Datenblatt für AP2181,91 von Diodes Incorporated

AP2181/ AP2191 and ”g and I: ' :I E j I: :I E 3 (Top View) NC OUT OUT FLG MSOP-SEP ( Top View) OuT GND FLG $0125 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

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March 2015

AP2181/ AP2191

1.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2181 and AP2191 are integrated high-

side power switches

optimized for Universal Serial Bus (USB) and other hot-

swap

applications. The family of devices complies with USB 2.0 and

is

available with both polarities of Enable input. They offer current and

thermal limiting and short circuit protection as well as controlled rise

time and under-voltage lockout functionality. A 7ms

deglitch capability

on the open-drain Flag output prevents false over-

current reporting

and does not require any external components.

All devices are available in SO-8, MSOP-8EP

, SOT25 and

U-DFN2018-6 packages.

Features

• Single USB Port Power Switches

• Over-Current and Thermal Protection

• 2.1A Accurate Current Limiting

• Reverse Current Blocking

• 95mΩ On-Resistance

• Input Voltage Range: 2.7V – 5.5V

• 0.6ms Typical Rise Time

• Very Low Shutdown Current: 1µA (max)

• Fault Report (FLG) with Blanking Time (7ms typ)

• ESD Protection: 4kV HBM, 300V MM

• Active Low (AP2181) or Active High (AP2191) Enable

• Ambient Temperature Range: -40°C to +85°C

• SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:

Available in “Green” Molding Compound (No Br, Sb)

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• UL Recognized, File Number E322375

• IEC60950-1 CB Scheme Certified

Applications

• Consumer Electronics – LCD TVs & Monitors, Game Machines

• Communications – Set-Top-Boxes, GPS Systems,

Smartphones

• Computing – Laptops, Desktops, Servers, Printers, Docking

Stations, HUBs

Pin Assignments

SO-8

( Top View )

1

2

3

4

8

7

6

5

NC

OUT

FLG

OUT

GND

EN

IN

FLGEN

GND

OUT

IN

1

3

2

4

5

6

U-DFN2018-6

( Top View )

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

2 of 17

www.diodes.com

March 2015

AP2181/ AP2191

Typical Applications Circuit

0

00

0.

..

.1

11

1uF

uFuF

uF

IN

ININ

IN

GND

GNDGND

GND

EN

ENEN

EN

OUT

OUTOUT

OUT

ON

ONON

ON

120

120120

120uF

uFuF

uF

Power Supply

Power SupplyPower Supply

Power Supply

2

22

2.

..

.7

77

7V to

V to V to

V to 5

55

5.

..

.5

55

5V

VV

V

0

00

0.

..

.1

11

1uF

uFuF

uF

OFF

OFFOFF

OFF

FLG

FLGFLG

FLG

Load

LoadLoad

Load

10

1010

10k

kk

k10

1010

10uF

uFuF

uF

AP

APAP

AP2191

2191 2191

2191 Enable Active High

Enable Active HighEnable Active High

Enable Active High

Available Options

Part Number Channel Enable Pin (EN) Current Limit

(typ)

Recommended Maximum Continuous

Load Current

AP2181 1 Active Low 2.1A 1.5A

AP2191 1 Active High 2.1A 1.5A

Pin Descriptions

Name

Pin Number Function

SO-8 MSOP-8EP SOT25 U-DFN2018-6

GND 1 1 2 1 Ground

IN

2, 3 2, 3 5 2 Voltage input pin (all IN pins must be tied together externally)

EN 4 4 4 3 Enable input, active low (AP2181) or active high (AP2191)

FLG 5 5 3 4 Over-current and over-temperature fault report.

Open-drain flag is active low when triggered

OUT

6, 7 6, 7 1 5, 6 Voltage output pin (all OUT pins must be tied together externally)

NC

8 8 N/A N/A No internal connection.

Recommend tie to OUT pins

Exposed tab

- Exposed tab - Exposed tab

Exposed pad.

It should be connected to GND and thermal mass for enhanced thermal

impedance. It should not be used as electrical ground conduction path.

