SMD to DIP PowerSOIC, PSOP, HSOP 10 0.050" (1.27mm) FR4 Epoxy Glass
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SMD to DIP PowerSOIC, PSOP, HSOP 10 0.050" (1.27mm) FR4 Epoxy Glass

IPC0050

DigiKey Part Number
IPC0050-ND
Manufacturer
Manufacturer Product Number
IPC0050
Description
POWERSOIC-10/PSOP-10/HSOP-10
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
SMD to DIP PowerSOIC, PSOP, HSOP 10 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Package Accepted
PowerSOIC, PSOP, HSOP
Manufacturer
Chip Quik Inc.
Number of Positions
10
Series
Pitch
0.050" (1.27mm)
Packaging
Bulk
Board Thickness
0.062" (1.57mm) 1/16"
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
1.000" x 0.700" (25.40mm x 17.78mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 28
Check for Additional Incoming Stock
Once available stock of this product has been depleted, manufacturer standard package and lead time will apply.
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
14,92000 €4,92 €
Manufacturers Standard Package
Unit Price without VAT:4,92000 €
Unit Price with VAT:5,85480 €