Name: CLP-130-02-H-D-A-P
Brand: Samtec Inc.
SKU: 612-CLP-130-02-H-D-A-P-ND
Price: 26.061 EUR
Availability: OutOfStock

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CLP-130-02-H-D-A-P
DigiKey Part Number	612-CLP-130-02-H-D-A-P-ND
Manufacturer	Samtec Inc.
Manufacturer Product Number	CLP-130-02-H-D-A-P
Description	LOW PROFILE DUAL-WIPE SOCKET, .0
Manufacturer Standard Lead Time	6 Weeks
Customer Reference
Detailed Description	60 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold
EDA/CAD Models	CLP-130-02-H-D-A-P Models

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Category Connectors, Interconnects Rectangular Connectors Headers, Receptacles, Female Sockets	Fastening Type Push-Pull
Mfr Samtec Inc.	Contact Finish - Mating Gold
Series CLP	Contact Finish Thickness - Mating 30.0µin (0.76µm)
Packaging Bulk	Insulation Color Black
Part Status Active	Insulation Height 0.084" (2.14mm)
Connector Type Receptacle	Operating Temperature -55°C ~ 125°C
Contact Type Female Socket	Material Flammability Rating UL94 V-0
Style Board to Board	Contact Finish - Post Gold
Number of Positions 60	Features Board Guide, Pick and Place
Number of Positions Loaded All	Current Rating (Amps) 3.3A per Contact
Pitch - Mating 0.050" (1.27mm)	Voltage Rating 240VAC, 330VDC
Number of Rows 2	Insulation Material Liquid Crystal Polymer (LCP)
Row Spacing - Mating 0.050" (1.27mm)	Contact Shape Square
Mounting Type Surface Mount	Contact Material Phosphor Bronze
Termination Solder	Contact Finish Thickness - Post 3.00µin (0.076µm)