LTST-C170CKT Datasheet by Lite-On Inc.

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Features
* Package in 8mm tape on 7" diameter reels.
* Compatible with automatic placement equipment.
* Compatible with infrared and vapor phase reflow solder process.
* EIA STD package.
* I.C. compatible.
Package Dimensions
Part no. Lens Source Color
LTST-C170CKT Water Clear AlGaAs on GaAs Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (.004") unless otherwise noted.
Part No. : LTST-C170CKT Page : 1 of 9
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Absolute Maximum Ratings At Ta=25
Parameter LTST-C170CKT Unit
Power Dissipation 100 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 200 mA
Continuous Forward Current 40 mA
Derating Linear From 50 0.8 mA/
Reverse Voltage 5 V
Operating Temperature Range -55 to + 85
Storage Temperature Range -55 to + 85
Wave Soldering Condition 260°C For 5 Seconds
Infrared Soldering Condition 260°C For 5 Seconds
Vapor Phase Soldering Condition 215°C For 3 Minutes
Suggest IR Reflow Condition :
Part No. : LTST-C170CKT Page : 2 of 9
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Electrical Optical Characteristics At Ta=25
Parameter Symbol Part No.
LTST- Min. Typ. Max. Unit Test Condition
Luminous Intensity IV C170CKT 2.8 10.0 mcd IF = 10mA
Note 1
Viewing Angle 2θ1/2 C170CKT 130 deg Note 2 (Fig.6)
Peak Emission Wavelength λPeak C170CKT 660 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd C170CKT 638 nm Note 3
Spectral Line Half-Width Δλ C170CKT 20 nm
Forward Voltage VF C170CKT 1.8 2.4 V IF = 20mA
Reverse Current IR C170CKT 100 μA VR = 5V
Capacitance C C170CKT 30 PF
VF = 0
f = 1MHZ
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device
Part No. : LTST-C170CKT Page : 3 of 9
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Bin Code List
Part No. : LTST-C170CKT Page : 4 of 9
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Luminous Intensity Unit : mcd @10mA
Bin Code Min. Max.
H 2.8 4.5
J 4.5 7.1
K 7.1 11.2
L 11.2 18.0
M 18.0 28.0
Tolerance on each Intensity bin is +/-15%
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Typical Electrical / Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)
Part No. : LTST-C170CKT Page : 5 of 9
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature
for less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
Part No. : LTST-C170CKT Page : 6 of 9
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. The maximum number of consecutive missing lamps is two.
4. In accordance with ANSI/EIA 481-1-A-1994 specifications.
Part No. : LTST-C170CKT Page : 7 of 9
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CAUTIONS
1. Application limitation
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household application.) Consult Liteon’s sales in advance
for information on application in which exceptional quality and reliability are required, particularly
when the failure or malfunction of the LEDs may directly jeopardize life or health (such as airplanes,
automobiles, traffic control equipment, life support system and safety devices).
2. Storage
Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. The LEDs
should be used within a year.
After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs
should be soldered within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
4. Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition
Reflow soldering Soldering iron Wave soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
120~150°C
120 sec. Max.
240°C Max.
10 sec. Max.
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
5. Drive Method
LED is a current operated device, and therefore, requires some kind of current limiting incorporated
into the drive circuit. This current limiting typically takes the form of a current limiter resistor placed in
series with the LED.
Consider worst case voltage variations that could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40% of its desired value.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(
B
)
The difference of bri
g
htness between LEDs could be found due to the V
f
-If characteristics of LED.
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Part No. : LTST-C170CKT Page : 9 of 9
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6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-
electrostatic glove is recommended when handling these LED. All devices, equipment and machinery
must be properly grounded.
7. Reliability Test
Classification Test Item Test Condition Referance Standard
Operation Life
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5,RH= 9095%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
High Temperature
Storage
Ta= 105±5
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Endurance
Test
Low Temperature
Storage
Ta= -55±5
*Test Time=1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 (1982)
Temperature
Cycling
105 25 -55 25
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Thermal
Shock
IR-Reflow In-Board, 2 Times
105 ± 5 -55 ± 5
10mins 10mins 10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol= 260 ± 5
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
IR-Reflow
Ramp-up rate(183 to Peak) +3 second max
Temp. maintain at 125(±25) 120 seconds max
Temp. maintain above 183 60-150 seconds
Peak temperature range 235+5/-0
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6/second max
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
Environmental
Test
Solderability
T.sol= 235 ± 5
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Immersion rate 25±2.5 mm/sec
Coverage 95% of the dipped surface
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
8. Others
The appearance and specifications of the product may be modified for improvement without notice.

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