MLA Series Datasheet, Automotive by Littelfuse Inc.

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© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
MLA Automotive Varistor Series
Description
The MLA Automotive Series of transient voltage surge
suppression devices is based on the Littelfuse Multilayer
fabrication technology. These components are designed
to suppress a variety of transient events, including those
specified in IEC 61000-4-2 or other standards used for
Electromagnetic Compliance (EMC). The MLA Automotive
Series is typically applied to protect integrated circuits and
other components at the circuit board level.
The wide operating voltage and energy range make the
MLA Automotive Series suitable for numerous applications
on power supply, control and signal lines.
The MLA Automotive Series is manufactured from
semiconducting ceramics, and is supplied in a leadless,
surface mount package. The MLA Automtove Series
is compatible with modern reflow and wave soldering
procedures.
It can operate over a wider temperature range than Zener
diodes, and has a much smaller footprint than plastic-
housed components.
Features
AEC-Q200 qualified
Halogen-Free and
RoHS compliant
Leadless 0603, 0805,
1206 and 1210 chip sizes
Multilayer ceramic
construction technology
-55°C to +125°C
operating temp. range
Operating voltage range
VM(DC) = 3.5V to 120V
Rated for surge
current (8 x 20µs)
Rated for energy
(10 x 1000µs)
Inherent bi-directional
clamping
No plastic or epoxy
packaging assures
better than UL94V-0
flammability rating
Standard low
capacitance types
available
Load Dump energy
rated per SAE
Specification J1113
Applications
Suppression of
inductive switching
or other transient
events such as EFT
and surge voltage at
the circuit board level
ESD protection for IEC
61000-4-2, MIL-STD-
883c method 3015.7,
and other industry
specifications
Provides on-board
transient voltage
protection for ICS
and transistors
Used to help achieve
electromagnetic
compliance of
end products
Replaces larger surface
mount TVS Zeners in
many applications
Size Table
Metric EIA
1608 0603
2012 0805
3216 1206
3225 1210
Absolute Maximum Ratings
Continuous MLA Auto
Series Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) 3.5 to 120 V
AC Voltage Range (VM(AC)RMS) 2.5 to 107 V
Transient:
Non-Repetitive Surge Current, 8/20µs
Waveform, (ITM)up to 500 A
Non-Repetitive Surge Energy,
10/1000µs Waveform, (WTM)0.1 to 2.5 J
Operating Ambient Temperature Range (TA)-55 to
+125 ºC
Storage Temperature Range (TSTG)-55 to
+150 ºC
Temperature Coefficient (αV) of Clamping
Voltage (VC) at Specified Test Current <0.01 %/º C
RoHS
• For ratings of individual members of a series, see device ratings and specifications table.
Additional Information
Datasheet Samples
Resources
% Litteltuse” ExnevhxeADnlled \ AnswevxDelweved
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Device Ratings and Specifications
Part Number
Maximum Ratings (125º C)Specifications (25ºC)
Maximum
Continuous
Working
Voltage
Jump
Start
Voltage
(5 min)
Load
Dump
Energy
Maximum
Non-repetitive
Surge Current
(8/20µs)
Maximum
Non-repetitive
Surge Energy
(10/1000µs)
Maximum
Clamping
Voltage
at 1A (or
as Noted)
(8/20µs)
Nominal
Voltage at
