TSSP57038 Datasheet by Vishay Semiconductor Opto Division

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TSSP57038
www.vishay.com Vishay Semiconductors
Rev. 2.2, 30-Mar-2021 1Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IR Receiver Modules for Remote Control Systems
LINKS TO ADDITIONAL RESOURCES
DESCRIPTION
The TSSP57038 is a compact infrared detector module
for presence sensing applications. It receives 38 kHz
modulated signals and has a peak sensitivity of 940 nm.
This component has not been qualified according to
automotive specifications.
FEATURES
Up to 2 m for presence sensing
Uses modulated bursts at 38 kHz
PIN diode and sensor IC in one package
Low supply current
Shielding against EMI
Visible light is suppressed by IR filter
Insensitive to supply voltage ripple and noise
Supply voltage: 2.5 V to 5.5 V
Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
ORDERING CODE
Taping:
TSSP57038TT1 - top view taped, 1800 pcs/reel
APPLICATIONS
Reflective sensors for hand dryers, towel or soap
dispensers, water faucets, toilet flush
Vending machine fall detection
Security and pet gates
Person or object vicinity activation
BLOCK DIAGRAM
PRESENCE SENSING
22531-1
Product Page
3
3
3
D
D
D
3
D
3D Models
Calculators
Marking
33 kΩ
VS
OUT
Demo-
GND
pass
AMPInput
PIN
Band dulator
4, 5
1
2, 3,
6, 7, 8
20445-7
+3 V
IR emitter
+3 V
38 kHz
Envelope
signal
Out to
μC
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TSSP57038
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Rev. 2.2, 30-Mar-2021 2Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
PARTS TABLE
Carrier
frequency 38 kHz TSSP57038
Package Belobog
Pinning 1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm) 3.95 W x 3.95 H x 0.8 D
Mounting SMD
Application Presence sensors
Special options Extended temperature range: www.vishay.com/doc?82738
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage VS-0.3 to +6 V
Supply current IS5mA
Output voltage VO-0.3 to (VS + 0.3) V
Output current IO5mA
Junction temperature Tj100 °C
Storage temperature range Tstg -25 to +85 °C
Operating temperature range Tamb -25 to +85 °C
Power consumption Tamb 85 °C Ptot 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply current (pin 3) Ev = 0, VS = 5 V ISD 0.55 0.7 0.9 mA
Ev = 40 klx, sunlight ISH -0.8-mA
Supply voltage VS2.5 - 5.5 V
Transmission distance
Ev = 0, test signal see Fig. 1,
IR diode TSAL6200,
IF = 50 mA
d-8-m
Output voltage low (pin 1) IOSL = 0.5 mA, Ee = 2 mW/m2,
test signal see Fig. 1 VOSL - - 100 mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min. -0.71.2mW/m
2
Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1 Ee max. 50 - - W/m2
Directivity Angle of
half transmission distance ϕ1/2 75- deg
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TSSP57038
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Rev. 2.2, 30-Mar-2021 3Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Output Active Low
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 3 - Output Function
Fig. 4 - Output Pulse Diagram
Fig. 5 - Frequency Dependence of Responsivity
Fig. 6 - Sensitivity vs. Ambient Temperature
16110
E
e
T
t
pi
*
t
* t
pi
10/f
0
is recommended for optimal function
V
O
V
OH
V
OL
t
Optical Test Signal
(IR diode TSAL6200, I
F
= 0.4 A, 30 pulses, f = f
0
, t = 10 ms)
Output Signal
t
d
1)
t
po 2)
1)
7/f
0
< t
d
< 15/f
0
2)
t
pi
- 5/f
0
< t
po
< t
pi
+ 6/f
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1 10 100 1000 10 000 100 000
tpo - Output Pulse Width (ms)
Ee - Irradiance (mW/m2)
Output pulse width
Input burst length
λ = 950 nm,
optical test signal, Fig. 1
E
e
t
V
O
V
OH
V
OL
t
600 µs 600 µs
t = 60 ms
t
on
t
off
94 8134
Optical Test Signal
Output Signal, (see Fig. 4)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1 1 10 100 1000 10 000
ton, toff - Output Pulse Width (ms)
Ee - Irradiance (mW/m2)
ton
toff
λ = 950 nm,
optical test signal, Fig. 3
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.7 0.9 1.1 1.3
f/f
0
- Relative Frequency
16925
f = f
0
± 5 %
Δf(3 dB) = f
0
/10
E
e min.
