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Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
EUR
Minimum Quantity Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
54020-44030LF Datasheet 54020-44030LF - Amphenol ICC (FCI) 609-4705-ND CONN SOCKET PLCC 44POS TIN 5.454 - Immediate Available: 5.454 1,91000 € 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
DILB8P-223TLF Datasheet DILB8P-223TLF - Amphenol ICC (FCI) 609-4717-ND CONN IC DIP SOCKET 8POS TIN 11.461 - Immediate Available: 11.461 0,18000 € 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB14P-223TLF Datasheet DILB14P-223TLF - Amphenol ICC (FCI) 609-4712-ND CONN IC DIP SOCKET 14POS TIN 3.878 - Immediate Available: 3.878 0,23000 € 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB16P-223TLF Datasheet DILB16P-223TLF - Amphenol ICC (FCI) 609-4713-ND CONN IC DIP SOCKET 16POS TIN 4.364 - Immediate Available: 4.364 0,27000 € 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB18P-223TLF Datasheet DILB18P-223TLF - Amphenol ICC (FCI) 609-5427-ND CONN IC DIP SOCKET 18POS TINLEAD 11.267 - Immediate Available: 11.267 0,30000 € 1 Minimum: 1 Tube DILB Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
DILB20P-223TLF Datasheet DILB20P-223TLF - Amphenol ICC (FCI) 609-4714-ND CONN IC DIP SOCKET 20POS TIN 14.704 - Immediate Available: 14.704 0,33000 € 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB28P-223TLF Datasheet DILB28P-223TLF - Amphenol ICC (FCI) 609-4715-ND CONN IC DIP SOCKET 28POS TIN 9.097 - Immediate Available: 9.097 0,38000 € 1 Minimum: 1 Tube
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Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB24P-223TLF Datasheet Photo Not Available 609-6034-ND CONN IC DIP SOCKET 24POS TINLEAD 10.415 - Immediate Available: 10.415 0,40000 € 1 Minimum: 1 Tube DILB Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
DILB32P-223TLF Datasheet DILB32P-223TLF - Amphenol ICC (FCI) 609-5428-ND CONN IC DIP SOCKET 32POS TINLEAD 5.658 - Immediate Available: 5.658 0,43000 € 1 Minimum: 1 Tube DILB Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
DILB40P-223TLF Datasheet DILB40P-223TLF - Amphenol ICC (FCI) 609-4716-ND CONN IC DIP SOCKET 40POS TIN 2.758 - Immediate Available: 2.758 0,55000 € 1 Minimum: 1 Tube
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Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
69802-032LF Datasheet 69802-032LF - Amphenol ICC (FCI) 609-3478-ND CONN SOCKET PLCC 32POS TIN 6.083 - Immediate Available: 6.083 1,16000 € 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-132LF Datasheet 69802-132LF - Amphenol ICC (FCI) 609-3479-ND CONN SOCKET PLCC 32POS TIN 2.105 - Immediate Available: 2.105 1,17000 € 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
54020-32030LF Datasheet 54020-32030LF - Amphenol ICC (FCI) 609-4704-ND CONN SOCKET PLCC 32POS TIN 9.347 - Immediate Available: 9.347 1,31000 € 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
69802-044LF Datasheet 69802-044LF - Amphenol ICC (FCI) 609-3480-ND CONN SOCKET PLCC 44POS TIN 3.248 - Immediate Available: 3.248 1,82000 € 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-432LF Datasheet 69802-432LF - Amphenol ICC (FCI) 609-4532-2-ND CONN SOCKET PLCC 32POS TIN 2.340 - Immediate Available: 2.340 0,86979 € 390 Minimum: 390 Tape & Reel (TR)
Alternate Packaging
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-432LF Datasheet 69802-432LF - Amphenol ICC (FCI) 609-4532-1-ND CONN SOCKET PLCC 32POS TIN 2.494 - Immediate Available: 2.494 1,36000 € 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
-
Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-432LF Datasheet 69802-432LF - Amphenol ICC (FCI) 609-4532-6-ND CONN SOCKET PLCC 32POS TIN 2.494 - Immediate Available: 2.494 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
-
Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-444LF Datasheet Photo Not Available 609-5389-2-ND CONN SOCKET PLCC 44POS TINLEAD 1.000 - Immediate Available: 1.000 1,23652 € 250 Minimum: 250 Tape & Reel (TR)
Alternate Packaging
69802 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Surface Mount Open Frame Solder 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled
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69802-444LF Datasheet Photo Not Available 609-5389-1-ND CONN SOCKET PLCC 44POS TINLEAD 1.110 - Immediate Available: 1.110 1,94000 € 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
69802 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Surface Mount Open Frame Solder 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled
-
69802-444LF Datasheet Photo Not Available 609-5389-6-ND CONN SOCKET PLCC 44POS TINLEAD 1.110 - Immediate Available: 1.110 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
69802 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Surface Mount Open Frame Solder 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled
-
69802-144LF Datasheet 69802-144LF - Amphenol ICC (FCI) 609-3481-ND CONN SOCKET PLCC 44POS TIN 608 - Immediate Available: 608 1,82000 € 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
DILB24P-224TLF Datasheet Photo Not Available DILB24P-224TLF-ND CONN IC DIP SOCKET 24POS TINLEAD 0 Available: 0
Standard Lead Time 11 Weeks
0,14566 € 12.000
Non-Stock
Minimum: 12.000
Tube DILB Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
DILB42P-223TLF Datasheet Photo Not Available DILB42P-223TLF-ND CONN IC DIP SOCKET 42POS TINLEAD 0 Available: 0
Standard Lead Time 11 Weeks
0,25646 € 7.920
Non-Stock
Minimum: 7.920
Tube DILB Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
SIP1X06-014BLF Datasheet Photo Not Available SIP1X06-014BLF-ND
CONN SOCKET SIP 6POS TIN 0 Available: 0
Obsolete
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Bulk SIP1x Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
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SIP1X05-014BLF Datasheet Photo Not Available SIP1X05-014BLF-ND
CONN SOCKET SIP 5POS TIN 0 Available: 0
Obsolete
-
Bulk SIP1x Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
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13:12:26 9.21.2019