1mA DC Test
Current
Typical
Capacitance
at f = 1MHz
VM(DC) VM(AC) VJUMP WLD ITM WTM VC
VN(DC)
Min
VN(DC)
Max C
(V) (V) (V) (J) (A) (J) (V) (V) (V) (pF)
V3.5MLA0603NHAUTO 3.5 2.5 -- -- 30 0.100 13.0 3.7 7. 0 860
V3.5MLA0805NHAUTO 3.5 2.5 -- -- 120 0.300 13.0 3.7 7. 0 1500
V3.5MLA0805LNHAUTO 3.5 2.5 -- -- 40 0.100 13.0 3.7 7. 0 1080
V3.5MLA1206NHAUTO 3.5 2.5 -- -- 100 0.300 13.0 3.7 7. 0 3000
V5.5MLA0603NHAUTO 5.5 4.0 -- -- 30 0.100 1 7. 5 7. 1 9.3 830
V5.5MLA0805NHAUTO 5.5 4.0 -- -- 120 0.300 1 7. 5 7. 1 9.3 1200
V5.5MLA0805LNHAUTO 5.5 4.0 -- -- 40 0.100 1 7. 5 7. 1 9.3 400
V5.5MLA1206NHAUTO 5.5 4.0 -- -- 150 0.400 1 7. 5 7. 1 9.3 2900
V9MLA0603NHAUTO 9.0 6.5 -- -- 30 0.100 25.5 11. 0 16.0 210
V9MLA0805LNHAUTO 9.0 6.5 -- -- 40 0.100 25.5 11. 0 16.0 400
V12MLA0805LNHAUTO 12.0 9.0 -- -- 40 0.100 29.0 14.0 18.5 210
V14MLA0603NHAUTO 14.0 10.0 -- -- 30 0.100 34.5 15.9 21.5 90
V14MLA0805NHAUTO 14.0 10.0 -- -- 120 0.300 32.0 15.9 20.3 560
V14MLA0805LNHAUTO 14.0 10.0 -- -- 40 0.100 32.0 15.9 20.3 320
V14MLA1206NHAUTO 14.0 10.0 -- -- 150 0.400 32.0 15.9 20.3 800
V18MLA0603NHAUTO 18.0 14.0 24.5 0.3 30 0.100 50.0 22.0 28.0 120
V18MLA0805NHAUTO 18.0 14.0 24.5 1 120 0.300 44.0 22.0 28.0 245
V18MLA0805LNHAUTO 18.0 14.0 24.5 0.7 40 0.100 44.0 22.0 28.0 180
V18MLA1206NHAUTO 18.0 14.0 24.5 1. 5 150 0.400 44.0 22.0 28.0 1050
V18MLA1210NHAUTO 18.0 14.0 24.5 3 500 2.500 44.0 at 2.5 22.0 28.0 2500
V26MLA0603NHAUTO 26.0 20.0 27.5 0.4 30 0.100 60.0 31.0 38.0 50
V26MLA0805NHAUTO 26.0 20.0 27.5 1 10 0 0.300 60.0 29.5 38.5 110
V26MLA0805LNHAUTO 26.0 20.0 27.5 0.7 40 0.100 60.0 29.5 38.5 90
V26MLA1206NHAUTO 26.0 20.0 27.5 1. 5 150 0.600 60.0 29.5 38.5 600
V26MLA1210NHAUTO 26.0 20.0 27.5 3 300 1.200 60.0 at 2.5 29.5 38.5 1260
V30MLA0603NHAUTO 30.0 25.0 29 0.4 30 0.100 74.0 37.0 46.0 45
V30MLA0805LNHAUTO 30.0 25.0 29 0.7 30 0.100 72.0 37.0 46.0 80
V30MLA0805NHAUTO 30.0 25.0 29 1 80 0.300 72.0 37.0 46.0 100
V30MLA1210NHAUTO 30.0 25.0 29 3 280 1.200 68.0 at 2.5 35.0 43.0 690
V30MLA1210LNHAUTO 30.0 25.0 29 3 220 0.900 68.0 at 2.5 35.0 43.0 500
V33MLA1206NHAUTO 33.0 26.0 36 1. 5 180 0.800 75.0 38.0 49.0 380
V42MLA1206NHAUTO 42.0 30.0 48 1. 5 180 0.800 92.0 46.0 60.0 340
V48MLA1210NHAUTO 48.0 40.0 48 3 250 1.200 105.0 at 2.5 54.5 66.5 400
V48MLA1210LNHAUTO 48.0 40.0 - - 220 0.90 105.0 at 2.5 54.5 66.5 320
V48MLA1206NHAUTO 48.0 40.0 48 1. 5 180 0.90 100 54.5 66.5 180
V56MLA1206NHAUTO 56.0 40.0 48 1. 5 180 1. 0 0 120.0 61.0 77.0 150
V60MLA1210NHAUTO 60.0 50.0 48 3 250 1.50 130.0 at 2.5 67.0 83.0 230
V68MLA1206NHAUTO 68.0 50.0 48 1. 5 180 1. 0 0 140.0 76.0 90.0 130
V85MLA1210NHAUTO 85.0 67.0 48 3 150 2.50 180.0 at 2.5 95.0 115.0 160
V120MLA1210NHAUTO 120.0 107.0 48 3 125 2.00 260.0 at 2.5 135.0 165.0 80
NOTES:
1. 'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requirements
2. Typical leakage at 25ºC<25µA, maximum leakage 100µA at VM(DC)
3. Average power dissipation of transients for 0603, 0805, 1206 and 1210 sizes not to exceed 0.05W, 0.1W, 0.1W and 0.15W respectively
4. Load dump :min. time of energy input 40ms, interval 60sec(the load dump time constant Td differs from the time constant of energy input; load dump rating for ISO 7637-2 pulse 5a and
ISO16750-2 Table 5A. Please contact Littelfuse.
