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AP65111A Datasheet

Diodes Incorporated

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Datasheet

AP65111A
Document number: DS39760 Rev. 1 - 2
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AP65111A
TSOT26 LIGHT LOAD IMPROVED 1.5A SYNCH DC/DC BUCK CONVERTER
Description
The AP65111A is a 500kHz switching frequency internal
compensated synchronous DC/DC buck converter. It has integrated
low RDS(ON) high and low side MOSFETs.
The AP65111A enables continuous load current of up to 1.5A with
efficiency as high as 97%.
The AP65111A implements an automatic custom light load efficiency
improvement algorithm.
The AP65111A features current mode control operation, which
enables fast transient response time and easy loop stabilization.
The AP65111A simplifies board layout and reduces space
requirements with its high level of integration and minimal need for
external components, making it ideal for distributed power
architectures.
The AP65111A is available in a standard Green TSOT26 package
and is RoHS compliant.
Features
VIN 4.5V to 18V
1.5A Continuous Output Current
Efficiency Up to 97%
Automated Light Load Improvement
VOUT Adjustable from 0.8V
500kHz Switching Frequency
Internal Soft-Start
Enable Pin
Overvoltage Protection & Undervoltage Protection
Overcurrent Protection (OCP) with Hiccup
Thermal Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignments
(Top View)
3
2
1 6
4
5
IN
GND
SW
FB
EN
BST
TSOT26
Applications
Gaming Consoles
Flat Screen TV Sets and Monitors
Set-Top Boxes
Distributed Power Systems
Home Audio
Consumer Electronics
Network Systems
FPGA, DSP and ASIC Supplies
Green Electronics
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated‟s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
AP65111A
L1
6.5μH
R1
40.2kΩ
R2
13kΩ
C5
1µF
C2
22μF
C1
22μF
ON
OFF
1
IN
5
EN
3
SW
4
BST
6
FB
2
GND
INPUT
OUTPUT
VOUT
3.3V
VIN
12V
R3
59kΩ
VIN=4.5V
VIN=12V
VIN=18V
AP65111A
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AP65111A
Pin Descriptions
Pin Number
Pin Name
Function
1
IN
Power Input. IN supplies the power to the IC, as well as the step-down converter switches. Drive IN with a 4.5V
to 18V power source. Bypass IN to GND with a suitably large capacitor to eliminate noise on the input to the IC.
See Input Capacitor.
2
GND
Ground
3
SW
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC
filter from SW to the output load. Note that a capacitor is required from SW to BST to power the high-side
switch.
4
BST
High-Side Gate Drive Boost Input. BST supplies the drive for the high-side N-Channel MOSFET a 0.01µF or
greater capacitor from SW to BST to power the high side switch.
5
EN
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator; low to
turn it off. Attach to IN with a 100kΩ pull up resistor for automatic startup.
6
FB
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage divider
connected to it from the output voltage. The feedback threshold is 0.8V. See Setting the Output Voltage.
Functional Block Diagram
Internal
Reference
0.4V
0.8V
1.1V
VCC
Regulator
+
-
+
-
+
-
-
+
1.1V
0.4V
+
0.8V
Internal SS Error
Amplifier
OVP
PWM
Comparator
Oscillator
500kHz +
Logic
-
+
Ref
62pF 650k
1pF
OCP
UVP
SE=0.9V/T RT=0.22V/A
HS
LS
5
EN
6
FB
2
GND
3
SW
4BST
1
IN
Figure 2. Functional Block Diagram
AP65111A
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AP65111A
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) (Note 4)
Symbol
Parameter
Rating
Unit
VIN
Supply Voltage
-0.3 to 20
V
VSW
Switch Node Voltage
-1.0 to VIN +0.3
V
VBST
Bootstrap Voltage
VSW -0.3 to VSW +6.0
V
VFB
Feedback Voltage
-0.3V to +6.0
V
VEN
Enable/UVLO Voltage
-0.3V to +6.0
V
TST
Storage Temperature
-65 to +150
°C
TJ
Junction Temperature
+160
°C
TL
Lead Temperature
+260
°C
ESD Susceptibility (Note 5)
HBM
Human Body Model
2
kV
CDM
Charged Device Model
1
kV
Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
Thermal Resistance (Note 6)
Symbol
Parameter
Rating
Unit
θJA
Junction to Ambient
TSOT26
120
°C/W
θJC
Junction to Case
TSOT26
30
°C/W
Note: 6. Test condition for TSOT26: Device mounted on FR-4 substrate, single-layer PC board, 2oz copper, with minimum recommended pad layout.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) (Note 7)
Symbol
Parameter
Min
Max
Unit
VIN
Supply Voltage
4.5
18
V
TA
Operating Ambient Temperature Range
-40
+85
°C
Note: 7. The device function is not guaranteed outside of the recommended operating conditions.
