BAT46 Series Datasheet by STMicroelectronics

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July 2006 Rev 4 1/11
BAT46 Series
Small signal Schottky diodes
Main product characteristics
Features and benefits
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount device
Description
Diodes in the BAT46 series are high voltage,
small signal Schottky diodes suited for protection
and routing operations.
Order codes
IF150 mA
VRRM 100 V
C (typ) 6 pF
Tj (max) 150° C
Part Number Marking
BAT46ZFILM Z46
BAT46FILM S46
BAT46AFILM A46
BAT46CFILM C46
BAT46SFILM B46
BAT46WFILM D46
BAT46AWFILM DB6
BAT46CWFILM DB8
BAT46SWFILM B46
BAT46JFILM 46
SOD-123
SOD-323
BAT46ZFILM
(Single)
BAT46JFILM
(Single)
BAT46WFILM
(Single)
BAT46CWFILM
(Common cathode)
BAT46AWFILM
(Common anode)
BAT46SWFILM
(Series)
SOT-323
Configurations in top view
SOT-23
BAT46FILM
(Single)
BAT46SFILM
(Series)
BAT46CFILM
(Common cathode)
BAT46AFILM
(Common anode)
www.st.com
Characteristics BAT46 Series
2/11
1 Characteristics
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V
IFContinuous forward current 150 mA
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 1 A
Tstg Storage temperature range -65 to +150 ° C
TjMaximum operating junction temperature (1) 150 ° C
TLMaximum soldering temperature(1) 260 ° C
1. Pulse test: tp = 380 µs, δ < 2 %
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-a) Junction to ambient(1) SOD-123, SOT-23 500 °C/W
SOT-323, SOD-323, 550
1. On epoxy printed circuit board with recommended pad layout
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR(1) Reverse leakage current
Tj = 25° C
VR = 1.5 V 0.5
µA
VR = 10 V 0.8
VR = 50 V 2
VR = 75 V 5
Tj = 60° C
VR = 1.5 V 5
VR = 10 V 7.5
VR = 50 V 15
VR = 75 V 20
VF(2) Forward voltage drop Tj = 25° C
IF = 0.1 mA 0.25
VIF =10 mA 0.45
IF =250 mA 1
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Table 4. Dynamic characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
C Diode capacitance VR = 0 V, F = 1 MHz 10 pF
VR = 1 V, F = 1 MHz 6
arm nun nu: um nae nun um nu
BAT46 Series Characteristics
3/11
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 1)
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18
P(W)
δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1
T
δ=tp/T tp
IF(AV)(A)
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0 25 50 75 100 125 150
I
F(AV)
(A)
T
δ=tp/T tp Tamb(°C)
Figure 3. Reverse leakage current versus
reverse applied voltage (typical
values)
Figure 4. Reverse leakage current versus
junction temperature
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
10 20 30 40 50 60 70 80 90 100
I
R
(µA)
Tj=125 °C
Tj=75 °C
Tj=25 °C
Tj=50 °C
Tj=100 °C
VR(V) 1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125 150
I
R
(
µA
)
VR=75 V
Tj(°C)
Figure 5. Junction capacitance versus
reverse applied voltage (typical
values)
Figure 6. Forward voltage drop versus
forward current (typical values,
low-level)
0
2
4
6
8
10
12
0 102030405060708090100
C(pF)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
VR(V)
0
2
4
6
8
10
12
14
16
18
20
0.0 0.1 0.2 0.3 0.4 0.5 0.6
I
FM
(mA)
Tj=125 °C
Tj=25 °C
VFM(V)
Characteristics BAT46 Series
4/11
Figure 7. Forward voltage drop versus
forward current (typical values,
high-level)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
eCU = 35 µm (SOD-323)
1.E-02
1.E-01
1.E+00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
I
FM
(
A
)
Tj=125 °C
Tj=25 °C
VFM(V)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-323
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
tP(s)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Figure 10. Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, eCU = 35 µm (SOT-323)
Figure 11. Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
eCU = 35 µm (SOD-323)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT-23
Alumine substrate
10 x 8 x 0.5 mm
tP(s)
10
100
1000
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
(°C/W)
Single pulse
SOT-323
t
P
(s)
300
350
400
450
500
550
600
0 5 10 15 20 25 30 35 40 45 50
R
th(j-a)
(
°
C/
W
)
SCU(mm²)
Ll:
BAT46 Series Ordering information scheme
5/11
2 Ordering information scheme
BAT46 xx xx FILM
Signal Schottky diodes
Package
FILM = Tape and reel
No letter = Single diode
A = Common anode
C = Common cathode
S = Series diodes
Blank = SOT-23
J = SOD-323
W = SOT-323
Z = SOD-123
Configuration
Package
0.97 0.97
Package information BAT46 Series
6/11
3 Package information
Epoxy meets UL94, V0
Figure 12. SOD-123 footprint (dimensions in mm)
Table 5. SOD-123 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 1.45 0.057
A1 0 0.1 0 0.004
A2 0.85 1.35 0.033 0.053
b 0.55 Typ. 0.022 Typ.
