Image for 342945-COPPER SKIVFIN is not available
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

342945-COPPER SKIVFIN

DigiKey Part Number
59-342945-COPPERSKIVFIN-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
342945-COPPER SKIVFIN
Description
342945,REV03(GP)
Manufacturer Standard Lead Time
16 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Copper Board Level
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bulk
Part Status
Active
Type
Board Level
Package Cooled
BGA, FPGA
Attachment Method
Push Pin, Thermal Material
Shape
Square, Fins
Length
2.362" (60.00mm)
Width
2.362" (60.00mm)
Diameter
-
Fin Height
0.551" (14.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

Available To Order
Check Lead Time
This product is not kept in stock at DigiKey. The lead time shown will apply to the manufacturer’s shipment to DigiKey. Upon receiving the product, DigiKey will ship to fill open orders.
Quantity
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
10031,87450 €3.187,45 €
Manufacturers Standard Package
Unit Price without VAT:31,87450 €
Unit Price with VAT:37,93066 €