AP65111A
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AP65111A
Electrical Characteristics (@TA = +25°C, VIN = 12V, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
ISHDN
Shutdown Supply Current
VEN = 0V
1.0
µA
IQ
Supply Current (Quiescent)
VEN = 2.0V, VFB = 0.85V
0.725
mA
RDS(ON)1
High-Side Switch On-Resistance (Note 8)
200
RDS(ON)2
Low-Side Switch On-Resistance (Note 8)
120
ILIMIT_PEAK
HS Peak Current Limit (Note 8)
Minimum duty cycle,
TA = -40°C to +85°C
2.5
3.0
A
ISW_LKG
Switch Leakage Current
VEN = 0V, VSW = 12V
1
μA
fSW
Oscillator Frequency
VFB = 0.75V
400
500
600
kHz
DMAX
Maximum Duty Cycle
VFB = 700mV
88
92
%
tON
Minimum On Time
90
ns
VFB
Feedback Voltage (Note 8)
TA = -40°C to +85°C
776
800
824
mV
VEN_RISING
EN Rising Threshold
1.4
1.5
1.6
V
VEN_FALLING
EN Falling Threshold
1.23
1.32
1.41
V
IEN
EN Input Current
VEN = 2V
2.85
μA
VEN = 0V
0
μA
INUVVTH
VIN Undervoltage Threshold Rising
3.7
4.05
4.4
V
INUVHYS
VIN Undervoltage Threshold Hysteresis
250
mV
tSS
Soft-Start Period
1
ms
TSHDN
Thermal Shutdown (Note 8)
+160
°C
THYS
Thermal Hysteresis (Note 8)
+20
°C
Note: 8. Compliance to the datasheet limits is assured by one or more methods: production test, characterization, and/or design.
AP65111A
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AP65111A
Typical Performance Characteristics (@TA = +25°C, VIN = 12V, VOUT = 3.3V, L = 6.5µH, unless otherwise specified.)
VIN=7V
VIN=12V
VIN=18V
VIN=4.5V
VIN=12V
VIN=18V
VIN=4.5V
VIN=12V
VIN=18V
VIN=4.5V
VIN=12V
VIN=18V
ISHDN vs Input Voltage
VIN = 4.5V to 18V
ISHDN (nA)
IQ vs Input Voltage
VIN = 4.5V to 18V
Efficiency vs Output Current
VOUT = 3.3V; LOUT = 6.5µH
IQA)
AP65111A
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AP65111A
Typical Performance Characteristics (Cont.) (@TA = +25°C, VIN = 12V, VOUT = 3.3V, L = 6.5µH, unless otherwise specified.)
VIN=4.5V
VIN=12V
VIN=18V
VIN=4.5V
VIN=12V
VIN=18V
VIN=12V
VIN=18V
IOUT=1.5A
VIN=4.5V
IOUT=10mA
IOUT=0A
IOUT=1A
AP65111A
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AP65111A
Typical Performance Characteristics (Cont.) (@TA = +25°C, VIN = 12V, VOUT = 3.3V, L = 6.5µH, C1 = 22µF, C2 = 22µF,
unless otherwise specified.)