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

3 of 17

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March 2015

AP2181/ AP2191

Functional Block Diagram

AP2181, AP2191

Thermal

Sense

Driver FLG

OUT

GND

IN

EN

UVLO

Current

Limit

Current

Sense

Deglitch

Absolute Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Symbol Parameter Ratings Units

ESD HBM Human Body Model ESD Protection 4 kV

ESD MM

Machine Model ESD Protection

for MSOP-8EP, SOT25 Packages 400 V

Machine Model ESD Protection

for U-DFN2018-6, SO-8 Packages 300 V

V

IN

Input Voltage 6.5 V

V

OUT

Output Voltage V

IN

+0.3 V

V

EN ,

V

FLG

Enable Voltage 6.5 V

I

LOAD

Maximum Continuous Load Current Internal Limited A

T

J(MAX)

Maximum Junction Temperature +150 °C

T

ST

Storage Temperature Range (Note 4) -65 to +150 °C

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be

affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling

and transporting these devices

Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified

T

ST

from -65°C to +150°C).

Recommended Operating Conditions

(@T

A

= +25°C, unless otherwise specified.)

Symbol

Parameter

Min

Max

Units

V

IN

Input Voltage 2.7 5.5 V

I

OUT

Output Current 0 1.5 A

T

A

Operating Ambient Temperature -40 +85 °C

V

IH

High-Level Input Voltage on EN or

EN

2.0 V

IN

V

IL

Low-Level Input Voltage on EN or

EN

0 0.8 V

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

4 of 17

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March 2015

AP2181/ AP2191

Electrical Characteristics

(@T

A

= +25°C, VIN = +5V, unless otherwise specified.)

Symbol Parameter Test Conditions Min Typ Max Unit

V

UVLO

Input UVLO R

LOAD

= 1kΩ 1.6 1.9 2.5 V

I

SHDN

Input Shutdown Current Disabled, I

OUT

= 0 — 0.5 1 µA

I

Q

Input Quiescent Current Enabled, I

OUT

= 0 — 45 70 µA

I

LEAK

Input Leakage Current Disabled, OUT grounded — — 1 µA

I

REV

Reverse Leakage Current Disabled, V

IN

= 0V, V

OUT

= 5V, I

REV

at V

IN

— 1 — µA

R

DS(ON)

Switch On-Resistance

V

IN

= 5V,

I

OUT

= 1.5A

T

A

= +25°C SOT25, MSOP-8EP, SO-8 — 95 115

mΩ

U-DFN2018-6 — 90 110

-40°C ≤ T

A

≤ +85°C — — 140

V

IN

= 3.3V,

I

OUT

= 1.5A

T

A

= +25°C — 120 140

-40°C ≤ T

A

≤ +85°C — — 170

I

SHORT

Short-Circuit Current Limit Enabled into short circuit, C

L

= 100µF — 2.0 — A

I

LIMIT

Over-Load Current Limit V

IN

= 5V, V

OUT

= 4.5V, C

L

= 120µF, -40°C ≤ T

A

≤ +85°C 1.6 2.1 2.6 A

I

Trig

Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) , C

L

= 100µF — 2.6 — A

V

IL

EN Input Logic Low Voltage V

IN

= 2.7V to 5.5V — — 0.8 V

V

IH

EN Input Logic High Voltage V

IN

= 2.7V to 5.5V 2 — — V

I

SINK

EN Input Leakage V

EN

= 5V — — 1 µA

T

D(ON)

Output Turn-On Delay Time C

L

= 1µF, R

LOAD

= 10Ω — 0.05 — ms

T

R

Output Turn-On Rise Time C

L

= 1µF, R

LOAD

= 10Ω — 0.6 1.5 ms

T

D(OFF)

Output Turn-Off Delay Time C

L

= 1µF, R

LOAD

= 10Ω — 0.01 — ms

T

F

Output Turn-Off Fall Time C

L

= 1µF, R

LOAD

= 10Ω — 0.05 0.1 ms

R

FLG

FLG Output FET On-Resistance I

FLG

= 10mA, C

L

= 100µF — 20 40 Ω

T

Blank

FLG Blanking Time C

IN

= 10µF, C

L

= 100µF 4 7 15 ms

T

SHDN

Thermal Shutdown Threshold Enabled, R

LOAD

= 1kΩ — +140 — °C

T

HYS

Thermal Shutdown Hysteresis — — +25 — °C

θ

JA

Thermal Resistance Junction-to-

Ambient

SO-8 (Note 5) — 110 — °C/W

MSOP-8EP (Note 6) — 60 — °C/W

SOT25 (Note 7) — 157 — °C/W

U-DFN2018-6 (Note 8) — 70 — °C/W

Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.

