Ohmite's HS series thermal pads help simplify the design and engineering process.
Use the right off-the-shelf DC/DC converter to accelerate medical system power supply design while meeting operator, patient, and system safety needs.
Laird's Ttape pressure sensitive adhesive tape is designed to facilitate the transfer of thermal energy from heat sources, such as IC chips, to heat sinks.
CUI Devices' line of aluminum heat sinks has the variety of form factors and transistor package types to meet various onboard cooling needs.
CUI Devices' HSB series models are measured under four conditions for thermal resistance and carry power dissipation ratings from 1.92 W to 11.69 W at 75°C.
Check out Laird’s next generation of thermoelectric coolers offering higher reliability, efficiency & greater heat pumping capacity over the standard coolers.
This module will provide an overview on how to select the proper fan for forced air cooling.Duration: 10 minutes
AMEC Thermasol specializes in Thermal Management Materials with a product line including thermally conductive pads/insulators and gap fillers, thermally-conductive adhesive tapes, phase-change interface materials, and graphite foil.
An outline of the basic operating principles of axial and centrifugal fans, their common applications and uses, and their advantages and disadvantages.
Seeed’s NVIDIA® Jetson one-stop platforms enhance the development of artificial intelligence (AI), Edge computing, and various industrial embedded applications.
Aimtec's catalog overview includes AC/DC & DC/DC Converters, AC/DC & DC/DC LED Drivers, EMC Filters, and AC Adapters.
This presentation will provide an overview on CUI Devices' omniCOOL™ Bearing system, the different fans and their advantages and disadvantages.Duration: 5 minutes
Use gap filler and heat spreader thermal interface materials to design optimal cooling solutions for electronic devices.
This video takes a closer look at the advantages and disadvantages of the two most common bearing designs, the sleeve bearing and ball bearing, while introducing an alternate option developed by CUI Devices called the omniCOOL™ system.
This video breaks down the importance of heat sinks through a simple thermal calculation example that can be used to determine if a heat sink is needed, and if so, how to properly specify a heat sink based on your system requirements.
This video webinar covers the basics of Peltier module technology and its operating principles, design application examples, and key criteria and specifications for proper device selection.
History is less likely to associate Ron Hunkeler with his work on Space Shuttle heat shield tiles and more likely to focus on his strange childhood.
There are many options available when selecting how best to house your electronics project. This blog will help you determine your "best case" scenario.