides customer-driven solutions backed by the expert capabilities of product design, R&D, manufacturing, and promoting brand name products globally. Winbond’s product portfolio, consisting of Code Storage Flash, TrustME® Secure Flash, Customized Memory Solution (CMS), is widely used by tier 1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. With its 12-inch fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park, Winbond keeps pace to develop in-house technologies to provide high-quality integrated circuit products and services.
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PRESS RELEASES
- Winbond Earns ISO/SAE 21434 Certification for W77Q Secure Flash, Becoming the World's First Memory IC Vendor to Achieve this Milestone
- Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0
- Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
- Winbond Introduces the Next Generation 8Mb Serial Flash for Edge Devices in Space Constrained IoT Applications
- Winbond Introduces the Next Generation 8Mb Serial Flash – W25Q80RV for Low Power and Small Form Factor IoT Devices
- Winbond joins STMicroelectronics Partner Program to Combine High-Performance Memory with STM32 Devices in Smart Industrial and Consumer Applications
- Winbond joins UCIe Consortium to Support High-Performance Chiplet Interface Standardization
- Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
- Winbond Sets Global Sustainability Standard with Sustainability Initiatives and Products
- Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
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