LQP03TGyyyy02D Series Spec Datasheet by Murata Electronics

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Spec No. JELF24BC-OO16H-O1 Re fe re n c e O n I
Spec No. JELF243C-0016H-01 P.1/12
MURATA MFG.CO., LTD
Reference Only
CHIP COIL (CHIP INDUCTORS) LQP03TG□□□□02D Reference Specification
1.Scope
This reference specification applies to LQP03TG_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ P 03 T G 0N1 B 0 2 D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and D:Taping
Characteristics *B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
Operating Temperature Range. –55°C to +125°C
(Ambient temperature: Rated current can be handled in this temperature range.)
Storage Temperature Range. –55°C to +125°C
Customer
Part Number MURATA
Part Number
Inductance Q
(min)
DC
Resistance
(Ω max)
Self
Resonant
Frequency
(MHz)
Rated
Current
(mA)
(nH) Tolerance Min. *Typ.
LQP03TG0N1B02D 0.1 B:±0.1nH
-
0.07
20000
20000
850
LQP03TG0N2B02D 0.2
B:±0.1nH
C:±0.2nH
0.08
LQP03TG0N2C02D
LQP03TG0N3B02D 0.3
18000
LQP03TG0N3C02D
LQP03TG0N4B02D 0.4
LQP03TG0N4C02D
LQP03TG0N5B02D 0.5
11
LQP03TG0N5C02D
LQP03TG0N6B02D 0.6
LQP03TG0N6C02D
LQP03TG0N7B02D 0.7
12
0.10 750
LQP03TG0N7C02D
LQP03TG0N8B02D 0.8
LQP03TG0N8C02D
LQP03TG0N9B02D 0.9 0.12 700
LQP03TG0N9C02D
LQP03TG1N0B02D 1.0
0.15
17000
600
LQP03TG1N0C02D
LQP03TG1N1B02D 1.1
LQP03TG1N1C02D
LQP03TG1N2B02D 1.2
13
15000
18100
LQP03TG1N2C02D
LQP03TG1N3B02D 1.3 18200
LQP03TG1N3C02D
LQP03TG1N4B02D 1.4 14000 17800
LQP03TG1N4C02D
LQP03TG1N5B02D 1.5 13500 16400
LQP03TG1N5C02D
LQP03TG1N6B02D 1.6 13000 16100
LQP03TG1N6C02D
LQP03TG1N7B02D 1.7
0.20
12500
16400
500
LQP03TG1N7C02D
LQP03TG1N8B02D 1.8 15000
LQP03TG1N8C02D
LQP03TG1N9B02D 1.9 0.25 15900 450
LQP03TG1N9C02D
39% No. JELF24ac-oo1eH-o1 m
Spec No. JELF243C-0016H-01 P.2/12
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance Q
(min)
DC
Resistance
(Ω max)
Self
Resonant
Frequency
(MHz)
Rated
Current
(mA)
(nH) Tolerance Min. *Typ.
