SMD to DIP BGA 36 0.012" (0.30mm) FR4 Epoxy Glass
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

BGA0028

DigiKey Part Number
315-BGA0028-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
BGA0028
Description
BGA-36 TO DIP-36 SMT ADAPTER
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP BGA 36 0.012" (0.30mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
Proto-Advantage
Packaging
Bulk
Part Status
Active
Proto Board Type
SMD to DIP
Package Accepted
BGA
Number of Positions
36
Pitch
0.012" (0.30mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.700" L x 1.800" W (17.78mm x 45.72mm)
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 1
Check for Additional Incoming Stock
Quantity
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
165,04000 €65,04 €
557,46400 €287,32 €
1054,75600 €547,56 €
2551,60400 €1.290,10 €
5049,50460 €2.475,23 €
10047,62240 €4.762,24 €
Manufacturers Standard Package
Unit Price without VAT:65,04000 €
Unit Price with VAT:77,39760 €