ArcShield High Volt X7R Datasheet by KEMET

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E‘ectromc Components KEII/IEI' CHARGED?
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 1
One world. One KEMET
Overview
The KEMET ArcShield high voltage surface mount capacitors in
X7R dielectric are designed for use in high voltage applications
susceptible to surface arcing (arc-over discharge).
The phenomenon of surface arcing is caused by a high voltage
gradient between the two termination surfaces or between one
of the termination surfaces and the counter internal electrode
structure within the ceramic body. It occurs most frequently at
application voltages that meet or exceed 300 V, in high humidity
environments, and in chip sizes with minimal bandwidth
separation (creepage distance). This phenomenon can either
damage surrounding components or lead to a breakdown of
the dielectric material, ultimately resulting in a short circuit
condition (catastrophic failure mode).
Patented ArcShield technology features KEMET's highly reliable
base metal dielectric system, combined with a unique internal
shield electrode structure that is designed to suppress an arc-
over event while increasing available capacitance. Developed
on the principle of a partial Faraday cage, this internal system
offers unrivaled performance and reliability when compared to
external surface coating technologies.
fl
fl
over standard termination systems. This technology was
fl
mode of MLCCs and typically the result of excessive tensile and
fl
Flexible termination technology inhibits the transfer of board
fl
cracks which can result in low IR or short circuit failures.
The KEMET ArcShield high voltage surface mount MLCCs are
available in automotive grade, which undergo stricter testing
protocol and inspection criteria. Whether underhood or in-cabin,
these devices are designed for mission and safety-critical
automotive circuits or applications requiring proven, reliable
performance in harsh environments. Automotive grade devices
meet the demanding Automotive Electronics Council's AEC-Q200
fi
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield™ Technology, High Voltage, X7R Dielectric,
500 – 1,000 VDC (Commercial & Automotive Grade)
Ordering Information
C0603 W392 K C R A C TU
Ceramic Case Size
(L" x W")
fi
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric
Failure
Rate/
Design
Termination Finish1
Packaging/
Grade
(C-Spec)2
0603
0805
1206
1210
1808
1812
1825
2220
2225
V = ArcShield
W = ArcShield
fl
termination
fi
digits and
number of
zeros.
J = ±5%
K = ±10%
M = ±20%
C = 500
B = 630
D = 1,000
R = X7R A = N/A C = 100% Matte Sn
L = SnPb (5% PB minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
1 Additional termination finish options may be available. Contact KEMET for details.
1, 2 SnPb termination finish option is not available on automotive grade product.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
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Elecrmmc Compancnls KEIl/IEI' EHARGED! 7411 (HA 0603 and smaller case sizes) 7210 (EIA 0505 and larger case sizes) 7040 EIA 0603 and smaller case sizes) 7215 EIA 0805 and larger case sizes) AUT07411 EEIA 0603 and smaller case sizes) AUT07210 EIA 0805 and larger case sizes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
Not Required (Blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7" Reel/Marked
TM
13" Reel/Marked
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
7081
13" Reel/Unmarked/2 mm pitch
2
7082
Automotive Grade3
7" Reel
AUTO
13" Reel/Unmarked
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
2
3190
13" Reel/Unmarked/2 mm pitch
2
3191
1 Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3 Reeling tape options (paper or plastic) are dependent on capacitor case size (L x W) and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking."
Benefits
Patented technology
Permanent internal arc protection
Protective surface coating not required
Base metal electrode (BME) dielectric system
Industry leading CV values
 