/E
e
- Relative Responsivity
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-30 -10 10 30 50 70 90
Ee min. - Threshold Irradiance (mW/m2)
Tamb - Ambient Temperature (°C)
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TSSP57038
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Rev. 2.2, 30-Mar-2021 4Document Number: 82482
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Fig. 7 - Sensitivity vs. Supply Voltage
Fig. 8 - Relative Spectral Sensitivity vs. Wavelength
Fig. 9 - Horizontal Directivity
The typical application of this device is a reflective or beam
break sensor with active low “detect” or “no detect”
information contained in its output. Applications requiring
up to 2 m beam break or 1 m reflective range benefit from
the lower gain of these sensors because they are less
sensitive to stray signal from the emitter, simplifying the
mechanical design.
Example for a sensor hardware:
There should be no common window in front of the emitter
and detector in order to avoid crosstalk via guided light
through the window.
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2 3 4 5
Ee min. - Sensitivity (mW/m2)
VS - Supply Voltage (V)
Axis Title
2nd line
2nd line
2nd line
Vertical
drel. - Relative Transmission Distance
1.0
0.9
0.7
0.8
30°
50°
40°
80°
0.6 0.4 0.200.40.2 0.6
20°10°
60°
70°
21947
Emitter
TSAL6200
IR Receiver
TSSP6P38
Separation to avoid
crosstalk by stray light inside
the housing
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TSSP57038
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Rev. 2.2, 30-Mar-2021 5Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
Finish soldering within 3 s
Handle products only after the temperature has cooled off
Notes
(1) Optically effective area
(2) Pins connected internally. It is not necessary to connect externally
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specifications
Proposed pad layout from
component side
(dim. for reference only)
(3.95)
(3.95)
(0.35)
(0.8)
(2.75)
(3)
(4 x)
(4x)
0.55
(0.95)
0.55
(1.8)
0.75± 0.05
4 x 0.75 = 3
0.35± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
0.475
(0.4)
0.8
0.15
Pinning from topview
GND
GND
Out
Vs
(Vs)
(GND)
(GND) (GND)
1 2 3 4 5
8 7 6
Pin 1 identification
(2)
(2) (2) (2)
3.95
3.95
(2.75)
(1.9)
(3.4)
marking area
Pin 1 Identification
(1)
(1)
(1)
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TSSP57038
www.vishay.com Vishay Semiconductors
Rev. 2.2, 30-Mar-2021 6Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
TAPING VERSION TSSP57038 DIMENSIONS in millimeters
max. 120 s max. 100 s
max. 20 s
Max. ramp up 3 °C/s
max. 260 °C
10
100
1000
10000
0
50
100
250
300
0 300
Axis Title
2nd line
Temperature (°C)
Time (s)
25020015010050
200
150
245 °C
217 °C
240 °C
255 °C
Max. ramp down 6 °C/s
Max. 2 cycles allowed
19800
Tape and reel dimensions:
Parts mounted
Empty trailer 200 mm min.
Empty leader 400 mm min.
Direction of pulling out
Unreel direction
Ø 60 min.
Ø Y
2 ± 0.5
Label posted here
coming out from reel
Tape position
(12.4)
18.4 max.
Ø 13 ± 0.2
Ø 21 ± 0.8
100 mm min. with cover tape
X 2:1
(2)
(1.75)
(5.5)
12 ± 0.3
(8) (4)
(Ø 1.5)
(0.3)
(1.2)
Technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.1Drawing-No.: 9.700-5347.01-4
Issue: 2; 07.03.18
Reel size “Y”
TT1 Ø 180 ± 2 = 1800 pcs.
Leader and trailer tape:
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TSSP57038
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Rev. 2.2, 30-Mar-2021 7Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OUTER PACKAGING
The sealed reel is packed into a pizza box.
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final
packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to
warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
CARTON BOX DIMENSIONS in millimeters
THICKNESS WIDTH LENGTH
Pizza box (Panhead, Heimdall, and Belobog)
(taping in reels) 50 340 340
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17
Thickness
Width
22127
Length
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TSSP57038
www.vishay.com Vishay Semiconductors
Rev. 2.2, 30-Mar-2021 8Document Number: 82482
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Storage temperature 10 °C to 30 °C
Storage humidity 60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 3 label is included
on all dry bags.
EIA JEDEC standard J-STD-020 level 3 label
is included on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
BAR CODE PRODUCT LABEL (example)
Aluminum bag
Label
Reel
15973
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
a) Mounted within:___________________hours of factory conditions
≤30°C/60% RH, or
b) Stored per J-STD-033
If blank, see adjacent bar code label
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
This bag contains
MOISTURE-SENSITIVE DEVICES
Caution
If blank, see adjacent
bar code label
3
LEVEL
260
168
22650
22178
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
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