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DLP11SNyyyyL2y Spec Sheet

Murata Electronics North America

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Spec No. JEFL243E-0004W P1/9
MURATA MFG.CO., LTD
Reference Only
Chip Common Mode Choke Coil
DLP11SN□□□□L2 Reference Specification
1.Scope
This reference specification applies to Chip Common Mode Choke Coil DLP11SN Series.
2.Part Numbering
(ex.) DL P 11 S N 201 H L 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L×W)
(4) Type
(5) Category
3.Rating
Customer
Part Number
Murata
Part Number
Common Mode Impedance
(at 100MHz, Under
Standard Testing Condition)
Rated
Voltage
Withstanding
Voltage
Rated
Current
DC
Resistance
Insulation
Resistanc
e
DLP11SN670SL2L 67Ω ±20%
5V(DC) 12.5V(DC)
180mA 1.3Ω±25%
100MΩ
min.
DLP11SN670SL2B
DLP11SN900HL2L 90Ω ±20% 150mA 1.5Ω±25%
DLP11SN900HL2B
DLP11SN121SL2L 120Ω ±20% 140mA 2.0Ω±25%
DLP11SN121SL2B
DLP11SN161SL2L 160Ω ±20% 120mA 2.7Ω±25%
DLP11SN161SL2B
DLP11SN201HL2L 200Ω±20% 110mA 3.1Ω±25%
DLP11SN201HL2B
DLP11SN241HL2L 240Ω±20% 100mA 3.5Ω±25%
DLP11SN241HL2B
DLP11SN281HL2L 280Ω±20% 90mA 4.2Ω±25%
DLP11SN281HL2B
DLP11SN331HL2L 330Ω±20% 80mA 4.9Ω±25%
DLP11SN331HL2B
Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C
4. Standard Testing Conditions
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5.Style and Dimensions
Equivalent Circuits
Unit Mass (Typical value)
0.005g
(6) Impedance (Typ. at 100MHz)
(7) Circuit S : Standard
H : Characteristic Impedance 100Ω system
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping / B : Bulk
(1)
(4)
(2)
(3)
No polarity
0.82±0.10
(Top View)
(Bottom View)
(Side View)
1.25±0.10
0.25 +0.10/-0.05
1.00±0.10
0.55±0.10
(1) (2)
(3)(4)
:Electrode
(in : mm)
0.30±0.10
Spec No. JEFL243E-0004W P2/9
MURATA MFG.CO., LTD
Reference Only
6.Marking
No Marking.
7. Electrical Performance
No. Item Specification Test Method
7.1 Common Mode
Impedance
Meet item 3. Measuring Frequency : 100±1MHz (ref.item 10.)
Measuring Equipment : KEYSIGHT 4291A or the
equivalents
(In case of doubt in standard condition, the heat
treatment (200°C,about 10 min)shall be applied.
7.2 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 s
Charge Current : 1 mA max.(ref.item 10.)
7.3 DC Resistance
(Rdc)
Meet item 3. Measuring current : 100mA max.(ref.item 10.)
7.4 Insulation
Resistance (I.R.)
Measuring voltage : Rated Voltage
Measuring time : 1 min max. (ref.item 10.)
8.Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5.
Visual Inspection and measured with Slide Calipers.
8.2 Solderability The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 1min
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 3±1 s
Immersion and emersion rates : 25 mm / s
8.3 Resistance to
Soldering Heat
Meet Table 1.
Table 1 Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C ,1min
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 s
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 h.
8.4 Drop It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 3 times
8.5 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 h in each of 3
mutually perpendicular directions.
8.6 Bending
Strength
Meet Table 2.
Table 2
Substrate : (t =1.0 mm).
Deflection : 2 mm
Speed of Applying Force : 0.5 mm / s
Keeping time : 30 s
Appearance No damaged
Common Mode
Impedance
Change
within ± 20%
I.R. 100MΩ min.
DC Resistance
Change within ± 30%
45
R230
F
Deflection
45 Product
Pressure jig
Appearance No damaged
DC Resistance
Change within ± 30%
Spec No. JEFL243E-0004W P3/9
MURATA MFG.CO., LTD
Reference Only
9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 h.