mm Wampum \ Answusmllumd m=._<> Biz “5 pzmuzmn
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Peak Current and Energy Derating Curve
When transients occur in rapid succession, the average
power dissipation is the energy (watt-seconds) per pulse
times the number of pulses per second. The power so
developed must be within the specifications shown
on the Device Ratings and Specifications Table for the
specific device. For applications exceeding 125°C ambient
temperature, the peak surge current and energy ratings
must be derated as shown below.
100
80
60
40
20
0
-55 50 60 70 80 90 100110 120130 140150
PERCENT OF RATED VALUE
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY
DERATING CURVE
T
1
T
2
100
50
0
O1TIME
PERCENT OF PEAK
VALUE
O1 = VIRTUAL ORIGIN OF WAVE
t1 = VIRTUAL FRONT TIME = 1.25 x t
(IMPULSE DURATION)
t = TIME FROM 10% TO 90% OF PEAK
t2 = VIRTUAL TIME TO HALF VALUE
EXAMPLE:
FOR AN 8/20 s CURRENT WAVEFORM
8s = t1 = VIRTUAL FRONT TIME
20 s = t2 = VIRTUAL TIME TO
HALF VALUE
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM
FOR CLAMPING VOLTAGE
T
Peak Pulse Current Test Waveform for Clamping Voltage
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
Example - For an 8/20 µs Current Waveform:
8µs = T1 = Rise Time
20µs = T2 = Decay Time
Figure 1
Figure 2
% Litleltuse“ ExpemxaADnllzd \ Anxwux Damn
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
1
10
100
1000
10µA 100µA 1mA 10mA 100mA1A 10A 100A
FIGURE X. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805LNHAUTO TO V30MLA0805LNHAUTO
Varistor Voltage (V)
Current (A)
V14MLA0805LNHAUTO
V18MLA0805LNHAUTO
V26MLA0805LNHAUTO
V30MLA0805LNHAUTO
V5.5MLA0805LNHAUTO
V
3.5MLA0805LNHAUTO
V9MLA0805LNHAUTO
V12MLA0805LNHAUTO
1
10
100
1000
10
µA
100
µA
1mA 10mA 100mA 1A 10A100A
V30MLA0603NHAUTO
V26MLA0603NHAUTO
V18MLA0603NHAUTO
V14MLA0603NHAUTO
V3.5MLA0603NHAUTO
Varistor Voltage (V)
Current (A)
FIGURE X. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603NHAUTO TO V30MLA0603NHAUTO
V5.5MLA0603NHAUTO,
V5.5MLA0603LNHAUTO
V9MLA0603NHAUTO,
V9MLA0603LNHAUTO
Figure 3 Figure 4
1
10
100
1000
10µA 100µA 1mA 10mA 100mA1A 10A 100A
FIGURE X. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805LNHAUTO TO V30MLA0805LNHAUTO
Varistor Voltage (V)
Current (A)
V14MLA0805LNHAUTO
V18MLA0805LNHAUTO
V26MLA0805LNHAUTO
V30MLA0805LNHAUTO
V5.5MLA0805LNHAUTO
V
3.5MLA0805LNHAUTO
V9MLA0805LNHAUTO
V12MLA0805LNHAUTO
FIGURE X. LIMIT V-I CHARACTERISTIC FOR V18MLA1210NHAUTO TO V120MLA1210NHAUTO
1mA10µA 100µA
CURRENT (A)
10mA 100mA 1A 10A 100A 1000A
V48MLA1210
NHAUTO
, V48MLA1210L
NHAUTO
V30MLA1210
NHAUTO
, V30MLA1210L
NHAUTO
V26MLA1210
NHAUTO
V18MLA1210
NHAUTO
100
10
Varistor Voltage (V)
1000
1
V60MLA1210
NHAUTO
V85MLA1210
NHAUTO
V120MLA1210
NHAUTO
Figure 5
1
10
100
1000
10
µA
100
µA
1mA 10mA 100mA 1A 10A 100A 1000A
Current (A)
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
Varistor Voltage (V)
FIGURE 6. LIMIT V-1 CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
V3.5MLA1206NHAUTO
V5.5MLA1206NHAUTO
V14MLA1206NHAUTO
V18MLA1206NHAUTO
V26MLA1206NHAUTO
V33MLA1206NHAUTO
V42MLA1206NHAUTO
V56MLA1206NHAUTO
V68MLA1206NHAUTO
V48MLA1206NHAUTO
Figure 6
Figure 7
Limit V-I Characteristic for V3.5MLA0603NHAUTO to
V30MLA0603NHAUTO