c 0.15 Typ. 0.039 Typ.
D 2.55 2.85 0.1 0.112
E 1.4 1.7 0.055 0.067
G 0.25 0.01
H 3.55 3.95 0.14 0.156
H
b
D
E
A1
A2
A
G
c
4.45
0.65
2.510.97 0.97
1.06 .—» 1.06 ‘—.
BAT46 Series Package information
7/11
Figure 13. SOD-323 footprint (dimensions in mm)
Table 6. SOD-323 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 1.17 0.046
A1 0 0.1 0 0.004
b 0.25 0.44 0.01 0.017
c 0.1 0.25 0.004 0.01
D 1.52 1.8 0.06 0.071
E 1.11 1.45 0.044 0.057
H 2.3 2.7 0.09 0.106
L 0.1 0.46 0.004 0.02
Q1 0.1 0.41 0.004 0.016
H
b
D
E
A1
A
L
Q1
c
3.20
0.54
1.081.06 1.06
Package information BAT46 Series
8/11
Figure 14. SOT-23 footprint (dimensions in mm)
Table 7. SOT-23 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 0.89 1.4 0.035 0.055
A1 0 0.1 0 0.004
B 0.3 0.51 0.012 0.02
c 0.085 0.18 0.003 0.007
D 2.75 3.04 0.108 0.12
e 0.85 1.05 0.033 0.041
e1 1.7 2.1 0.067 0.083
E 1.2 1.6 0.047 0.063
H 2.1 2.75 0.083 0.108
L 0.6 typ. 0.024 typ.
S 0.35 0.65 0.014 0.026
A1
A
L
H
B
E
D
e
e1
S
c
0.95 0.61
1.26
3.25
0.73
Figure 15 In order to packages second Ie complianc conditions ECOPACK
BAT46 Series Package information
9/11
Figure 15. SOT-323 footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 8. SOT-323 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.8 1.1 0.031 0.043
A1 0.0 0.1 0.0 0.004
b 0.25 0.4 0.010 0.016
c 0.1 0.26 0.004 0.010
D 1.8 2.0 2.2 0.071 0.079 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 0.026
H 1.8 2.1 2.4 0.071 0.083 0.094
L 0.1 0.2 0.3 0.004 0.008 0.012
q 0 30° 0 30°
A1
A
L
H
c
b
E
D
e
θ
0.95
1.0 2.9
0.500.8
Ordering information BAT46 Series
10/11
4 Ordering information
5 Revision history
Part Number Marking Package Weight Base qty Delivery mode
BAT46ZFILM Z46 SOD-123 Single 10 mg 3000 Tape and reel
BAT46FILM S46 SOT-23 Single 10 mg 3000 Tape and reel
BAT46AFILM A46 SOT-23
Common anode 10 mg 3000 Tape and reel
BAT46CFILM C46 SOT-23
Common cathode 10 mg 3000 Tape and reel
BAT46SFILM B46 SOT-23 Series 10 mg 3000 Tape and reel
BAT46WFILM D46 SOT-323 Single 6 mg 3000 Tape and reel
BAT46AWFILM DB6 SOT-323
Common anode 6 mg 3000 Tape and reel
BAT46CWFILM DB8 SOT-323
Common cathode 6 mg 3000 Tape and reel
BAT46SWFILM B46 SOT-323 Series 6 mg 3000 Tape and reel
BAT46JFILM 46 SOD-323 5 mg 3000 Tape and reel
Date Revision Description of Changes
Jun-1999 3 Previous revision.
25-Jul-2006 4 BAT46Z, J, W datasheets merged. ECOPACK statement
added.
BAT46 Series
11/11
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