Startup Through VEN 1.5A Load
Time-1ms/div
Startup Through VIN 1.5A Load
Time-1ms/div
Short Circuit Test
Time-5ms/div
Shutdown Through VEN 1.5A Load
Time-50µs/div
Shutdown Through VIN 1.5A Load
Time-1ms/div
Short Circuit Recovery
Time-5ms/div
Startup Through VEN 0A Load
Time-1ms/div
Startup Through VIN 0A Load
Time-1ms/div
Transient Response (0.75A to 1.5A)
Time-100µs/div
Shutdown Through VEN 0A Load
Time-500ms/div
Shutdown Through VIN 0A Load
Time-500ms/div
Input/Output Ripple (IO = 1.5A)
Time-2µs/div
VIN (12V/DIV)
VOUT (3.3V/DIV)
IOUT (1.5A/DIV)
SW (10V/DIV)
VEN (5V/DIV)
IOUT (1.5A/DIV)
SW (10V/DIV)
VOUT (3.3V/DIV)
VEN (5V/DIV)
VOUT (3.3V/DIV)
IOUT (1.5A/DIV)
SW (10V/DIV)
VIN (12V/DIV)
VOUT (3.3V/DIV)
IOUT (1.5A/DIV)
SW (10V/DIV)
VOUT (2V/DIV)
IOUT (1.5A/DIV)
VOUT (2V/DIV)
IOUT (1.5A/DIV)
IOUT (1A/DIV)
VOUT_AC (200mV/DIV)
VOUT_AC (50mV/DIV)
SW (10V/DIV)
VEN (5V/DIV)
IOUT (100mA/DIV)
SW (10V/DIV)
VOUT (3.3V/DIV)
VEN (5V/DIV)
VOUT (3.3V/DIV)
IOUT (100mA/DIV)
SW (10V/DIV)
VIN (12V/DIV)
VOUT (3.3V/DIV)
IOUT (100mA/DIV)
SW (10V/DIV)
VIN (12V/DIV)
VOUT (3.3V/DIV)
IOUT (100mA/DIV)
SW (10V/DIV)
IL (2A/DIV)
VIN_AC (100mV/DIV)
AP65111A
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AP65111A
Application Information
Theory of Operation
The AP65111A is a 1.5A current mode control, synchronous buck regulator with integrated power MOSFETs. Current mode control assures
excellent line regulation, load regulation, and a wide loop bandwidth for fast response to load transients. Figure 2 depicts the functional block
diagram of AP65111A.
The operation of one switching cycle can be explained as follows: The rising edge of the 500kHz oscillator clock signal sets the RS Flip-Flop. Its
output turns on HS MOSFET. When the HS MOSFET is on, inductor current starts to increase. The current sense amplifier with a gain of 0.22V/A
is used to detect the inductor current. Since the current mode control is subject to sub-harmonic oscillations that start at half duty cycle, ramp
slope compensation of 0.9V/T is added to the current sense signal. When the sum of the current sense amplifier output and the slope
compensation signal exceeds the EA output voltage, the RS Flip-Flop is reset and HS MOSFET is turned off.
Then synchronous LS MOSFET turns on until the next clock cycle begins. There is a “dead time” between the HS turn off and LS turn on that
prevents the switches from “shooting through” across the input supply to ground.
If the sum of the current sense amplifier output and the slope compensation signal does not exceed the EA output, then the falling edge of the
oscillator clock resets the Flip-Flop, and forces the HS MOSFET to turn off.
The voltage loop is compensated internally.
Enable
The enable (EN) input allows the user to control turning on or off the regulator. The AP65111A has an internal pull down resistor on the EN pin
and when the EN is not actively pulled up the part turns off.
Quiescent Current
Above the „EN Rising Threshold‟, the internal regulator is turned on and the quiescent current can be measured when VFB > 0.8V.
Automated No-Load and Light-Load Operation
The AP65111A operates in light load high efficiency mode during low load current operation. The advantage of this light load efficiency mode is
lower power losses at no-load and light-load conditions. The AP65111A automatically detects the inductor‟s valley current and enters the light load
high efficiency mode when value falls below zero Ampere. Once the inductor‟s valley current exceeds this zero Ampere, the AP65111A transitions
from light load high efficiency mode to continuous PWM mode.
Current Limit Protection
In order to reduce the total power dissipation and to protect the application, AP65111A has cycle-by-cycle current limiting implementation. The
voltage drop across the internal high-side MOSFET is sensed and compared with the internally set current limit threshold. This voltage drop is
sensed at about 30ns after the HS turns on. When the peak inductor current exceeds the set current limit threshold, current limit protection is
activated. When the FB voltage pin dropped below 0.4V, the device enters Hiccup mode to periodically restart the part. This protection mode
greatly reduces the power dissipated on chip and reduces the thermal stress to help protect the device. AP65111A will exit Hiccup mode when the
over current situation is resolved.