6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and

thermal vias to bottom layer ground plane.

7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.

8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom

layer 1.0”x1.4” ground plane.

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

5 of 17

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March 2015

AP2181/ AP2191

Typical Performance Characteristics

V

VV

V

EN

ENEN

EN

90

9090

90%

%%

%

V

VV

V

OUT

OUTOUT

OUT

T

TT

T

D

DD

D(

((

(ON

ONON

ON)

))

)

10

1010

10%

%%

%

T

TT

T

D

DD

D(

((

(OFF

OFFOFF

OFF)

))

)

50

5050

50%

%%

%50

5050

50%

%%

%

T

TT

T

R

RR

R

10

1010

10%

%%

%

90

9090

90%

%%

%

T

TT

T

F

FF

F

V

VV

V

EN

ENEN

EN

90

9090

90%

%%

%

V

VV

V

OUT

OUTOUT

OUT

T

TT

T

D

DD

D(

((

(ON

ONON

ON)

))

)

10

1010

10%

%%

%

T

TT

T

D

DD

D(

((

(OFF

OFFOFF

OFF)

))

)

50

5050

50%

%%

%50

5050

50%

%%

%

T

TT

T

R

RR

R

10

1010

10%

%%

%

90

9090

90%

%%

%

T

TT

T

F

FF

F

Figure 1 Voltage Waveforms: AP2181 (left), AP2191 (right)

All Enable Plots are for AP2191 Active High

Turn-On Delay and Rise Time

400µs/div

Turn-Off Delay and Fall Time

400µs/div

Turn-On Delay and Rise Time

400µs/div

Turn-Off Delay and Fall Time

400µs/div

Vout

2V/div

Ven

5V/div

CL = 1µF

TA = +25°C

RL = 5

Ω

Vout

2V/div

Ven

5V/div

CL = 1µF

TA = +25°C

RL = 5

Ω

Vout

2V/div

Ven

5V/div

CL = 100µF

TA = +25°C

RL = 5

Ω

Vout

2V/div

Ven

5V/div

CL = 100µF

TA = +25°C

RL = 5

Ω

AP2181/ AP2191 ——J v —" ’ . n e V .—.—..—— a: t _ — : ;.____......_..______._.______ w H ‘l ‘ ._._.___—. __ V — —_.3 On "9 a- 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

6 of 17

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March 2015

AP2181/ AP2191

Typical Performance Characteristics

(continued)

Short Circuit Current,

Device Enabled Into Short

500µs/div

Inrush Current

1ms/div

0.6

Ω Load Connected to Enabled Device

2ms/div

Short Circuit with Blanking Time and Recovery

20ms/div

Power On

1ms/div

UVLO Increasing

1ms/div

Iout

1A/div

Vflag

2V/div

VIN = 5V

TA = +25°C

CL = 100µF

TA = +25°C

CL = 68µF

RL = 3.3

Ω

Iout

2A/div

Vout

5V/div

Vin

5V/div

Vflag

5V/div

VIN = 5V

TA = +25°C

CL = 100µF

Vflag

5V/div

Iout

500mA/div

Ven

5V/div

Vin

2V/div

Iout

500mA/div

TA = +25°C

CL = 68µF

RL = 3.3

Ω

Iout

500mA/div

Ven

5V/div

VIN = 5V

TA = +25°C

CL = 100µF

Iout

500mA/div

Ven

5V/div

V

IN

= 5V

T

A

= +25°C

R

L

= 3.3

Ω

C

L

= 470uF

C

L

= 220uF

C

L

= 100uF

x AP2181/ AP2191 / n = .251: u = .25c n = .251: i 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

7 of 17

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March 2015

AP2181/ AP2191

Typical Performance Characteristics

(cont.)