LQP03TG2N0B02D 2.0
B:±0.1nH
C:±0.2nH 13
0.25
12500
14800
450
LQP03TG2N0C02D
LQP03TG2N1B02D 2.1
12000
LQP03TG2N1C02D
LQP03TG2N2B02D 2.2 14300
LQP03TG2N2C02D
LQP03TG2N3B02D 2.3 11500 14100
LQP03TG2N3C02D
LQP03TG2N4B02D 2.4 11000 13700
LQP03TG2N4C02D
LQP03TG2N5B02D 2.5
11000
13800
LQP03TG2N5C02D
LQP03TG2N6B02D 2.6 13900
LQP03TG2N6C02D
LQP03TG2N7B02D 2.7 13100
LQP03TG2N7C02D
LQP03TG2N8B02D 2.8
9500
12200
LQP03TG2N8C02D
LQP03TG2N9B02D
2.9
LQP03TG2N9C02D
LQP03TG3N0B02D
3.0 11500
LQP03TG3N0C02D
LQP03TG3N1B02D
3.1
0.32
11800
400
LQP03TG3N1C02D
LQP03TG3N2B02D
3.2 11600
LQP03TG3N2C02D
LQP03TG3N3B02D
3.3 11200
LQP03TG3N3C02D
LQP03TG3N4B02D
3.4
0.35
8000
10300
350
LQP03TG3N4C02D
LQP03TG3N5B02D
3.5 10000
LQP03TG3N5C02D
LQP03TG3N6B02D
3.6 9400
LQP03TG3N6C02D
LQP03TG3N7B02D
3.7
7000 8600
LQP03TG3N7C02D
LQP03TG3N8B02D
3.8
LQP03TG3N8C02D
LQP03TG3N9B02D
3.9
6500
8100
LQP03TG3N9C02D
LQP03TG4N3H02D
4.3
H:±3
J:±5
0.58 8000 300
LQP03TG4N3J02D
LQP03TG4N7H02D
4.7
12
0.72 7800
250
LQP03TG4N7J02D
LQP03TG5N1H02D
5.1
LQP03TG5N1J02D
LQP03TG5N6H02D
5.6 0.88
6000
7500
LQP03TG5N6J02D
LQP03TG6N2H02D 6.2 1.15
7400
200
LQP03TG6N2J02D
LQP03TG6N8H02D 6.8 5400 6300
LQP03TG6N8J02D
LQP03TG7N5H02D 7.5 1.22 4800 5600
LQP03TG7N5J02D
39% No. JELF24ac-oo1eH-o1 m
Spec No. JELF243C-0016H-01 P.3/12
MURATA MFG.CO., LTD
Reference Only
Customer
Part Number MURATA
Part Number
Inductance Q
(min)
DC
Resistance
(Ω max)
Self
Resonant
Frequency
(MHz)
Rated
Current
(mA)
(nH) Tolerance Min. *Typ.
LQP03TG8N2H02D 8.2
H:±3
J:±5
12
1.40
4800 6200
200
LQP03TG8N2J02D
LQP03TG9N1H02D 9.1
11
4500 5200
LQP03TG9N1J02D
LQP03TG10NH02D 10 1.52 190
LQP03TG10NJ02D
LQP03TG11NH02D 11 1.65
4100 4700
180
LQP03TG11NJ02D
LQP03TG12NH02D
12 1.78
3700 4400
LQP03TG12NJ02D
LQP03TG13NH02D
13 1.82 3400 3800
170
LQP03TG13NJ02D
LQP03TG15NH02D 15 1.90 3100 3600
LQP03TG15NJ02D
LQP03TG16NH02D
16 2.03
2900 3300
160
LQP03TG16NJ02D
LQP03TG18NH02D 18 2.28 2800 3200
LQP03TG18NJ02D
LQP03TG20NH02D 20 9 2.57 2600 2900
140
LQP03TG20NJ02D
LQP03TG22NH02D
22 2.85 2500 2900
LQP03TG22NJ02D
LQP03TG24NH02D
24
7
3.17 2000 2400
120
LQP03TG24NJ02D
LQP03TG27NH02D
27 3.65 1700 2200
LQP03TG27NJ02D
LQP03TG33NJ02D 33
J:±5
4.25 1600
2000 110
LQP03TG39NJ02D 39 4.60 1500
LQP03TG47NJ02D 47 5.20 1300 1700
100
LQP03TG56NJ02D 56 5.60 1200 1500
LQP03TG68NJ02D 68
6
6.25 1100 1400
90
LQP03TG82NJ02D 82 7.15 1000 1300
LQP03TGR10J02D 100 8.05 900 1200
80
LQP03TGR12J02D 120 8.75 800 1000
Typical value is actual performance.
Spec No. JELF2430-0016H-01 Re fe I" e n c e 0 n I lUniI @— — a CI: p MURA
Spec No. JELF243C-0016H-01 P.4/12
MURATA MFG.CO., LTD
Reference Only
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature / 15°C to 35°C
Temperature : 20°C ± 2°C
Humidity
: Ordinary Humidity / 25%(RH) to 85 %(RH)
Humidity : 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5.