Limit V-I Characteristic for V3.5MLA0805NHAUTO to
V26MLA0805NHAUTO
Limit V-I Characteristic for V3.5MLA0805LNHAUTO to
V30MLA0805LNHAUTO
Limit V-I Characteristic for V18MLA1210NHAUTO to
V48MLA1210NHAUTO
Limit V-I Characteristic for V3.5MLA1206NHAUTO to
V42MLA1206NHAUTO
% Littelfuse’ Wampum \ Answusmllumd aw +0+
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Device Characteristics
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance modex (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA.
100%
1E-9 1E-8
SUPPRESSOR CURRENT (ADC)
10%
1E-7 1E-6 1E-5 1E-4 1E-3 1E-2
25 50 75 100125oC
SUPPRESSOR VOLTAGE IN PERCENT OF
VNOM VALUE AT 25 oC (%)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
o
oo
o
Clamping Voltage Over Temperature (VC at 10A)
100
10
20
V26MLA1206
40 60 80 100120 140
TEMPERATURE (oC)
V5.5MLA1206
0-20-40-60
Typical Temperature Dependance of the Haracteristic
Curve in the Leakage Region
Speed of Response
The Multilayer Suppressor is a leadless device. Its response
time is not limited by the parasitic lead inductances found
in other surface mount packages. The response time of
the ZNO dielectric material is less than 1ns and the MLA
Automotive Series can clamp very fast dV/dT events such as
ESD. Additionally, in "real world" applications, the associated
circuit wiring is often the greatest factor effecting speed of
response. Therefore, transient suppressor placement within
a circuit can be considered important in certain instances.
GRAINS
DEPLETION
FIRED CERAMIC
DIELECTRIC
REGION
METAL
ELECTRODES
DEPLETION
REGION
METAL END
TERMINATION
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
Multilayer Internal Construction
Energy Absorption/Peak Current Capability
Energy dissipated within the MLA Automotive Series is
calculated by multiplying the clamping voltage, transient
current and transient duration. An important advantage of
the multilayer is its interdigitated electrode construction
within the mass of dielectric material. This results in
excellent current distribution and the peak temperature per
energy absorbed is very low. The matrix of semiconducting
grains combine to absorb and distribute transient energy
(heat) (see Speed of Response). This dramatically reduces
peak temperature; thermal stresses and enhances device
reliability.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206 part was tested with
multiple pulses at its peak current rating (150A, 8/20µs). At
the end of the test,10,000 pulses later, the device voltage
characteristics are still well within specification.
100
10
0
V26MLA1206
2000 4000 6000 8000 10000 12000
NUMBER OF PULSES
VO LTAGE
FIGURE 13. REPETITIVE PULSE CAPABILITY
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
Repetitive Pulse Capability
Figure 8
Figure 9
Figure 10
Figure 11
% Litleltuse“ mum» a \ Anxwuxbelwend vaupsnnuns ‘c m4: MINUTES) Emma“ \ I 9 m: w /*I D K E g a / a . m
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLA Automotive Series
suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37
(Sn/Pb). Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken
to ensure that the MLA Automotive Series chip is not
subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second.
