Large Can DirectFET® MOSFETs

Infineon Technologies' large can devices provide superior R_DS(ON) performance leading to lower-conduction losses and improved system-efficiency. Similar to small and medium can DirectFET devices, the large can provides dual-side cooling that can maximize thermal transfer and help increase power density. DirectFET also has the optimum die-to-footprint ratio, leading to a reduction in board space. Combined with its ultra-low profile (0.7 mm), it is the ideal solution for space constrained, high-power industrial power designs.

As with the entire DirectFET family, the industrial large can has wire bond-free construction for improving reliability performance. The DirectFET package meets all RoHS requirements such as a completely lead-free bill of materials, and is well-suited for long-lifecycle designs. Alternative high-performance packages feature lead die attach under RoHS exemption 7(a) which is due to expire in 2016.

With the addition of the large can, DirectFET continues to lead the industry as one of the most-reliable and highest-performing MOSFET packages on the market. By offering a significantly smaller-footprint than traditional large plastic surface-mount power packages like D²PAK, and, in addition to the ability to top-side cool, the large can DirectFET family is ideally suited for space constrained long-life industrial power designs.