SP1007 Series Datasheet by Littelfuse Inc.

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©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 06/18/19
General Purpose ESD Protection - SP1007 Series
Description
Applications
The SP1007 diodes are fabricated in a proprietary back-to-
back silicon avalanche technology. These diodes provide
a high ESD (electrostatic discharge) protection level for
electronic equipment. The SP1007 TVS can safely absorb
repetitive ESD strikes at the maximum level specified in
IEC 61000-4-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation. The back-to-
back configuration provides symmetrical ESD protection for
data lines when AC signals are present.
Features
• ESD, IEC 61000-4-2,
±8kV contact, ±15kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, 2A (8/20 as
defined in IEC 61000-4-5
2nd edition)
• Low capacitance of 5pF
(TYP @ VR=5V)
• Low leakage current of
0.1μA at 5V
• Space efficient 0201 and
0402 footprin
• AEC-Q101 qualified for
SOD882 package
• Moisture Sensitivity Level
(MSL -1) for SOD882
package
• Halogen free, lead free
and RoHS compliant
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• MP3/PMP
• Portable Navigation
Components
Tablets
• Point of Sale Terminals
Pinout
Functional Block Diagram
12
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
I/O Controller
P1
GND
Keypads
P2
IC P3
P4
SP1007-01WTG
(x4)
12
0201 Flipchip
SP1007 Series 5pF 8kV Bidirectional Discrete TVS
12
SOD882
AEC-Q101 qualified
nu Vail-:- (V7
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 06/18/19
General Purpose ESD Protection - SP1007 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
component at these or any other conditions above those indicated in the operational
sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP
Peak Current
(tp=8/20μs) 2.0 A
TOP
Operating
Temperature -40 to 125 °C
TSTOR
Storage
Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Note:
1. Parameter is guaranteed by design and/or component characterization.
2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Parameter Symbol Test Conditions Min Ty p Max Units
Reverse Standoff Voltage VRWM IR = 1μA - - 6.0 V
Breakdown Voltage VBR IR=1mA - 8.5 9.5 V
Reverse Leakage Current ILEAK VR=5V - 0.1 0.5 μA
Dynamic Resistance2RDYN TLP, tp =100ns, I/O to GND - 0.8 -
Clamp Voltage1VC
IPP=1A, tp=8/20μs, Fwd -10 50 V
IPP=2A, tp=8/20μs, Fwd 12
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±8 - - kV
IEC 61000-4-2 (Air Discharge) ±15 - - kV
Diode Capacitance1CI/O-I/O Reverse Bias=0V f =1MHZ - 5 6 pF
8/20μs Pulse WaveformCapacitance vs. Reverse Bias
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Bias Voltage (V)
Capacitance (pF)
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7. 0
SP1007-01ETG
SP1007-01WTG
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
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©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 06/18/19
General Purpose ESD Protection - SP1007 Series
Insertion Loss (S21) I/O to GND
Frequency (MHz)
Attenuation (dB)
-35
-30
-25
-20
-15
-10
-5
0
-40
-45
10 1001000
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-downRamp-d
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics of SOD-882 Package
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Substrate material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting
flammability rating V-0
Transmission Line Pulsing(TLP) Plot
-2
0
2
4
6
8
10
12
14
16
0510 15 20 25
TLP Current(A)
TLP Voltage(V)
W m m m M m m 11:4 T\.
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 06/18/19
General Purpose ESD Protection - SP1007 Series
Package Dimensions 0201 Flip Chip
Symbol
0201 Flipchip
Millimeters Inches
Min Ty p Max Min Ty p Max
A0.595 0.620 0.645 0.0234 0.0244 0.0254
B0.295 0.320 0.345 0.0116 0.0126 0.0136
C0.245 0.275 0.305 0.0096 0.0108 0.0120
D0.145 0.150 0.155 0.0057 0.0059 0.0061
E0.245 0.250 0.255 0.0096 0.0098 0.0100
F0.245 0.250 0.255 0.0096 0.0098 0.0100
G0.005 0.010 0.015 0.0002 0.0004 0.0006
A
B
DED
F
C
G
0.28
0.30
0.75 0.19
Recommended Solder Pad Footprint
*Sizes in mm
Recommended Soldering Pad Layout
0.325
0.325
0.650
0.975
0.650
Package Dimensions — SOD882
Symbol
Package SOD882
JEDEC MO-236
Millimeters Inches
Min Ty p Max Min Ty p Max
A0.95 1. 0 0 1.05 0.037 0.039 0.041
B0.55 0.60 0.65 0.022 0.024 0.026
C0.50 0.55 0.60 0.020 0.022 0.024
D0.45 0.018
E0.20 0.25 0.30 0.008 0.010 0.012
F0.45 0.50 0.55 0.018 0.020 0.022
Part Numbering System
Part Marking System
SP 1007 01 xTG
Series
Number of
Channels
Package
W: 0201 Flipchip
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
E: SOD882
Ordering Information
Part Number Package Min. Order Qty.
SP1007-01WTG 0201 Flipchip 10000
SP1007-01ETG SOD882 10000
SP1007-01WTG
b
SP1007-01ETG
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©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 06/18/19
General Purpose ESD Protection - SP1007 Series
Embossed Carrier Tape & Reel Specification — SOD882
Symbol Millimeters
A0 0.70+/-0.045
B0 1.10+/-0.045
K0 0.65+/-0.045
F 3.50+/-0.05
P1 2.00+/-0.10
W 8.00 + 0.30 -0.10
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
A0 K0 B0
T
P0
P1
P2
D
D1
E
F
W
Symbol Millimeters
A0 0.41+/-0.03
B0 0.70+/-0.03
D ø 1.50 + 0.10
D1 ø 0.20 +/- 0.05
E 1.75+/-0.10
F 3.50+/-0.05
K0 0.38+/-0.03
P0 2.00+/-0.05
P1 2.00+/-0.05
P2 4.00+/-0.10
W 8.00 + 0.30 -0.10
T 0.23+/-0.02
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete
Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
,Ref.
,Ref.
,Ref.
8mm TAPE AND REEL
,Ref.
,Ref.
,Ref.
8mm TAPE AND REEL

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