During the soldering process, preheating to within 100
degrees of the solder's peak temperature is essential to
minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination option (see
"N" suffix in Part Numbering System for ordering) for the
optimum Lead–free solder performance, consisting of a
Matte Tin outer surface plated on Nickel underlayer, plated
on Silver base metal.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15.WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
TIME (MINUTES)
300
250
200
150
100
50
0
0.0 0.5 1. 01.5 2.0 2.5 3.0 3.5 4.0 4.5
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT DWELL
RAMP RATE
<2°C/s
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
TIME (MINUTES)
250
200
150
100
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
40-80
SECONDS
ABOVE 183°C
TEMPERATURE °C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7. 0
Reflow Solder Profile
Wave Solder Profile
Lead–free Re-flow Solder Profile
Figure 12
Figure 13
Figure 14
% Littelfuse’
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Product Dimensions (mm)
NOTE : Avoid metal runs in this area, parts not recommended for use in applications using
Silver (Ag) epoxy paste.
PAD LAYOUT DIMENSIONS
C
B
A
NOTE: Avoid metal runs in this area.
Parts not recommended for use in
applications using silver epoxy paste.
NOTE
CHIP LAYOUT DIMENSIONS
E
L
W
D
Dimension 1210 Size 1206 Size 0805 Size 0603 Size
IN MM IN MM IN MM IN MM
A0.160 4.06 0.160 4.06 0.120 3.05 0.100 2.54
B0.100 2.54 0.065 1.65 0.050 1.27 0.030 0.76
C0.040 1.02 0.040 1.02 0.040 1.02 0.035 0.89
D (max.) 0.113 2.87 0.071 1.80 0.043 1. 10 0.040 1. 0 0
E0.020
-/+0.010
0.50
-/+0.25
0.020
-/+0.010
0.50
-/+0.25
0.020 -/+
0.010
0.50 -/+
0.25
0.015
-/+0.008
0.4
-/+0.20
L0.125
-/+0.012
3.20
-/+0.30
0.125
-/+0.012
3.20
-/+0.30
0.079
-/+0.008
2.01
-/+0.20
0.063
-/+0.006
1.6
-/+0.15
W0.100
-/+0.012
2.54
-/+0.30
0.060
-/+0.011
1.60
-/+0.28
0.049
-/+0.008
1.25
-/+0.20
0.032
-/+0.060
0.8
-/+0.15
Part Numbering System
V181206
PACKING
AUTOMOTIVE SERIES
OPTIONS (see Packaging table for quantities)
DEVICE SIZE:
DEVICE FAMILY
Littelfuse TVSS Device
X AUTO
MAXIMUM DC
WORKING VOLTAGE
MLA X X
CAPACITANCE OPTION
No Letter:Standard
L: Low Capacitance Version
END TERMINATION INDICATOR
MULTILAYER SERIES
DESIGNATOR
N: Nickel Barrier
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm)
0805 = .08 inch x .08 inch (2.0 mm x 1.25 mm)
1206 = .126 inch x .063 inch (3.2 mm x 1.6 mm)
1210 = .126 inch x .1 inch (3.2 mm x 2.5 mm)
Packaging*
Device Size
Quantity
7” Inch Reel
("H" Option)
1210 2,000
1206 2,500
0805 2,500
0603 2,500
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
pnonucr
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/29/18
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Automotive Series
Tape and Reel Specifications
Symbol Description Dimensions in Millimeters
0603, 0805, 1206 & 1210 Sizes
A0Width of Cavity Dependent on Chip Size to Minimize Rotation.
B0Length of Cavity Dependent on Chip Size to Minimize Rotation.
K0Depth of Cavity Dependent on Chip Size to Minimize Rotation.
WWidth of Tape 8 -/+0.3
FDistance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05
EDistance Between Drive Hole Centers and Tape Edge 1.75 -/+0.1
P1Distance Between Cavity Centers 4 -/+0.1
P2Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+0.1
P0Axial Drive Distance Between Drive Hole Centers 4 -/+0.1
D0Drive Hole Diameter 1.55 -/+0.05
D1Diameter of Cavity Piercing 1.05 -/+0.05
T1Top Tape Thickness 0.1 Max
NOTES:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
K0
t1
D0P0
D1
P1A0
P2
B0
F
E
W
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
EMBOSSMENT
TOP TAPE 8mm
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

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