Laird Thermal Materials

Tflex™ SF600D Series

Compliant silicone-free 2.8-3.0 W/mK thermally conductive gap filler

Image of Laird Technologies - Thermal Products' Tflex SF600D SeriesLaird Technologies' Tflex SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 W/mK to 3.0 W/mK. Tflex SF600 DF is designed for applications which are silicone sensitive. This material is certified to UL 94V0 flammability ratings.

Features
  • Silicone-free gap pad
  • 2.8 W/mK thermal conductivity for material thicknesses of 10 to 30 mils
  • 3.0 W/mK thermal conductivity for material thicknesses of 40 to 60 mils
  • Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments
  • Differential tack on one side for easy assembly and rework
Applications
  • Automotive applications
  • Applications involving optical components
  • Flat panel displays
  • Hard drives

Tflex SF600D Series

ImageManufacturer Part NumberDescriptionAvailable QuantityPrice
THERM PAD 228.6MMX215.9MM PINKA16367-04THERM PAD 228.6MMX215.9MM PINK60 - Immediate$67.22View Details
THERM PAD 228.6MMX215.9MM PINKA16367-02THERM PAD 228.6MMX215.9MM PINK303 - Immediate$46.29View Details
THERM PAD 228.6MMX215.9MM PINKA16367-06THERM PAD 228.6MMX215.9MM PINK9 - Immediate$97.34View Details
Published: 2012-06-29