CRCW01005 e3 Series Datasheet by Vishay Dale

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CRCW01005 e3
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Revision: 06-Nov-13 1Document Number: 20056
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Standard Thick Film Chip Resistors
FEATURES
Very small standard size (0.4 mm x 0.2 mm)
•Low tolerance (1 %)
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 125 °C is not exceeded.
STANDARD ELECTRICAL SPECIFICATIONS
TYPE
CASE
SIZE
IMPERIAL
CASE
SIZE
METRIC
POWER RATING
P70
W
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
SERIES
CRCW01005 01005 RR0402M
0.031 15
± 250
± 1
10.0 to 1M
E24; E96
± 2, ± 5 E24
-200/+600
± 1 1.0 to 9.76 E24; E96
± 2, ± 5 1.0 to 9.1 E24
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 0.5 A
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRCW01005
Rated Dissipation P70 (1) W 0.031
Operating Voltage Umax. ACRMS/DC V 15
Insulation Voltage Uins (1 min) V 30
Insulation Resistance > 109
Operating Temperature Range °C -55 to +125
Mass mg 0.07
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CRCW01005 e3
www.vishay.com Vishay
Revision: 06-Nov-13 2Document Number: 20056
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS in millimeters
Note
No marking for 01005 size.
DERATING
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW01001K00FREL
TYPE VALUE TOLERANCE TCR PACKAGING
CRCW0100 R = Decimal
K = Thousand
M = Million
0000 = Jumper
F = ± 1.0 %
G = ± 2.0 %
J = ± 5.0 %
Z = Jumper
R = ± 250 ppm/K
Y = -200 ppm/K/+600 ppm/K
0 = Jumper
EL
PRODUCT DESCRIPTION: CRCW01005 250 1K0 1 % ET3 e3
CRCW01005 250 1K0 1 % ET3 e3
TYPE TCR RESISTANCE
VALUE
TOLERANCE
VALUE PACKAGING LEAD (Pb)-FREE
CRCW01005 ± 250 ppm/K
-200/+600 ppm/K
1R0 = 1
10R = 10
1K0 = 1 k
10K = 10 k
1M0 = 1 M
0R0 = Jumper
± 1 %
± 2 %
± 5 %
ET3 e3 = Pure tin
termination finish
PACKAGING
TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
CRCW01005 EL = ET3 20 000 Paper tape acc. to IEC 60286-3, Type 1a 8 mm 2 mm 180 mm/7"
SIZE DIMENSIONS RECOMMENDED SOLDER PAD
DIMENSIONS
IMPERIAL METRIC L W H T1 T2 a b l
01005 RR0402M 0.4 ± 0.02 0.2 ± 0.02 0.13 ± 0.02 0.10 ± 0.03 0.10 ± 0.03 0.15 0.2 0.2
- 50 0 50 100 150
70 125
0
Ambient Temperature amb in °C
Fraction of Rated Dissipation P70 in %
50
100
ϑ
C R C W 0 1 0 0 1 K 0 0 F R E L
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CRCW01005 e3
www.vishay.com Vishay
Revision: 06-Nov-13 3Document Number: 20056
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
Stability for product types:
1 to 1 M
CRCW01005 e3
4.5 - Resistance - ± 1 %; ± 2 %; ± 5 %
4.13 - Short time overload U = 2.5 x 2 x Umax.;
duration according to style ± (2 % R + 0.1 )
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(235 ± 3) °C
(2 ± 0.5) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/-55/20) °C and
(20/125/20) °C
- 200 ppm/K/+600 ppm/K,
± 250 ppm/K
4.33 21 (Uu1) Substrate bending Depth 3 mm; 1 time
No visible damage,
no open circuit in bent position
± (1 % R + 0.05 )
4.19 14 (Na) Rapid change
of temperature
15 min. at -55 °C;
15 min. at 125 °C;
300 cycles
± (2 % R + 0.1 )
4.25.1 - Endurance at 70 °C
U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (5 % R + 0.1 )
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) °C; (10 ± 1) s ± (2 % R + 0.1 )
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (90 to 95) % RH;
1000 h ± (5 % R + 0.1 )
4.25.3 - Endurance at upper
category temperature 125 °C, 1000 h ± (2 % R + 0.1 )
4.29 45 (XA) Component
solvent resistance
Isopropyl alcohol;
(20 to 25) °C; (5 ± 0.5) min No visible damage
P70 x R
P70 x R
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Revision: 01-Jan-2019 1Document Number: 91000
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