BLM15yyyySZ1D Ref Spec Datasheet by Murata Electronics

View All Related Products | Download PDF Datasheet
Relerence Spec.No.JEN F243Ar91 18F701
Reference Spec.No.JENF243A-9118F-01 P1/10
MURATA MFG.CO.,LTD.
Chip Ferrite Bead BLM15□□□□□SZ1D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15_SZ series based on AEC-Q200 except for
Power train and Safety.
2.Part Numbering
(ex.) BL M 15 AG 102 S Z 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category(for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×) (6)Performance (9)Packaging (D:Taping)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below comment)
Rated
Current
(mA)
DC Resistance
( max.) (*1)
(refer to below
comment) ESD Rank
2 :2kV
Initial
Values
Values
After
Testing
BLM15AG100SZ1D 515 1000 0.05 0.10
2
BLM15AG700SZ1D 40100 500 0.15 0.20
BLM15AG121SZ1D 120±25% 500 0.25 0.35
BLM15AG221SZ1D 220±25% 300 0.35 0.45
BLM15AG601SZ1D 600±25% 300 0.60 0.70
BLM15AG102SZ1D 1000±25% 200 1.0 1.1
BLM15AX100SZ1D 515 1740 0.015 0.025
BLM15AX300SZ1D 30±25% 1100 0.08 0.11
BLM15AX700SZ1D 70±25% 780 0.1 0.15
BLM15AX121SZ1D 120±25% 700 0.13 0.18
BLM15AX221SZ1D 220±25% 600 0.18 0.23
BLM15AX601SZ1D 600±25% 500 0.34 0.39
BLM15AX102SZ1D 1000±25% 350 0.49 0.54
BLM15BA050SZ1D 5±25% 300 0.1 0.15
BLM15BA100SZ1D 10±25% 300 0.2 0.25
BLM15BA220SZ1D 22±25% 300 0.3 0.35
BLM15BA330SZ1D 33±25% 300 0.4 0.45
BLM15BA470SZ1D 47±25% 200 0.6 0.65
BLM15BA750SZ1D 75±25% 200 0.8 0.85
BLM15BB050SZ1D
5±25 500 0.08 0.15
BLM15BB100SZ1D 10±25 300 0.10 0.15
BLM15BB220SZ1D 22±25 300 0.20 0.30
BLM15BB470SZ1D 47±25 300 0.35 0.45
BLM15BB750SZ1D 75±25 300 0.40 0.50
BLM15BB121SZ1D 120±25 300 0.55 0.65
BLM15BB221SZ1D
220±25 200 0.80 0.90
BLM15BC121SZ1D 120±25 350 0.45 0.50
BLM15BC241SZ1D 240±25 250 0.7 0.75
BLM15BD750SZ1D 75±25 300 0.2 0.3
BLM15BD121SZ1D 120±25 300 0.3 0.4
BLM15BD221SZ1D 220±25 300 0.4 0.5
BLM15BD471SZ1D 470±25 200 0.60 0.70
BLM15BD601SZ1D
600±25 200 0.65 0.75
Rated Current (A) Panel anem m EFL; Rmad errant m 125-: 125 on u. Opemung Temperature l c,
Reference
Spec.No.JENF243A-9118F-01 P2/10
MURATA MFG.CO.,LTD.
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(
*
2)
As for the Rated current marked with *2
Rated Current is derated as right figure
Dependind on the operating temperature.
Customer
Part Number MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below
comment)
Rated
Current
(mA)(*2)
DC Resistance
( max.) (*1)
(refer to below
comment)
ESD Rank
2 :2kV
at85 at125 Initial
Values
Values
After
Testing
BLM15BD102SZ1D
1000±25 200 0.90 1.0
2
BLM15BD152SZ1D 1500±25 190 1.0 1.1
BLM15BD182SZ1D
1800±25 200 1.4 1.5
BLM15BX750SZ1D
75±25 600 0.15 0.20
BLM15BX121SZ1D
120±25 600 0.17 0.22
BLM15BX221SZ1D
220±25 450 0.27 0.32
BLM15BX471SZ1D
470±25 350 0.41 0.46
BLM15BX601SZ1D
600±25 350 0.46 0.51
BLM15BX102SZ1D
1000±25 300 0.65 0.75
BLM15BX182SZ1D
1800±25 250 0.90 1.00
BLM15PG100SZ1D 5~15 1000 0.025 0.05
BLM15PD300SZ1D 30±25 2200 1400 0.035 0.05
BLM15PD600SZ1D
60±25 1700 1100 0.06 0.075
BLM15PD800SZ1D
80±25 1500 1000 0.07 0.085
BLM15PD121SZ1D
120±25 1300 900 0.09 0.105
BLM15PX330SZ1D
33±25
3000 1700 0.022 0.037
BLM15PX600SZ1D
60±25
2500 1400 0.032 0.047
BLM15PX800SZ1D
80±25
2300 1300 0.038 0.053
BLM15PX121SZ1D
120±25
2000 1100 0.055 0.070
BLM15PX181SZ1D
180±25
1500 800 0.09 0.105
BLM15PX221SZ1D
220±25
1400 800 0.100 0.115
BLM15PX331SZ1D
330±25
1200 700 0.150 0.165
BLM15PX471SZ1D
470±25
1000 600 0.20 0.22
BLM15PX601SZ1D
600±25
900 500 0.23 0.25
Relerence Sgec.No.JEN F243Ar91 18F701 Table A
Reference Spec.No.JENF243A-9118F-01 P3/10
MURATA MFG.CO.,LTD.
4.Style and Dimensions
Equivalent Circuit
Unit Weight (Typical value)
0.001g
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
5 Destructive
Physical Analysis Per EIA469
No electrical tests No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current. Meet Table A after testing.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance Meet item 3.
Resistance element becomes
dominant at high frequencies.
()
:Electrode
1.0±0.05 0.5±0.05
0.25±0.1
0.5±0.05
(in mm)
Relerence Spec.No.JEN F243Ar91 18F701 Table 8
Reference Spec.No.JENF243A-9118F-01 P4/10
MURATA MFG.CO.,LTD.
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at
room temperature,
then measured
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9
External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance
to Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Condition F:
1500g's(14.7N)/0.5ms/Half sine
Meet Table A after testing.
14 Vibration 5g's(0.049N) for 20 minutes
12cycles each of 3 oritentations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating: 150C +/-10 deg C, 60s to 90s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 ESD Rank: Meet Item 3 (Rating)
BLM15BB/BD series: Meet Table B after testing.
Table B
Other BLM15 sereis: Meet Table A after testing.
18 Solderability
Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
Murata deviation request: 5N
