ESD7C3.3DT5G Series Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
November, 2017 Rev. 4
1Publication Order Number:
ESD7C3.3D/D
ESD7C, SZESD7C SERIES
ESD Protection Diode
MicroPackaged Diodes for ESD Protection
The ESD7CxxD Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
Specification Features:
Low Capacitance 6.2 pF to 13 pF
Low Clamping Voltage
Small Body Outline Dimensions:
0.047 x 0.047 (1.20 mm x 1.20 mm)
Low Body Height: 0.020 (0.5 mm)
Standoff Voltage: 3.3 V, 5 V
Low Leakage
Response Time < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC6100042 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These are PbFree Devices
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 6100042 (ESD) Contact
Air
±8.0
±15
kV
Total Power Dissipation on FR5 Board
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance JunctiontoAmbient
PD
RqJA
240
1.9
525
mW
mW/°C
°C/W
Junction and Storage Temperature Range TJ, Tstg 55 to
+150
°C
Lead Solder Temperature Maximum
(10 Second Duration)
TL260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
Device Package Shipping
ORDERING INFORMATION
ESD7CxxDT5G SOT723
(PbFree)
8000 /
Tape & Reel
MARKING
DIAGRAM
www.onsemi.com
SOT723
CASE 631AA
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
L5 = Specific Device Code
M = Date Code
L5 M
1
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
DEVICE MARKING INFORMATION
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SZESD7CxxDT5G SOT723
(PbFree)
8000 /
Tape & Reel
Max Capacnance @vH Tek Run 2.50am Samwe m Tek Run: 2.5nc5/s Sample m [ T ] I T l W ‘ W \ mum Mzn ans cm; Em Ioovn M20V0ns ch11 www onsem' com
ESD7C, SZESD7C SERIES
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
IFForward Current
VFForward Voltage @ IF
Ppk Peak Power Dissipation
CMax. Capacitance @VR = 0 and f = 1 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters. UniDirectional
IPP
IF
V
I
IR
IT
VRWM
VCVBR
VF
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA)
Device (Note 2)
Device
Marking
VRWM (V) IR (mA) @ VRWM
VBR (V) @ IT
(Note 3) IT
C (pF)
(Note 4)
C (pF)
(Note 4) VC
Max Max Min mA Typ Max
Per IEC6100042
(Note 5)
ESD7C3.3DT5G L5 3.3 1.0 5.0 1.0 12 13 Figures 1 and 2
See Below
(Note 6)
ESD7C5.0DT5G L4 5.0 0.5 11 1.0 6.0 6.2
2. Include SZprefix devices where applicable.
3. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
4. Capacitance of one diode at f = 1 MHz, VR = 0 V, TA = 25°C.
5. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
6. ESD7C5.0DT5G shown below. Other voltages available upon request.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC6100042
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC6100042
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ESD7C, SZESD7C SERIES
www.onsemi.com
3
IEC 6100042 Spec.
Level
Test
Voltage
(kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1 2 7.5 4 2
2 4 15 8 4
3 6 22.5 12 6
4 8 30 16 8
Ipeak
90%
10%
IEC6100042 Waveform
100%
I @ 30 ns
I @ 60 ns
tP = 0.7 ns to 1 ns
Figure 3. IEC6100042 Spec
Figure 4. Diagram of ESD Test Setup
50 W
Cable
Device
Under
Test Oscilloscope
ESD Gun
50 W
The following is taken from Application Note
AND8308/D Interpretation of Datasheet Parameters
for ESD Devices.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC6100042 waveform. Since the
IEC6100042 was written as a pass/fail spec for larger
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
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ESD7C, SZESD7C SERIES
www.onsemi.com
4
PACKAGE DIMENSIONS
SOT723
CASE 631AA
ISSUE D
DIM MIN NOM MAX
MILLIMETERS
A0.45 0.50 0.55
b0.15 0.21 0.27
b1 0.25 0.31 0.37
C0.07 0.12 0.17
D1.15 1.20 1.25
E0.75 0.80 0.85
e0.40 BSC
H1.15 1.20 1.25
L
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
D
b1
E
b
e
A
L
C
H
Y
X
X0.08 Y
2X
E
12
3
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2 0.15 0.20 0.25
0.29 REF
3X
L2
3X
1
2X
TOP VIEW
BOTTOM VIEW
SIDE VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
0.40
1.50
2X
PACKAGE
OUTLINE
0.27
2X
0.52
3X 0.36
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
ESD7C3.3D/D
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