UVLO Decreasing

10ms/div

Current Limit Response vs Peak Current

0

5

10

15

20

25

30

35

40

45

0 2 4 6 8 10 12

Peak Current (A)

Current Limit Response (us)

Turn-On Time vs Input Voltage

250

350

450

550

650

750

850

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

Turn-On Time (us)

Turn-Off Time vs Input Voltage

25

30

35

40

45

50

55

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

Turn-Off Time (us)

Rise Time vs Input Voltage

300

350

400

450

500

550

600

650

2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

Rise Time (us)

Fall Time vs Input Voltage

19

20

21

22

23

24

25

2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

Fall Time (us)

CL = 1µF

RL =10

Ω

T

A

= +25°C

CL = 1µF

RL = 10

Ω

T

A

= +25°C

CL = 1µF

RL = 10

Ω

TA = +25°C

CL = 1µF

RL = 10

Ω

T

A

= +25°C

Iout

500mA/div

Vin

2V/div

TA = +25°C

CL = 68µF

RL = 3.3

Ω

VIN = 5V

T

A

= +25°C

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

8 of 17

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March 2015

AP2181/ AP2191

Typical Performance Characteristics

(cont.)

Supply Current, Output Enabled vs Ambient Temperature

27

32

37

42

47

52

-60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Supply Current, Output Enabled (uA)

Supply Current, Output Disabled vs Ambient Temperature

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Supply Current, Output Disabled (uA)

Static Drain-Source On-State Resistance vs Ambient

Temperature

80

90

100

110

120

130

140

150

160

170

180

-60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Static Drain-Source On-State

Resistance (mΩ)

Short-Circuit Output Current vs Ambient Temperature

2.00

2.10

2.20

2.30

2.40

2.50

2.60

-60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Short-Circuit Output Current (A)

Undervoltage Lockout vs Ambient Temperature

1.90

1.95

2.00

2.05

2.10

2.15

-60 -40 -20 0 20 40 60 80 100

Ambient Temperature (°C)

Undervoltage Lockout (V)

Threshold Trip Current vs Input Voltage

3.08

3.10

3.12

3.14

3.16

3.18

3.20

3.22

3.24

2.8 3.3 3.8 4.3 4.8 5.3

Input Voltage (V)

Threshold Trip Current (A)

UVLO Falling

UVLO Rising

Vin = 2.7V

Vin = 3.3V

Vin = 5V

Vin = 2.7V

Vin = 3.3V

Vin = 5.0V

Vin = 5.5V

TA = +25°C

C

L

= 68µF

CL = 100uF

Vin = 2.7V

Vin = 5.0V

Vin = 3.3V

Vin = 5.5V

Vin = 5.0V

Vin = 5.5V

Vin = 3.3V

Vin = 2.7V

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

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March 2015

AP2181/ AP2191

Application Information

Power Supply Considerations

A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value

electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces

power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves

the immunity of the device to short-circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series

resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output

voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN

has been applied. The AP2181/AP2191 senses the short circuit and immediately clamps output current to a certain safe level namely I

LIMIT

.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may

flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current

trip threshold), the device switches into current limiting mode and the current is clamped at I

LIMIT

.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the

current-limit threshold (I

TRIG

) is reached or until the thermal limit of the device is exceeded. The AP2181/AP2191 is capable of delivering current up

to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode

and is set at I

LIMIT

.

Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the output

pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that

capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature

characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic

capacitor type is Panasonic FC series.

FLG Response

When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms

deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive

load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.

The AP2181/AP2191 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating

ambient temperature (T

A

) and R

DS(ON)

, the power dissipation can be calculated by:

P

D

= R

DS(ON)

× I

2

Finally, calculate the junction temperature:

T

J

= P

D

x R

θ

JA

+ T

A

Where:

T

A

= Ambient temperature °C

R

θ

JA

= Thermal resistance

P

D

= Total power dissipation

Thermal Protection

Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The

AP2181/AP2191 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die

temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense

circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the

device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input

power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.

AP2181/ AP2191 Downstream Power Supply USB Pans 3.3V 5V D _ + _ D- AP2181 2.3 W OUT I %ﬂ.1u 1: 20.»? GND USB Conlro‘ EN GND 0.1UF 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

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March 2015

AP2181/ AP2191

Application Information

(continued)

Under-Voltage Lockout (UVLO)

The under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,

even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the

design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Host/Self-Powered HUBs

Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This

power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts

and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop

PCs, monitors, printers, and stand-alone hubs.

