LQM18PNyyyyGHD Series Ref Sheet Datasheet by Murata Electronics

View All Related Products | Download PDF Datasheet
Reference Only Spec No.: JELF243B 0047E701 D Inf! and c y n
Spec No.: JELF243B_0047E-01 P1/8
MURATA MFG CO., LTD
CHIP COILS (CHIP INDUCTORS) LQM18PN□□□□GH REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQM18PN_GH series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ M 18 P N 2R2 M G H D
Product ID Structure Dimension
(L × W)
Application and
characteristic
Category Inductance Tolerance Dimension
(T)
Other Packaging
D: taping
*B: bulk
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range -40°C to +85°C
Storage temperature range -40°C to +85°C
Customer
Part number
Murata
Part number
Inductance DC
resistance
(m)
Self-resonant
frequency
(MHz min.)
Rated current
(A)*3
Nominal
value
(μH)
Toler a n ce
(%)
Based on
inductance
change*1
Based on
temperature
rise*2
Typ. Max. Typ. Max. Typ. Max.
LQM18PN1R0MGHD 1.0 ±20 200 250 100 0.9 0.8 1.15 1.05
LQM18PN2R2MGHD 2.2 ±20 200 250 70 0.35 0.25 1.15 1.05
LQM18PN3R3MGHD 3.3 ±20 200 250 30 0.2 0.15 1.15 1.05
*1 When rated current is applied to the products, inductance change will be within ±30% of initial Inductance value.
*2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C
max.
*3 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
4. Testing Conditions
Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
Suec No; JELF243B 0047501 efe re n ce 0 n I [14:02 FemLe Electrode c2} 5‘. 0 WJ 0 M 2 (m mm) my mm.” ‘W ’v‘wm hort between a 5 mu m
Spec No.: JELF243B_0047E-01 P2/8
MURATA MFG CO., LTD
5. Appearance and Dimensions
Unit mass (typical value): 0.006 g
6. Marking
No marking.
7. Electrical Performance
No. Item Specification Test method
7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight 4294A or the equivalent
(1 mA)
Measuring frequency: 1 MHz
7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter
Measuring circuit:
Measure with the product set to terminal 2 and the switch
pressed (open between a and b). When setting or
removing the product, press the switch to short between a
and b.
7.3 Self-resonant
frequency
Meet chapter 3 ratings. Measuring equipment: Keysight 4294A or the equivalent
8. Mechanical Performance
No. Item Specification Test method
8.1 Shear test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Force application direction:
Applying force: 10 N
Holding time: 5 s±1 s
Spec No; JELF243B 0047E701 efe rence only Pressure pg WV \ Deflechun 45 ‘5
Spec No.: JELF243B_0047E-01 P3/8
MURATA MFG CO., LTD
No. Item Specification Test method
8.2 Bending test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate (100 mm × 40 mm ×
1.0 mm)
Pressurizing speed: 0.5 mm/s
Deflection: 2 mm
Holding time: 30 s
(in mm)
8.3 Vibration Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for approx.
20 min
Total amplitude: total amplitude of 3.0 mm or acceleration
amplitude of 245 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 4 h for
each direction (12 h in total)
8.4 Drop Appearance shall have no significant
mechanical damage.
The product shall be dropped so that it falls freely onto
concrete or a steel board.
Height: 1 m
Number of falls: 10 times
8.5 Solderability 90% or more of the outer electrode shall
be covered with new solder seamlessly.
Flux: immersed in ethanol solution with a rosin content of
25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.6 Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±30%
Flux: immersed in ethanol solution with a rosin content of
25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room temperature for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No. Item Specification Test method
9.1 Heat
resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±20%
Temperature: 85°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.2 Cold
resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±20%
Temperature: -40°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.3 Humidity Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±20%
Temperature: 40°C±2°C
Humidity: 90% (RH) to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.4 Temperature
cycle
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±50%
Single cycle conditions:
Step 1: -40°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +85°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 100 cycles
Post-treatment: left at a room temperature for 24 h±2 h