Appearance and Dimensions
(0.1nH to 0.5nH) (0.6nH to 120nH)
Unit Mass (Typical value)
0.0002g
(in mm)
6.
Marking
Polarity Marking :white
Polarity Marking
Coloring side
0.6±0.03 0.6±0.03
0.3±0.03 0.3±0.03
0.3±0.03 0.3±0.03
0.15±0.05 0.15±0.05
Sgec Nu. JELF24SC-0016H-01 Polarity Measuring Method.See
Spec No. JELF243C-0016H-01 P.5/12
MURATA MFG.CO., LTD
Reference Only
7.Electrical Performance
No. Item Specification Test Method
7.1 Inductance Inductance shall meet item 3. Measuring Equipment:
KEYSIGHT E4991A or equivalent
Measuring Frequency:
(0.1nH27nH) 500MHz
(33nH~120nH) 300MHz
Measuring Condition:
Test signal level / about 0dBm
Electrical length / 10mm
Measuring Fixture: KEYSIGHT 16197A
Position coil under test as shown in below
and contact coil with each terminal by
adding weight. Coloring side should be a
topside, and should be in the direction of
the fixture for position of chip coil.
Polarity Marking
Measuring Method:See P.12
<Electrical Performance:Measuring
Method of Inductance/Q>
7.2 Q Q shall meet item 3.
7.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter
7.4 Self Resonant
Frequency(S.R.F) S.R.F shall meet item 3. Measuring Equipment:
KEYSIGHT 8753C or equivalent
7.5 Rated Current Self temperature rise shall be
limited to 25°C max. The rated current is applied.
Spec No. JELF24BC-OO16H-O1 Re fe re n c e O n I N0. Land
Spec No. JELF243C-0016H-01 P.6/12
MURATA MFG.CO., LTD
Reference Only
8.Mechanical Performance
No. Item Specification Test Method
8.1 Shear Test Chip coil shall not be damaged
after tested as test method. Substrate:Glass-epoxy substrate
(in mm)
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
8.2 Bending Test Chip coil shall not be damaged
after tested as test method. Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
(in mm)
8.3 Vibration Appearance:No damage
Inductance Change: within ±10% Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
Testing Time:
A period of 2h in each of
3 mutually perpendicular directions.
8.4 Solderability The electrode shall be at least 90%
covered with new solder coating. Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
8.5 Resistance to
Soldering Heat Appearance:No damage
Inductance Change: within ±10% Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
45
R340
F
Deflection
45 Product
Pressure jig
Land
0.3
0.3
0.9
F
Substrate
Chip coil
Spec No. JELF24SC-0016H-01 10.2 Specification of Taping (1) Packing quantity (standard quantity) 15,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed b (3) Sprocket hole Sprocket hole shall be located on the left-hand side toward the direc (4) Spliced poinl Base tape and Cover tape has no spliced point. (5) Missing components number MlSSll’lg components number Wlll’lll’l 0.1 “/a ol the number per reel or and are not continuous The Specified quantity per reel is kept. MURATA MFG.CO., LTD
Spec No. JELF243C-0016H-01 P.7/12
MURATA MFG.CO., LTD
Reference Only
9.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
9.1 Heat Resistance Appearance:No damage
Inductance Change: within ±10% Substrate: Glass-epoxy substrate
Temperature:125°C
Time:1000h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
9.2 Cold Resistance Substrate: Glass-epoxy substrate
Temperature:-55°C
Time:1000 h (+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
9.3 Humidity Substrate: Glass-epoxy substrate
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000 h(+48h,-0h)
Then measured after exposure in the
room condition for 24h±2h.
9.4 Temperature
Cycle Substrate: Glass-epoxy substrate
1 cycle:
1 step: -55°C / 30min±3 min
2 step:Ordinary temp. / 10~15 min
3 step: 125°C / 30min±3 min
4 step: Ordinary temp. / 10~15 min
Total of 10 cycles
Then measured after exposure in the
room condition for 24h±2h.
