Heat Sink FPGA Aluminum Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

IW-HSKALU-CLASLR-CU03

DigiKey Part Number
2503-IW-HSKALU-CLASLR-CU03-ND
Manufacturer
iWave Global
Manufacturer Product Number
IW-HSKALU-CLASLR-CU03
Description
ZYNQ ULTRASCALE+ MPSOC HEATSINK
Customer Reference
Detailed Description
Heat Sink FPGA Aluminum Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
iWave Global
Series
-
Packaging
Bulk
Part Status
Active
Type
Top Mount
Package Cooled
FPGA
Attachment Method
Bolt On
Shape
Rectangular, Fins
Length
3.740" (95.00mm)
Width
2.953" (75.00mm)
Diameter
-
Fin Height
1.181" (30.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
-
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 20
Non-Cancelable/Non-Returnable
MARKETPLACE PRODUCT
Will ship in approximately 7 days from iWave Global
A separate shipping fee may apply.
Unavailable in your selected currency
This product is unavailable in your selected currency. To purchase this product select an available currency below.