Undervoltage Lockout (UVLO)
Undervoltage Lockout is implemented to prevent the IC from insufficient input voltages. The AP65111A has a UVLO comparator that monitors the
input voltage and the internal bandgap reference. If the input voltage falls below 4.05V, the AP65111A will disable. In this event, both HS and LS
MOSFETs are turned off.
Overvoltage Protection
When the AP65111A FB pin exceeds 115% of the nominal regulation voltage of 0.8V, the overvoltage comparator is tripped and internal regulator
would stop switching. The VOUT would stay high voltage as tripped point and slowly discharged by output capacitance.
Thermal Shutdown
The AP65111A has on-chip thermal protection that prevents damage to the IC when the die temperature exceeds safe margins. It implements a
thermal sensing to monitor the operating junction temperature of the IC. Once the die temperature rises to approximately +160°C, the thermal
protection feature gets activated. The internal thermal sense circuitry turns the IC off thus preventing the power switch from damage. A hysteresis
in the thermal sense circuit allows the device to cool down to approximately +120°C before the IC is enabled again through soft start. This thermal
hysteresis feature prevents undesirable oscillations of the thermal protection circuit.
AP65111A
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AP65111A
Application Information (Cont.)
Setting the Output Voltage
The output voltage can be adjusted from 0.8V using an external resistor divider. Table 1 shows a list of resistor selection for common output
voltages. A serial resistor RT is also recommended for improving the system stability, especially for low VOUT (<3.3V). An optional CFF of 10pF to
100pF used to boost the phase margin. Resistor R1 is selected based on a design tradeoff between efficiency and output voltage accuracy. For
high values of R1 there is less current consumption in the feedback network. R1 can be determined by the following equation:
1
0.8
V
RR OUT
21
VOUT
FB R1
R2
RT
CFF
Figure 3. Feedback Divider Network
Table 1. Recommended Component Selection
VOUT (V)
R1 (kΩ)
R2 (kΩ)
RT (kΩ)
L1 (µH)
1.05
10
32.4
150
2.2
1.2
15
30.1
130
2.2
1.8
40.2
32.4
100
3.3
2.5
40.2
19.1
59
4.7
3.3
40.2
13
59
6.5
5
40.2
7.68
59
6.5
Inductor
Calculating the inductor value is a critical factor in designing a buck converter. For most designs, the following equation can be used to calculate
the inductor value;
SWLIN
OUTINOUT fΔIV
)V(VV
L
Where
L
ΔI
is the inductor ripple current and
SW
f
is the buck converter switching frequency.
Choose the inductor ripple current to be 30% to 40% of the maximum load current. The maximum inductor peak current is calculated from:
2
ΔI
II L
LOADL(MAX)
Peak current determines the required saturation current rating, which influences the size of the inductor. Saturating the inductor decreases the
converter efficiency while increasing the temperatures of the inductor and the internal MOSFETs. Hence, choose an inductor with appropriate
saturation current rating is important.
A 1µH to 10µH inductor with a DC current rating of at least 25% higher than the maximum load current is recommended for most applications.
For highest efficiency, the inductor‟s DC resistance should be less than 20. Use a larger inductance for improved efficiency under light load
conditions.
Input Capacitor
The input capacitor reduces the surge current drawn from the input supply and the switching noise from the device. The input capacitor has to
sustain the ripple current produced during the on time on the upper MOSFET. It must hence have a low ESR to minimize the losses.
The RMS current rating of the input capacitor is a critical parameter that must be higher than the RMS input current. As a rule of thumb, select an
input capacitor which has RMs rating that is greater than half of the maximum load current.
Due to large dI/dt through the input capacitors, low RESR electrolytic or ceramics should be used. If a tantalum must be used, it must be surge
protected. Otherwise, capacitor failure could occur. For most applications, a 22µF ceramic capacitor is sufficient.