Exceptional performance at high frequencies
Lead (Pb)-free, RoHS and REACH compliant
EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825,
2220, and 2225 case sizes
DC voltage ratings of 500 V, 630 V and 1 KV
Capacitance offerings ranging from 1,000 pF to 560 nF
Available capacitance tolerances of ±5%, ±10% and ±20%
Low ESR and ESL
• Non-polar device, minimizing installation concerns
Commercial and Automotive (AEC-Q200) grades available
 fi
excellent solderability
 fi
request (5% Pb minimum)
Flexible termination option available upon request
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
fi
fi
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
fi
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notifi cation (PCN)
fi
 fi
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
 fi
fi
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
fi
Product family PPAP only
ammmc compmm KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Applications
fi
fi
fl
equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive
(electric and hybrid vehicles, charging stations and lighting) applications.
Application Notes
fi
Qualification/Certification
fi
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
fi
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
fi
ammm Compancnls KEIVIEI' Emma): 1.50 (0.053) 0.30 (0.032) 0.35 (0.014) :0.15 (0.005) :0.15 (0.005) :0.15 (0.005) 2.00 (0.079) 1.25 (0.049 0.50 0.02) :0.20 (0.003) :0.20 (0,003) :0.25 0,010) 3.20 (0,125) 1.50 (0.053) 0.50 0.02) :0.20 (0.003) :0.20 (0,003) :0.25 0,010) 3.20 (0,125) 2.50 (0.093) 0.50 (0.02) :0.20 (0.003) :0.20 (0,003) :0.25 0,010) 4.70 (0.135) 2.00 (0,079 0 50 (0,024) :050 (0.020) :0.20 (0,003) :0 35 (0,014) 4.50 (0.177) 3.20 (0.125) 0.50 (0,024) :0.30 (0.012) :0.30 (0.012) :0.35 (0,014) 4 50 (0.177 5.40 (0.252) 0 50 (0,024) :0 30 (0.012) :040 (0.015) :0 35 (0,014) 5 70 (0.224 5 00 (0.197) 0 50 (0,024) :0 40 (0,015) :0 40 (0.015) :0 35 (0,014) 5 50 (0.220 5 40 (0.243) 0 50 (0 024) :040 (0,015)) 1.50 (0.054) 0.30 (0.032) 0.45 (0.013) :0.17 (0,007) :0.15 (0.005) :0.15 (0.005) 200(0079) 1.25 (0.049) 0.50 0.02) :0.30(0.012) :0.30 (0.012) :0.25 0,010) 3.30 (0,130) 1.50 (0.053) 0.50 (0,024) :040 (0,015) :0.35 (0.013) :0.25 (0,010) 3.30 (0,130) 2.50 (0.102) 0.50 (0,024) :040 (0,015) :0.30 (0.012) :0.25 (0,010) 4.70 (0.135) 2.00 (0,079) 0.70 (0.023) :050 (0.020) :0.20 (0,003) :0.35 (0,014) 4.50 (0,173) 3.20 (0.125) 0 70 (0.023) :040 (0,015) :0.30 (0.012) :0 35 (0,014) 4.50 (0.131) 5.40 (0.252) 0.70 (0.023) :040 (0,015) :040 (0.015) :0.35 (0,014) 5.90 (0.232) 5.00 (0.197) 0.70 (0.023) :0.75 (0,030) :040 (0.015) :0.35 (0,014) ( 232) 540 (0.243) 070 (0 023)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width T Thickness B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0603 1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.35 (0.014)
±0.15 (0.006)
0.70 (0.028)
Solder Wave or
fl
0805 2012
2.00 (0.079)
±0.20 (0.008)
1.25 (0.049)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
0.75 (0.030)
1206 3216
3.20 (0.126)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
N/A
1210 3225
3.20 (0.126)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
fl
Only
1808 4520
4.70 (0.185)
±0.50 (0.020)
2.00 (0.079)
±0.20 (0.008)
0.60 (0.024)
±0.35 (0.014)
1812 4532
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
0.60 (0.024)
±0.35 (0.014)
1825 4564
4.50 (0.177)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
2220 5650
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
2225 5664
5.60 (0.220)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
Dimensions – Millimeters (Inches) – Flexible Termination
EIA Size
Code
Metric Size
Code
L
Length
W
Width T Thickness B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0603 1608
1.60 (0.064)
±0.17 (0.007)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.45 (0.018)
±0.15 (0.006)
0.58 (0.023)
Solder Wave or
fl
0805 2012
2.00 (0.079)
±0.30 (0.012)
1.25 (0.049)
±0.30 (0.012)
0.50 (0.02)
±0.25 (0.010)
0.75 (0.030)
1206 3216
3.30 (0.130)
±0.40 (0.016)
1.60 (0.063)
±0.35 (0.013)
0.60 (0.024)
±0.25 (0.010)
N/A
1210 3225
3.30 (0.130)
±0.40 (0.016)
2.60 (0.102)
±0.30 (0.012)
0.60 (0.024)
±0.25 (0.010)
fl
Only
1808 4520
4.70 (0.185)
±0.50 (0.020)
2.00 (0.079)
±0.20 (0.008)
0.70 (0.028)
±0.35 (0.014)
1812 4532
4.50 (0.178)
±0.40 (0.016)
3.20 (0.126)
±0.30 (0.012)
0.70 (0.028)
±0.35 (0.014)
1825 4564
4.60 (0.181)
±0.40 (0.016)
6.40 (0.252)
±0.40 (0.016)
0.70 (0.028)
±0.35 (0.014)
2220 5650
5.90 (0.232)
±0.75 (0.030)
5.00 (0.197)
±0.40 (0.016)
0.70 (0.028)
±0.35 (0.014)
2225 5664
5.90 (0.232)
±0.75 (0.030)
6.40 (0.248)
±0.40 (0.016)
0.70 (0.028)
±0.35 (0.014)
ammmc compmm KEIVIEI' crummy: 100 megohm mmmlarads or 1060
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range 
Capacitance Change with Reference to
 ±15%
1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
2Dielectric Withstanding Voltage (DWV) 150% of rated voltage for voltage rating of < 1000V

