BAT20J Datasheet by STMicroelectronics

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1/5
BAT20J
®
April 2004 - Ed: 1
HIGH EFFICIENCY SWITCHING AND
ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE
Low conduction losses
Very low reverse current
Negligible switching losses
Low capacitance diode
Low forward and reverse recovery times
Extremely fast switching
Surface mount device
FEATURES AND BENEFITS
The BAT20J is using 23V schottky barrier diode
encapsulated on a SOD-323 package. This is spe-
cially suited for switching mode in mobile phone
and PDA power management applications or LED
driver circuits (step up converters).
DESCRIPTION
SOD-323
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 23 V
IF(RMS) Repetitive peak forward current 2 A
IF(AV) Average forward current δ= 0.38 1 A
IFSM Surge non repetitive forward current (tp=10ms sinusoidal) 5 A
Tstg Maximum storage temperature range - 65 to +150 °C
Tj Maximum operating junction temperature * 150 °C
TL Maximum temperature for soldering during * 260 °C
ABSOLUTE RATINGS (limiting values)
*:
dPtot
dTj Rth j a
<
1
()
thermal runaway condition for a diode on its own heatsink
IF(AV) 1A
VRRM 23 V
IR25°C(max) @ 15V 12 µA
Tj (max) 150 °C
MAIN PRODUCT CHARACTERISTICS
Part Number Marking
BAT20JFILM 20
Order code
AK
BAT20J
2/4
Symbol Parameter Value Unit
Rth (j-a) Junction to Ambient (*) 600 °C/W
(*) Mounted on epoxy board without copper heat sink.
THERMAL RESISTANCE
Symbol Parameters Tests conditions Min. Typ. Max. Unit
IR* Reverse leakage current
(see note 1)
Tj = 25°C VR=5V
VR=8V
VR=15V
0.65
0.88
3.00
2
3
12
µA
IR* Reverse leakage current Tj = 85°C VR=5V
VR=8V
VR=15V
55
70
120
120
150
250
VF** Forward voltage drop Tj = 25°C IF=10mA
IF= 100 mA
IF=1A
0.28
0.35
0.54
0.31
0.40
0.62
V
* Pulse test tp = 380 µs, δ<2%
** Pulse test tp = 5 ms, δ<2%
Note 1: IRat 23 V and Tj = 25°C is equal to 60 µA typ.
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameters Tests conditions Min. Typ. Max. Unit
CdDiode capacitance VR=5V F=1MHz 20 30 pF
To evaluate the maximum conduction losses, use the following equations :
P = 0.32 x IF(AV) + 0.23 x IF2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
BAT20J
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I(A)
P
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 25 50 75 100 125 150
T (°C)
amb
T
δ
=tp/T tp
Printed circuit board FR4
S =2.25mm
CU
2
Fig. 1: Peak forward current versus ambient
temperature (δ= 0.11).
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 25 50 75 100 125 150
I(A)
F(AV)
T
δ
=tp/T tp
T (°C)
amb
Printed circuit board FR4
S =2.25mm
CU
2
Fig. 2: Average forward current versus ambient
temperature ( δ= 0.5).
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
t(s)
p
Single pulse
S =2.25mm
CU
2
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration .
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125 150
I(T
Rj Rj
) / =25°CI(T )
T (°C)
j
V =5V
R
Fig. 5: Relative variation of reverse leakage
currrent versus junction temperature (typical
values).
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 2 4 6 8 1012141618202224
I (µA)
R
V (V)
R
T =25°C
j
T =85°C
j
T =150°C
j
Fig. 4: Reverse leakage currrent versus reverse
voltage applied (typical values).
1
10
100
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
BAT20J
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1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
I(A)
FM
T =25°C
j
T =85°C
j
T =150°C
j
V(V)
FM
Fig. 7-1: Forward voltage drop versus forward
current (typical values, high level).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
I(A)
FM
T =85°C
(typical values)
j
T =25°C
(maximum values)
j
T =150°C
(typical values)
j
T =25°C
(typical values)
j
V(V)
FM
Fig. 7-2: Forward voltage drop versus forward
current (low level).
0
50
100
150
200
250
300
350
400
450
500
550
600
0 5 10 15 20 25 30 35 40 45 50
R(°C/W)
th(j-a)
S(mm
Cu
²)
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (epoxy
printed circuit board FR4, eCU=35µm, typical
values).
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
0 50 100 150 200 250 300 350 400
R (°C/W)
th(j-a)
P(mW)
S =2.25mm
CU 2
T =25°C
amb
Fig. 9: Thermal resistance junction to ambient
versus power dissipation (epoxy printed circuit
board FR4, eCU=35µm, typical values).
BAT20J
5/5
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implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
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thorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners.
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PACKAGE MECHANICAL DATA
SOD-323
H
b
D
E
A1
A
L
Q1
c
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 1.13 0.045
A1 0 0.1 0 0.004
b 0.25 0.44 0.01 0.017
c 0.1 0.25 0.004 0.01
D 1.52 1.8 0.06 0.071
E 1.11 1.35 0.044 0.053
H 2.3 2.7 0.09 0.106
L 0.1 0.46 0.004 0.02
Q1 0.1 0.41 0.004 0.016
Ordering type Marking Package Weight Base qty Delivery mode
BAT20JFILM 20 SOD-323 0.005g 3000 Tape & reel
Epoxy meets UL94,V0

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