Output Capacitor
The output capacitor keeps the output voltage ripple small, ensures feedback loop stability and reduces the overshoot of the output voltage. The
output capacitor is a basic component for the fast response of the power supply. During load transient, the output capacitor supplies the current to
the load for the first few cycles. This caused the output voltage to drop and sets the duty cycle to maximum, but the current slope is limited by the
inductor value.
AP65111A
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AP65111A
Application Information (Cont.)
Maximum capacitance required can be calculated from the following equation:
ESR of the output capacitor dominates the output voltage ripple. The amount of ripple can be calculated from the equation below:
ESR*ΔIVout inductorcapacitor
An output capacitor with high capacitance and low ESR is the best option. For most applications, a 22µF ceramic capacitor will be sufficient.
2
out
2
out
2
inductor
out
oV)V V(Δ
)
2
ΔI
L(I
C
Where
ΔV
is the maximum output voltage overshoot.
PC Board Layout
The layout is very important in high frequency switching converter design. With power devices switching efficiently at 500kHz, the resulting current
transitions from one device to another cause voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage
spikes can degrade efficiency, radiate noise into the circuit, and lead to device overvoltage stress. Careful component layout and printed circuit
board design minimizes these voltage spikes. As an example, consider the turn-off transition of the HS MOSFET. Prior to turn-off, the HS
MOSFET is carrying the full load current. During turn-off, current stops flowing in the HS MOSFET and is picked up by the internal body diode.
Any parasitic inductance in the switched current path generates a large voltage spike during the switching interval. Careful component selection,
tight layout of the critical components and short, wide traces minimize the magnitude of voltage spikes. There are two sets of critical components
in the regulator switching converter. The switching components are the most critical because they switch large amounts of energy and therefore
tend to generate large amounts of noise. Next are the small signal components, which connect to sensitive nodes for controlling the regulator.
The switching components should be placed close to the regulator first. Minimize the length of the connections between the input capacitors and
the power switches by placing them nearby. Position both the ceramic and bulk input capacitors as close to the upper MOSFET drain as possible.
The critical small signal components include feedback components and BST capacitor. Place the compensation components close to the FB pin.
The feedback resistors should be located as close as possible to the FB pin with vias tied straight to the ground plane. See Figure 4 for reference.
Figure 4. PC Board Layout
External Bootstrap Diode
It is recommended that an external bootstrap diode be added when the input voltage is no greater than 5V or the 5V rail is available in the system.
This helps to improve the efficiency of the regulator. This solution is also applicable for D > 65%. The bootstrap diode can be a low cost device
such as B130 or a Schottky diode that has a low VF. See below for Diodes Incorporated‟s recommended diodes.
AP65111A
BST
SW
10nF
BOOST
DIODE
5V
Figure 5. External Bootstrap Compensation Components
Recommended Diodes:
Part Number
Voltage/Current
Rating
B130
30V, 1A
SK13
30V, 1A
AP65111A
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AP65111A
Ordering Information
AP65111A X - X
Packing
Package
WU : TSOT26 7 : Tape & Reel
Part Number
Package Code
Package
Identification Code
Tape and Reel
Quantity
Part Number Suffix
AP65111AWU-7
WU
TSOT26
R3
3,000
-7
Marking Information
TSOT26
1 2 3
6
7
4
XX Y W X
XX : Identification Code
Y : Year 0~9
X : Internal Code
(Top View)
5
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Part Number
Package
Identification Code
AP65111AWU-7
TSOT26
R3
AP65111A
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AP65111A
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TSOT26
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TSOT26
D
E1
E1/2
e1
E
E/2
e
A
A2
A1
Seating Plane
0
L2
L
Gauge Plane
01(4x)
01(4x)
c
b
Seating Plane
TSOT26
Dim
Min
Max
Typ
A
1.00
A1
0.010
0.100
A2
0.840
0.900
D
2.800
3.000
2.900
E
2.800 BSC
E1
1.500
1.700
1.600
b
0.300
0.450
c
0.120
0.200
e
0.950 BSC
e1
1.900 BSC
L
0.30
0.50
L2
0.250 BSC
θ
θ1
12°
All Dimensions in mm
Dimensions
Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
C
X
Y
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AP65111A
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com

Products

IC REG BUCK ADJ 1.5A TSOT26
Available Quantity67480
Unit Price0.35