Figure 2 Typical One-Port USB Host / Self-Powered Hub

Generic Hot-Plug Applications

In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug

applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most

effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a

power supply normally turns on. Due to the controlled rise times and fall times of the AP2181/AP2191, these devices can be used to provide a

softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2181/AP2191 also ensures that the switch is off

after the card has been removed, and that the switch is off during the next insertion.

By placing the AP2181/AP2191 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The

typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system

surge current and provides a hot-plugging mechanism for any device.

Dual-Purpose Port Applications

AP2181/AP2191 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the

host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of a non-recommended

application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a

smartphone or tablet while maintaining a charge to the smartphone or tablet battery. If a voltage is maintained across the output of the

AP2181/AP2191 when the output is disabled and the Vin of the device is subsequently ramped up, an overstress condition to the AP2181/AP2191

may result.

1Q @ 73 @ AP2181/ AP2191 APZ1X1XXG -x t—T.—1;|_T 1% Ell-Ha chmnsl Puck-gs Ere-n Pucklng 8 : Active Law 1 :1 annual W: 90125 G : Guam 7: 7' Tap-R- Rpal I : AmivaHigh S : 30-8 13:13“ Taps I: Raul HF : MMP-GEP FM : U-DFN201 3-6 W W W W 4773!: 4 F7 x » HQ—W ﬂ 0~ ﬂmxx M 52:52 ' x U U U U W W W W %*3H1M:6Y ‘ , 1XX ﬂ weekt Zrepresens :- I: I: I: 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

Ordering Information

Part Number Package Code

AP21X1WG-7 W

AP21X1SG-13 S

AP21X1MPG-13 MP

AP21X1FMG-7 FM

Marking Information

(1) SO-8

Part Number

Logo

8 : Active Low

9 : Active High

(2) MSOP-8EP

Part Number

Logo

8 : Active Low

9 : Active High

11 of 17

www.diodes.com

Packaging 7”/

13” Tape and Reel

Quantity

SOT25 3,000/Tape & Reel

SO-8 2,500/Tape & Reel

MSOP-8EP 2,500/Tape & Reel

U-DFN2018-6 3,000/Tape & Reel

AP

AP AP

AP21

2121

21X

XX

X

XX

X

(

( (

( Top view

Top view Top view

Top view )

))

)

YY

YYYY

YY

WW

WWWW

WW

X

XX

X

XX

X

WW : Week : 01~52;

52

YY : Year : 08, 09,10

~

G : Green

X : Internal Code

8 7 6 5

12 3 4

1 : 1 Channel

represents 52 and 53

AP21X X

( Top view )

Y W X E

Y : Year : 0~9

A~Z : Green

8 7 6 5

12 3 4

1 : 1 Channel

a~z : 27~52 week;

z represents

W : Week : A~Z : 1~26

week

52 and 53 week

MSOP-8L-EP

March 2015

AP2181/ AP2191

13” Tape and Reel

Part Number Suffix

-7

-13

-7

52

~

week

z represents

week

;

AP2181/ AP2191 W W a I 2§2S II !! 2S M! Li Ll |_l , (Top View) ﬂ . Identiﬁcanon Code H X ' Year ' 0~9 1V1! ﬂ'Week'A~Z'1~25week; - a~z . 27~52 week, 2 represents 52 and 53 week X ' A~Z ' Green 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

12 of 17

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March 2015

AP2181/ AP2191

Marking Information

(continued)

(3) SOT25

1 2 3

5

7

4

XX Y W X

XX : Identification code

W : Week : A~Z : 1~26 week;

X : A~Z : Green

( Top View )

Y : Year 0~9

a~z : 27~52 week; z represents

52 and 53 week

Device Package type Identification Code

AP2181W SOT25 HX

AP2191W SOT25 HY

(4) U-DFN2018-6

Device Package type Identification Code

AP2181FM U-DFN2018-6 HX

AP2191FM U-DFN2018-6 HY

AP2181/ AP2191 Damn ‘A‘ 0 J i Gauge mane ‘ Wang 7 L Detail C Fc L: 51 , f See new 0 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

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March 2015

AP2181/ AP2191

Package Outline Dimensions

(All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.