(5±1 seconds and charge/discharge not exceeding 50mA)
3
2.5%
4


1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial
Limit
16/25 5.0
< 16 7.5
ammmc compmm KEIVIEI' crummy: Ram: Voltage Ram: Voltage (vnm case sixe/ Series
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)
Cap Cap
Code
Case Size/
Series C0603W/V C0805W/V C1206W/V C1210W/V C1808W/V C1812W/V C1825W/V C2220W/V C2225W/V
Voltage Code C B D C B D C B D C B D C B D C B D C B C B C B
Rated Voltage
(VDC)
500 630
1000
500 630
1000
500 630
1000
500 630
1000
500 630 1000 500 630
1000
500 630 500 630 500 630
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF 102 J K M CG CG CG
1,200 pF 122 J K M CG CG
1,500 pF 152 J K M CG CG
1,800 pF 182 J K M CG
2,200 pF 222 J K M CG DG DG DG
2,700 pF 272 J K M CG DG DG DG
3,300 pF 332 J K M CG DG DG DG
3,900 pF 392 J K M CG DG DG DG
4,700 pF 472 J K M DG DG DG
5,600 pF 562 J K M DG DG
6,800 pF 682 J K M DG DG
8,200 pF 822 J K M DG DG
10,000 pF 103 J K M DG DG
12,000 pF 123 J K M DG DG EJ EJ EJ
15,000 pF 153 J K M DG EJ EJ EJ
18,000 pF 183 J K M DG EJ EJ EJ LE LE LE
22,000 pF 223 J K M DG EJ EJ EJ FZ FZ FZ LE LE LE
27,000 pF 273 J K M EJ EJ FZ FZ FZ LA LA LA GB GB GB
33,000 pF 333 J K M EJ EJ FZ FZ FU LA LA LA GB GB GB
39,000 pF 393 J K M EJ FZ FZ FU LA LA LA GB GB GB
47,000 pF 473 J K M EJ FZ FU FK LA LA LB GB GB GC
56,000 pF 563 J K M EJ FZ FU FK LA LA LB GB GB GE
62,000 pF 623 J K M EJ FZ FK FS LA LA LC GB GB GE
68,000 pF 683 J K M EJ FZ FK FS LA LA LC GE GE GE
82,000 pF 823 J K M FU FK LA LC GB GE GK
0.10 µF 104 J K M FK FS LA LC GB GH GJ
0.12 µF 124 J K M FK LA GE GK HE HE
0.15 µF 154 J K M FK LB GE GN HE HE JE JE
0.18 µF 184 J K M GF HE HG JE JE KE KE
0.22 µF 224 J K M GJ HG HJ JK JK KE KF
0.27 µF 274 J K M GL HJ HJ JK JL KF KH
0.33 µF 334 J K M GS HJ JL JN KF KH
0.39 µF 394 J K M HK JN KH KJ
0.47 µF 474 J K M JN KH KJ
0.56 µF 564 J K M KJ
Cap Cap
Code
Rated Voltage
(VDC)
500 630
1000
500 630
1000
500 630
1000
500 630
1000
500 630 1000 500 630
1000
500 630 500 630 500 630
Voltage Code C B D C B D C B D C B D C B D C B D C B C B C B
Case Size/
Series
C0603W/V C0805W/V C1206W/V C1210W/V C1808W/V C1812W/V C1825W/V C2220W/V C2225W/V
These products are protected under US Patents 8,885,319 B2 and 9,490,072 B2, other patents pending, and any foreign counterparts.
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