9.2 Humidity Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 h(+48 h,-0 h)
Then measured after exposure in the room condition
for 4 to 48 h.
9.3 Heat life Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 h(+48 h,-0 h)
Then measured after exposure in the room condition
for 4 to 48 h. (ref. Item 10.)
9.4 Cold Resistance Temperature : -40± 2°C
Time : 1000 h(+48 h,-0 h)
Then measured after exposure in the room condition
for 4 to 48 h.
10. Terminal to be Tested.
When measuring and supplying the voltage,the following terminal is applied.
No. Item Terminal to be Tested
10.1 Common Mode
Impedance
10.2
Withstanding Voltage
Insulation Resistance
Heat Life
10.3 DC Resistance
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Rx = Gm - Go
(Gm-Go) + (Bm-Bo) Rs
Xx = - (Bm - Bo)
(Gm-Go) + (Bm-Bo) Xs
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 16 except the case of being specified special condition.
IN OUT
IN
OUT
IN OUT
IN OUT
Spec No. JEFL243E-0004W P4/9
MURATA MFG.CO., LTD
Reference Only
1
10
100
1000
10000
1 10 100 1000 10000
Frequency (MHz)
Impedance (Ω)
DLP11SN670SL2
Common mode
DLP11SN281HL2
DLP11SN241HL2
DLP11SN281HL2
DLP11SN331HL2
DLP11SN201HL2
DLP11SN201HL2
DLP11SN241HL2
DLP11SN331HL2
Differential mode
DLP11SN900HL2
DLP11SN121SL2
DLP11SN161SL2
DLP11SN670SL2
DLP11SN900HL2
DLP11SN121SL2
DLP11SN161SL2
13.Impedance Frequency Characteristics(Typical)
Spec No. JEFL243E-0004W P5/9
MURATA MFG.CO., LTD
Reference Only
14. Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
(in:mm)
14.2 Specification of Taping
(1)Packing quantity(Standard quantity) 3000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc.,whichever is greater,and are not
continuous. The specified quantity per reel is kept.
14.3 Pull Strength of Plastic Tape
Plastic Tape 5N min.
Cover Tape 10N min.
14.4 Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
14.5 Dimensions of Leader-tape, Trailer and Reel
(in:mm)
14.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS Marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
165 to 180 degree FCover tape
Plastic tape
Sprocket Hole
Direction of feed
Cavity
φ
1.5
+0.1
-
0
4.0±0.1 2.0±0.05 1.2±0.1
1.4±0.1
4.0±0.1
1.75±0.1
3.5±0.05
8.0±0.2
0.98±0.05
0.25±0.05
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
*Dimension of the Cavity is measured
at the bottom side.
Spec No. JEFL243E-0004W P6/9
MURATA MFG.CO., LTD
Reference Only
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
WDH
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
15.
!Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
15.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
16. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solde
r
Use Sn-3.0Ag-0.5Cu solde
r
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the machanical
Stress.
Poor example
Good example
b
a
Z Z
right direction wrong direction
W
D
Label
H
Spec No. JEFL243E-0004W P7/9
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
16.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6 Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or the equivalents.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Perforation
A
B
C
D
Screw Hole Recommended
Spec No. JEFL243E-0004W P8/9
MURATA MFG.CO., LTD
Reference Only
0.55
0.85
0.30
0.55
1.95
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
(in : mm)
(1) (2)
(4) (3)
16.7 Standard Land Dimensions
16.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
(1) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use Sn-3.0Ag-0.5Cu solder.
(2) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 380°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) s. · Times : 2times max.
Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
Standard Profile
Limit Profile
Temp.
Time
90s±30s
230
260
245℃±3
220℃
30s60s
60s max.
180
150
(s)
(℃)
(inmm)
0.55
0.30
0.70 0.55 0.70
U
pp
er Limit
Recommendable
1/3 T TT : Chip thickness
t
Recommendable
U
pp
er Limit
Spec No. JEFL243E-0004W P9/9
MURATA MFG.CO., LTD
Reference Only
16.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.12 Storage Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 15 to 85% relative humidity
No rapid change on temperature and humidity
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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