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Pulse Electronics' line of SFP and SFP+ connectors and cages are designed for industry-wide compatibility and are tuned for optimal performance up to 10 Gbps.
5G is here. Increased speed, capacity, and bandwidth. TE Connectivity has powerful solutions to 5G communications connectivity design obstacles.
Hirose’s SignalBee Connectors offer an assortment of signal connection solutions providing high reliability & performance among their compact size & many configurations.
Phoenix Contact’s M12 push-pull connectors have a fast-locking system that enables convenient and secure cabling of devices and systems with just one click.
Samtec’s Edge Rate® contact system featuring the ERM8 and ERF8 series is designed for high speeds up to 56 Gbps PAM4 as well as high-cycle applications.
Samtec’s Q Strip® connectors have surface mount signal contacts and a surface mount ground plane between the signal rows for improved electrical performance.
Samtec's Tiger Eye™ assemblies are shrouded, polarized, keyed, offer a variety of pin counts, single or double row, optional retention latches, and screw downs.
Samtec’s high-speed edge card connectors are available in a variety of pitches and orientations and feature Edge Rate® contacts for increased cycle life.
Samtec's SEARAY™ open pin field arrays feature a 0.050" x 0.050" (1.27 mm x 1.27 mm) pitch grid for maximum grounding and routing flexibility.
Samtec's board-stacking interconnects feature a wide variety of designs, pitches, post height options, orientations, and body positions.
TE Connectivity AMP next-gen 0.8 mm free height connectors achieve 32 Gbps+ speeds to enable mainstream adoption in high-speed data communication applications.
Samtec’s Tiger Eye™ interconnect systems are available in three pitches and are designed for micro rugged, high-reliability, high-cycle applications.
TE Connectivity's lightweight O.C.H. connectors feature push-pull coupling, a quick disconnect, and an ultra-small footprint for battlefield conditions.
Tensility's assembly type connectors accommodates a range of wire gauges with an adjustable strain relief for applications including prototyping projects.
TE Connectivity's MU27P multiple unit connectors are completely interchangeable and intermateable with other brands that adhere to the AAR-S-512 specification.
Samtec’s Mini Mate® series is a discrete wire cable assembly on 0.100” (2.54 mm) pitch with 20 AWG to 30 AWG wire with contacts rated up to 4.8 A per pin.
HARTING's Han® Gigabit Module is suitable for 10 GB Ethernet and allows transmission at an operating frequency of up to 1000 MHz.
Die Millipacs®-Steckverbinder von Amphenol ICC ermöglichen ein kostengünstiges Upgrade auf Datenraten von bis zu 25 GBit/s bei Konformität mit einer Vielzahl von Standards.
Das Minitek® 1,00-mm-Steckverbindersystem von Amphenol ICC ist die ideale Lösung für Komponenten, die kompakte und flache Steckverbinder benötigen.
Die zweiteiligen Steckkomponenten BUCHANAN WireMate von TE bieten Entwiclern eine dreidirektionale Lösung für die Wandmontage eines Geräts und verbessert das Installationserlebnis für Neueinsteiger.