Spec No; JELF243B 0047501 eference Only 2mm 40:01 01.5 f5" wsmw z a ’“ 3 A 4.01.0.l ( DueumnalFesd_ To / Base Trailev ‘ 10:05 160 mm. . Lieder _O f , Labe' a 190mm. 77 210mm. *5 . -_ Plodudsmrage part Emmy 1gp» TopTape g :I ‘ 1:110:02 1 ‘ __ _ ‘ 021,010‘8 Ducmonochcd 13u.4 , 7 c1180}? , +1 . (m mm) 970
Spec No.: JELF243B_0047E-01 P4/8
MURATA MFG CO., LTD
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A 1.1±0.1
B 1.9±0.1
t 1.25 max.
(in mm)
10.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel
Packing method The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom
tape.
Feed hole position The feed holes on the base tape are on the right side when the top tape is pulled toward the user.
Joint The base tape and the top tape are seamless.
Number of missing
products
Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of top tape 5 N min.
Break down force of bottom tape 5 N min.
10.4 Peeling off force of top tape
Speed of peeling off 300 mm/min
Peeling off force 0.1 N to 0.6 N (The lower limit is for typical value.)
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the top tape. (See the diagram below.)
F
165 to 180 degree Top tape
Bottom tape Base tape
Reference Only Spec No; JELF243B 0047E701
Spec No.: JELF243B_0047E-01 P5/8
MURATA MFG CO., LTD
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
□□ ○○○○ 
(1) (2) (3)
(1) Factory code
(2) Date
First digit: year/last digit of year
Second digit: month/Jan. to Sep.1 to 9, Oct. to Dec.O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
ROHS- Y ()
(1) (2)
(1) RoHS regulation conformity
(2) Murata classification number
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
(mm) Standard reel quantity
in outer box (reel)
W D H
186 186 93 5
* Above outer box size is typical. It depends on a
quantity of an order.
11. Caution
Restricted
applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster/crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting
method, for example, using a conductive adhesive, please consult us beforehand.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
(in mm)
Applied
current (A) a b c
Pattern thickness and
dimension d
18 μm 35 μm 70 μm
0 to 0.7 0.7 2.0 0.7 0.7 0.7 0.7
0.7 to 1.5 0.7 2.0 0.7 1.2 0.7 0.7
W
D
Label
H
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
Chip coil
Reference Only Spec No; JELF243B 0047E701
Spec No.: JELF243B_0047E-01 P6/8
MURATA MFG CO., LTD
12.2 Flux and solder used
Flux • Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder • Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Standard profile Limit profile
Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s
Heating Above 220°C/30 s to 60 s Above 230°C/60 s max.
Peak temperature 245°C±3°C 260°C/10 s
Number of reflow cycles 2 times 2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item Requirement
Pre-heating 150°C/approx. 1 min
Tip temperature of soldering iron 350°C max.
Power consumption of soldering iron 80 W max.
Tip diameter of soldering iron ø3 mm max.
Soldering time 3 s (+1 s, -0 s)
Number of reworking operations 2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec N0.: JELFZASB 0047501 efe re n ce 0 n I Upper um" ammmmame ums‘s v (T (th lhlckness) /"\//\/' Pefloranon E 0000( 70000: @133] Slit /\_//‘\J/\\fi ©IJZU~DZIJ Recommended Screw Hole
Spec No.: JELF243B_0047E-01 P7/8
MURATA MFG CO., LTD
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D
*1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
Poor example
Good example
b
a
Suec No; JELF243B 0047501 Refe re n ce 0 n '5
Spec No.: JELF243B_0047E-01 P8/8
MURATA MFG CO., LTD
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item Requirement
Power 20 W/L max.
Time 5 min max.
Frequency 28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be
used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make
the reliability evaluation with the product mounted in your application set.
12.11 Handling of product
Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools
when handling the product (instead, use tweezers with resin or ceramic tips).
12.12 Magnetic saturation
A current exceeding the rated current could cause the inductance value to drop due to magnetic saturation.
13. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.

Products related to this Datasheet

FIXED IND 2.2UH 1.05A 250 MOHM
FIXED IND 1UH 1.05A 250 MOHM
FIXED IND 1UH 1.05A 250 MOHM
FIXED IND 3.3UH 1.05A 250 MOHM
FIXED IND 2.2UH 1.05A 250 MOHM
FIXED IND 2.2UH 1.05A 250 MOHM
FIXED IND 3.3UH 1.05A 250 MOHM
FIXED IND 1UH 1.05A 250 MOHM
FIXED IND 3.3UH 1.05A 250 MOHM