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±40%
DC
Resistance Meet item 3.
Relerence Sgec.Nu.JEN F243A79118F701 Top tape |:|:| number(»«1 0000 w
Reference Spec.No.JENF243A-9118F-01 P5/10
MURATA MFG.CO.,LTD.
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept..
7-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
F
165 to 180 degree Top tape
Bottom tape Base tape
0.8max.
0.65(Typ.)
1.15(Typ.)
(in mm)
2.0±0.05
2.0±0.05 4.0±0.1
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
Relerence Sgec.Nu.JEN F243A79118 , Case
Reference Spec.No.JENF243A-9118F-01 P6/10
MURATA MFG.CO.,LTD.
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It is depend on a quantity of an
order.
8. Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains, ships, etc.)
(4)Power plant control equipment (9) Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
Empty tape
190 min.
Leader
Trailer
2.0±0.5
13.0±0.2
21.0±0.8
180
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
W
D
Label
H
Relerence Sgec.Nu.JEN F243A79118F701 L; r+rrrl4 L g
Reference Spec.No.JENF243A-9118F-01 P7/10
MURATA MFG.CO.,LTD.
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
Standard land dimensions (Reflow soldering)
< For BLM15 series (except BLM15P
,
BLM15AX type) >
(in mm)
< For BLM15P
,
BLM15AX type >
(in mm)
The excessive heat by land pads may cause
deterioration at joint of products with substrate.
9-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solde
r
Use Sn-3.0Ag-0.5Cu solde
r
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Soldering a b c
Reflow 0.4 1.2 0.5
Rated
Current
(A) a b c
Land pad thickness
and dimension d
18µm 35µm 70µm
1.5 Max
0.4 1.2 0.5
0.5 0.5 0.5
2.2 Max 1.2 0.7 0.5
3.0 Max 2.4 1.2 0.5
Chip Ferrite Bead
Solder Resist
Pattern
c
b
a
Chip Ferrite Bead
Solder Resist
Pattern
Relerence Sgec.Nu.JEN F243A79118F701 ,’ ~
Reference Spec.No.JENF243A-9118F-01 P8/10
MURATA MFG.CO.,LTD.
(3) Soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
9-3. Soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3TtT
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Relerence Sgec.No.JENF243A79118F701 NE“? l )0000 ( 1 00001 BTU W “1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used. stress will be diagonal to the PCB. therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole. it may be allected by the board dellection that occurs during the tightening ol the screw. Mount the component in a position as lar away lrom the screw holes as possible. Ell-NEH Screw Hole Recommended 976.Mounting density Add special attention to radiating heat ol products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at ioint ol this product With substrate. 977. Operating Environment Do not use this product underthe following environmental conditions, on deterioration of the Insulation Resistance ol the Ferrite material and/or corrosion of Inner Electrode may result lrom the use. (1) in the corrodiple atmosphere such as acidic gases. alkaline gases, chlorine, sullur gases, organic gases and etc. (the sea breeze, CIZ, HES, NH3, $02, N02.etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 978. Resin coating The impedance value may change and/or it may affect on the product's perlormance due to high cure-stress ol resin to be used for coating / molding products. So please pay your carelul attention when you select resin. In prior to use. please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO.,LTD.
Reference Spec.No.JENF243A-9118F-01 P9/10
MURATA MFG.CO.,LTD.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation
surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as
possible.
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance
of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and
etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
Screw Hole Recommended
Perforation
Slit
A
B
C
D
Relerence Sgec.No.JENF243A79118
Reference Spec.No.JENF243A-9118F-01 P10/10
MURATA MFG.CO.,LTD.
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 . ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.

Products related to this Datasheet

FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 1 KOHM 0402 1LN
FERRITE BEAD 600 OHM 0402 1LN
FERRITE BEAD 1 KOHM 0402 1LN
FERRITE BEAD 470 OHM 0402 1LN
FERRITE BEAD 30 OHM 0402 1LN
FERRITE BEAD 1 KOHM 0402 1LN
FERRITE BEAD 600 OHM 0402 1LN
FERRITE BEAD 600 OHM 0402 1LN
FERRITE BEAD 1 KOHM 0402 1LN
FERRITE BEAD 330OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 30 OHM 0402 1LN
FERRITE BEAD 470 OHM 0402 1LN
FERRITE BEAD 600 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 220OHM 0402 1LN
FERRITE BEAD 33 OHM 0402 1LN
FERRITE BEAD 10 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 470 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 30 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 120 OHM 0402 1LN
FERRITE BEAD 1 KOHM 0402 1LN
FERRITE BEAD 33 OHM 0402 1LN
FERRITE BEAD 600 OHM 0402 1LN