10.Specification of Packaging
10.1 Appearance and Dimensions of paper tape (8mm-wide)
(in mm)
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
Sprocket hole shall be located on the left-hand side toward the direction of feed.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
2.0±0.05
Polarity
Marking
2.0±0.054.0±0.1
φ
1.5 +0.1
-0
0.35
Direction of feed 0.55 max.
1.75±0.1
3.5±0.05
8.0±0.2
(0.67)
Spec No. JELF24BC-OO16H-O1 Re fe re n c e O n I |:|:| S ; 2/fi 7M&
Spec No. JELF243C-0016H-01 P.8/12
MURATA MFG.CO., LTD
Reference Only
10.3 Pull Strength
Cover tape 5N min
10.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) , RoHS Marking (2),
Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS Marking > ROHS – Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ・・・
10.8 Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
F
Cover tape
Base tape
165
°
to 180
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
W
D
Label
H
Spec No. JELF24BC-OO16H-O1 Re fe re n c e O n I A
Spec No. JELF243C-0016H-01 P.9/12
MURATA MFG.CO., LTD
Reference Only
11. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
a 0.2~0.3
b 0.8~0.9
c 0.2~0.3
(in mm)
12.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm~150μm.
12.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
a
b
cChip Coil
Solder resist
Land
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec No. JELF24BC-OO16H-O1 Re fe re n c e O n I
Spec No. JELF243C-0016H-01 P.10/12
MURATA MFG.CO., LTD
Reference Only
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
12.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
1/3TtT
T : thickness of product
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Seam
Slit
AD
BC
b
a
Length:a
<
b
Spec No.JELF24ac-oo1eH-o1 Re fe re n c e O n I
Spec No. JELF243C-0016H-01 P.11/12
MURATA MFG.CO., LTD
Reference Only
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C ~ 40°C
Humidity 15% to 85% relative humidity No rapid change on temperature and humidity.
Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Sgec Nu. JELF24BC-OO16H-O1 ZmD Reference Onl
Spec No. JELF243C-0016H-01 P.12/12
MURATA MFG.CO., LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
V
1 A B V
2
I 1 C D I
2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V
1 V
2
I
1 I 2
(3) Thus,the relation between Zx and Zm is following;
Zm-β where, α= D / A =1
1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip(0nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx) Im(Zx) Lx :Inductance of chip coil
2πf Re(Zx) Qx:Q of chip coil
f :Measuring frequency
Zm= Zx=
Zx= α
Lx= Qx=
<Electrical Performance:Measuring Method of Inductance/Q>
AB
CD
Zm Zx
V
12
12
ProductTest fixtureTest Head
II
V

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FIXED IND 5.6NH 250MA 880 MOHM
FIXED IND 0.3NH 850MA 80 MOHM
FIXED IND 0.9NH 700MA 120 MOHM
FIXED IND 8.2NH 200MA 1.4 OHM
FIXED IND 0.4NH 850MA 80 MOHM
FIXED IND 16NH 160MA 2.03 OHM
FIXED IND 4.3NH 300MA 580 MOHM
FIXED IND 0.2NH 850MA 80 MOHM
FIXED IND 0.7NH 750MA 100 MOHM
FIXED IND 3.3NH 400MA 320 MOHM
FIXED IND 1.2NH 600MA 150 MOHM
FIXED IND 0.3NH 850MA 80 MOHM
FIXED IND 10NH 190MA 1.52 OHM
FIXED IND 11NH 180MA 1.65 OHM
FIXED IND 3.3NH 400MA 320 MOHM
FIXED IND 20NH 140MA 2.57 OHM
FIXED IND 0.5NH 850MA 80 MOHM
FIXED IND 1.4NH 600MA 150 MOHM
FIXED IND 0.5NH 850MA 80 MOHM
FIXED IND 4.3NH 300MA 580 MOHM
FIXED IND 5.1NH 250MA 720 MOHM
FIXED IND 0.8NH 750MA 100 MOHM
FIXED IND 13NH 170MA 1.82 OHM
FIXED IND 24NH 120MA 3.17 OHM
FIXED IND 2.2NH 450MA 250 MOHM
FIXED IND 2.2NH 450MA 250 MOHM