ammm Compancnls KEIVIEI' Emma): CG DG EJ FZ FU FK FS LE LA L8 L0 GE 5E 5F SJ GL GS 60 GH GK GN HE HG HJ HK JE JK JL JN KE KF KH KJ 603 805 1206 1210 1210 1210 1210 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 2220 2220 2220 2220 2225 2225 2225 2225 0.801010" 1.251015 1.701020 1.251020 1.551020 2.101020 25010.30 1.001010 1.401015 16010.15 2.001015 1.001010 1.301010 1.501010 1.701015 190 1 0.20 2.101020 1.101010 1.401015 1.60 1 0 20 1.701020 1.401015 1.601020 2.001020 2.501020 1.401015 1.60 1 0 20 2.001020 2.501020 1.401015 1.601020 2.001020 2.501020 1: c. o o oooooooooooooooooooooooooooooooo 15000 ococoooooooooceeoeooooocococoooo 2500 2000 2500 2000 2000 1000 2500 1000 1000 1000 1000 1000 1000 1000 500 500 1,000 1,000 1,000 1,000 1,000 1,000 500 500 1,000 1,000 500 500 1,000 1,000 500 500 10000 8000 10000 8000 8000 4000 10000 4000 4000 4000 4000 4000 4000 4000 2000 2000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000 4,000 4,000 2,000 2,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
CG
603
0.80 ± 0.10*
4000
15000
0
0
DG
805
1.25 ± 0.15
0
0
2500
10000
EJ
1206
1.70 ± 0.20
0
0
2000
8000
FZ
1210
1.25 ± 0.20
0
0
2500
10000
FU
1210
1.55 ± 0.20
0
0
2000
8000
FK
1210
2.10 ± 0.20
0
0
2000
8000
FS
1210
2.50 ± 0.30
0
0
1000
4000
LE
1808
1.00 ± 0.10
0
0
2500
10000
LA
1808
1.40 ± 0.15
0
0
1000
4000
LB
1808
1.60 ± 0.15
0
0
1000
4000
LC
1808
2.00 ± 0.15
0
0
1000
4000
GB
1812
1.00 ± 0.10
0
0
1000
4000
GE
1812
1.30 ± 0.10
0
0
1000
4000
GF
1812
1.50 ± 0.10
0
0
1000
4000
GJ
1812
1.70 ± 0.15
0
0
1000
4000
GL
1812
1.90 ± 0.20
0
0
500
2000
GS
1812
2.10 ± 0.20
0
0
500
2000
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GH
1812
1.40 ± 0.15
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
GN
1812
1.70 ± 0.20
0
0
1,000
4,000
HE
1825
1.40 ± 0.15
0
0
1,000
4,000
HG
1825
1.60 ± 0.20
0
0
1,000
4,000
HJ
1825
2.00 ± 0.20
0
0
500
2,000
HK
1825
2.50 ± 0.20
0
0
500
2,000
JE
2220
1.40 ± 0.15
0
0
1,000
4,000
JK
2220
1.60 ± 0.20
0
0
1,000
4,000
JL
2220
2.00 ± 0.20
0
0
500
2,000
JN
2220
2.50 ± 0.20
0
0
500
2,000
KE
2225
1.40 ± 0.15
0
0
1,000
4,000
KF
2225
1.60 ± 0.20
0
0
1,000
4,000
KH
2225
2.00 ± 0.20
0
0
500
2,000
KJ
2225
2.50 ± 0.20
0
0
500
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in
the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade
product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for
Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th
through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk
Bag" packaging.
E‘ucuomc Compcnonu KEIWEI' CHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 1.50 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
El" CHARGED! E‘ucuomc Compcnonu K
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11
1808 4520 2.30 1.75 2.30 7.4 0 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00
2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60
2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc Emma):
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
 fl
 fl
Recommended Reflow Soldering Profile:
The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
fl
fiflflfi
fl
these conditions.
Profile Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)


