Prototype Boards Perforated

Results: 6
Product Status
ActiveObsolete
Circuit Pattern
-Pad Per Hole (Round)
Size / Dimension
5.00" L x 4.00" W (127.0mm x 101.6mm)6.50" L x 4.50" W (165.1mm x 114.3mm)10.00" L x 10.00" W (254.0mm x 254.0mm)10.00" L x 4.00" W (254.0mm x 101.6mm)20.00" L x 10.00" W (508.0mm x 254.0mm)
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Plating
Pitch
Circuit Pattern
Edge Contacts
Hole Diameter
Size / Dimension
Board Thickness
8200-45
8200-45
BREADBOARD GENERAL PURPOSE
Twin Industries
36
In Stock
1 : 10,90000 €
Bulk
Bulk
ActiveBreadboard, General Purpose-0.100" (2.54mm)Pad Per Hole (Round)-0.037" (0.94mm)5.00" L x 4.00" W (127.0mm x 101.6mm)0.062" (1.57mm) 1/16"
8200-410
8200-410
BREADBOARD GENERAL PURPOSE
Twin Industries
1
In Stock
1 : 21,79000 €
Bulk
Bulk
ActiveBreadboard, General Purpose-0.100" (2.54mm)Pad Per Hole (Round)-0.037" (0.94mm)10.00" L x 4.00" W (254.0mm x 101.6mm)0.062" (1.57mm) 1/16"
8200-4565
8200-4565
BREADBOARD GENERAL PURPOSE
Twin Industries
0
In Stock
Check Lead Time
1 : 18,16000 €
Bulk
Bulk
ActiveBreadboard, General Purpose-0.100" (2.54mm)Pad Per Hole (Round)-0.037" (0.94mm)6.50" L x 4.50" W (165.1mm x 114.3mm)0.062" (1.57mm) 1/16"
8200-1010
8200-1010
PC BOARD 10"X10" 2X PTH/GND 0.1"
Twin Industries
0
In Stock
Active
-
ActiveBreadboard, General Purpose-0.100" (2.54mm)Pad Per Hole (Round)-0.037" (0.94mm)10.00" L x 10.00" W (254.0mm x 254.0mm)0.062" (1.57mm) 1/16"
8200-1020
8200-1020
PC BOARD 10"X20" 2X PTH/GND 0.1"
Twin Industries
0
In Stock
Active
Bulk
ActiveBreadboard, General Purpose-0.100" (2.54mm)--0.037" (0.94mm)20.00" L x 10.00" W (508.0mm x 254.0mm)0.062" (1.57mm) 1/16"
8200-45-LF
8200-45-LF
BREADBOARD GENERAL PURPOSE
Twin Industries
0
In Stock
Obsolete
Bulk
ObsoleteBreadboard, General Purpose-0.100" (2.54mm)Pad Per Hole (Round)-0.037" (0.94mm)5.00" L x 4.00" W (127.0mm x 101.6mm)0.062" (1.57mm) 1/16"
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Prototype Boards Perforated


Products in this category are used as a platform for circuit construction in hobby, experimental, and similar settings where adaptability is desired. Characterized by having a series of holes drilled through their thickness at regular intervals, they may also include a solderable conductive layer around these holes, which may or may not be interconnected, depending on the nature of a specific product. Often used for constructing circuits based on through-hole component packaging, similar products lacking perforation are more commonly used for circuit development using surface mounted components.