(1) Package Type: SO-8

(2) Package Type: MSOP-8EP

SO

-

8

Dim

Min

Max

A

- 1.75

A1

0.10 0.20

A2

1.30 1.50

A3

0.15 0.25

b

0.3 0.5

D

4.85 4.95

E

5.90 6.10

E1

3.85 3.95

e

1.27 Typ

h

- 0.35

L

0.62 0.82

θ

θθ

θ

0

°

8

°

All Dimensions in mm

MSOP

-

8EP

Dim

Min

Max

Typ

A

- 1.10 -

A1

0.05 0.15 0.10

A2

0.75 0.95 0.86

A3

0.29 0.49 0.39

b

0.22 0.38 0.30

c

0.08 0.23 0.15

D

2.90 3.10 3.00

D1

1.60 2.00 1.80

E

4.70 5.10 4.90

E1

2.90 3.10 3.00

E2

1.30 1.70 1.50

E3

2.85 3.05 2.95

e

- - 0.65

L

0.40 0.80 0.60

a

0° 8° 4°

x

- - 0.750

y

- - 0.750

All Dimensions in mm

Gauge Plane

Seating Plane

Detail ‘A’

E

E1

h

L

D

eb

A2

A1

A

45

°

7

°~

9

°

A3

0.254

1

D

A

A1

A2

E

e

y

x

Seating Plane

Gauge Plane

L

D

8Xb

See Detail C

Detail C

c

a

E1

E3

A3

E2

4

X

1

0

°

4

X

1

0

°

0

.

2

5

D1

AP2181/ AP2191 *Ik__ HEIEI I? L ,1 u- N2018- + + m n ax A 545 605 575 D 750 875 D2 E V41 4: T 1: ail +94,+ 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

14 of 17

www.diodes.com

March 2015

AP2181/ AP2191

Package Outline Dimensions

(All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.

(3) Package Type: SOT25

(4) Package Type: U-DFN2018-6

SOT25

Dim

Min

Max

Typ

A

0.35 0.50

0.38

B

1.50 1.70

1.60

C

2.70 3.00

2.80

D



0.95

H

2.90 3.10

3.00

J

0.013

0.10

0.05

K

1.00 1.30

1.10

L

0.35 0.55

0.40

M

0.10 0.20

0.15

N

0.70 0.80

0.75

α

αα

α

0° 8°



All Dimensions in mm

U

-

DFN2018

-

6

Dim

Min

Max

Typ

A

0.545

0.605

0.575

A1

0 0.05

0.02

A3



0.13

b

0.15

0.25

0.20

D

1.750

1.875

1.80

D2

1.30

1.50

1.40

e



0.50

E

1.95

2.075

2.00

E2

0.90

1.10

1.00

L

0.20

0.30

0.25

z



0.30

All Dimensions in mm

A

M

J

L

D

B C

H

KN

SEATING PLANE

EE2

L

A

D

D2

A3

A1

e

b

Pin#1 ID

z

AP2181/ AP2191 I+++I T T 4_+ +—l— |<>I

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

15 of 17

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March 2015

AP2181/ AP2191

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package Type: SO-8

(2) Package Type: MSOP-8EP

(3) Package Type: SOT25

Dimensions

Value (in mm)

X

0.60

Y

1.55

C1

5.4

C2

1.27

Dimensions

Value

(in mm)

C

0.650

G

0.450

X

0.450

X1

2.000

Y

1.350

Y1

1.700

Y2

5.300

Dimensions

Value (in mm)

Z

3.20

G

1.60

X

0.55

Y

0.80

C1 2.40

C2

0.95

X

C1

C2

Y

G

X

C

Y

Y2

Y

1

X1

X

Z

Y

C1

C2C2

G

» AP2181/ AP2191 Top cover age thickness Embossed tamer 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

16 of 17

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March 2015

AP2181/ AP2191

Suggested Pad Layout

(continued)

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(4) Package Type: U-DFN2018-6

Taping Orientation

For U-DFN2018-6

Notes: 9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.

Dimensions

Value (in mm)

C

0.50

G

0.20

X

0.25

X1

1.60

Y

0.35

Y1

1.20

Y

X

C

X1

G

Y1

AP2181/ AP2191 2015

AP2181/ AP2191

Document number: DS31563 Rev. 8 - 2

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March 2015

AP2181/ AP2191

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

Datenblatt für AP2181,91 von Diodes Incorporated

INFORMATION

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