Temperature Maximum (T
Smax
)
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)
maximum 
maximum
Liquidous Temperature (TL) 
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP) 

Peak Temperature (tP)20 seconds
maximum 30 seconds
maximum
Ramp-Down Rate (TP to TL)
maximum 
maximum

Temperature 6 minutes
maximum 8 minutes
maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
tP
tL
ts
25°C to Peak
ammmc Compancnl: KEIl/IEI' CHARGED! MlL’STD’ZO? Method 108 MlL’STD’ZO? Method 108 5 g‘s lot 20 minutes, 12 cycles each at 3 mientatinns. Note: Use 3" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of mounted Within 2" from any secure pointt Test (tom 10 7 2,000 Hz MlL’STD’ZO? Method 213 MlL’STD’ZO? Method 215
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 
Board Flex JIS–C–6429

for C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
fi



Temperature Cycling JESD22 Method JA–104 
Biased Humidity MIL–STD–202
Method 103

Measurement at 24 hours ±4 hours after test conclusion.

Measurement at 24 hours ±4 hours after test conclusion.
Moisture Resistance
MIL–STD–202
Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours ±4
hours after test conclusion.
Thermal Shock
MIL–STD–202
Method 107

seconds. Dwell time – 15 minutes. Air – air.
High Temperature Life
MILSTD202
Method 108

Storage Life
MILSTD202
Method 108

Vibration MIL–STD–202
Method 204

7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MILSTD202
Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MILSTD202
Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp

fl
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Emctmmc Compancnl: KEIVIEI' CHARGED! / strode: I r Layer ectrudes
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Dielectric
Material (BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Shield Electrodes
(Ni)
Shield Electrodes
(Ni)
Shield Electrode
(Ni)
End Termination/
External Electrode
(Cu)
Construction – Flexible Termination
Dielectric
Material (BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
Termination Finish
(100% Matte Sn/
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Epoxy Layer
(Ag)
Epoxy Layer
(Ag)
Shield Electrodes
(Ni)
Shield Electrodes
(Ni)
Shield Electrode
(Ni)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
summc Con-pan m KEIVIEI' CHARGED.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices, but must be requested using
fi
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Laser marking option is not
C0G, ultra stable X8R and Y5V dielectric devices.
EIA 0402 case size devices.
 fl
option.
KPS commercial and automotive grade stacked
devices.
X7R dielectric products in capacitance values outlined
below.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
EIA Case Size Metric Size Code Capacitance
0603
1608

0805
2012

1206
3216

1210
3225

1808
4520

1812
4532

1825
4564

2220
5650

2225
5664

ammmc Compononl: KEIWEI' cums): -acitance F Fur Varinus AI halNumeralldentifiers
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifi ers
Alpha
Character
Numeral
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
0.10
1.0
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000
C
0.12
1.2
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
1.3
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
1.5
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
160,000,000
G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
ammm Compancnls KEIVIEI' Emma): Bmm.12mm 173 mm (7 w») mmmm camenape KPS1812 and 2220
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm carrier tape
178 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch (P
1
)* Pitch (P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 1210 84444
1805 – 1808 12 4 4
12 8 8
KPS 1210 12 8 8
KPS 1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
Lower placement costs.
Double the parts on each reel results in fewer reel

Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm


1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiifi‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.904) maXImum (afiiflig (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 
 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with su cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: 
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 
 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)

14.4
(0.567)
Shall accommodate tape
width without interference
12 mm


18.4
(0.724)
16 mm

22.4
(0.882)
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
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