Datenblatt für MCP9600/L00/RL00 von Microchip Technology

6‘ MICRDCHIP “U
2015-2019 Microchip Technology Inc. DS20005426F-page 1
MCP960X/L0X/RL0X
Features
Thermocouple Electromotive Force (EMF) to °C
Converter:
- Integrated cold-junction compensation
- Integrated thermocouple open-circuit and
short-circuit detection
Supported Types (designated by NIST ITS-90):
- Type K, J, T, N, S, E, B and R
Sensor Accuracy for Thermocouple Hot-Junction:
- MCP9600/01 ±0.5°C/±1.5°C (typ./max.)
- MCP96L00/L01 ±2.0°C/±4.0°C (typ./max.)
- MCP96RL00/RL01 ±4.0°C/±8.0°C (typ./max.)
Measurement Resolution:
- Hot and cold-junctions: +0.0625°C (typical)
Four Programmable Temperature Alert Outputs:
- Monitor hot or cold-junction temperatures
- Detect rising or falling temperatures
- Up to 255°C of programmable hysteresis
Programmable Digital Filter for Temperature
•Low Power:
- Shutdown mode
- Burst mode: 1 to 128 temperature samples
2-Wire Interface: I2C Compatible, 100 kHz:
- Supports eight devices per I2C Bus
Operating Voltage Range: 2.7V to 5.5V
Operating Current: 300 µA (typical)
Shutdown Current: 2 µA (typical)
Package: 20-Lead MQFN
Typical Applications
Petrochemical Thermal Management
Hand-Held Measurement Equipment
Industrial Equipment Thermal Management
Commercial and Industrial Ovens
Industrial Engine Thermal Monitor
Temperature Detection Racks
Description
The Microchip Technology Inc. MCP960X/L0X/RL0X
converts thermocouple EMF to degree Celsius with
integrated cold-junction compensation. The
temperature correction coefficients are derived from
the National Institute of Standards and Technology
(NIST) ITS-90 Thermocouple Database. The
MCP9600/01 corrects the thermocouple nonlinear
error characteristics of eight thermocouple types and
outputs ±0.5°C/±1.5°C (Typ./Max.).
The MCP960X/L0X/RL0X digital temperature sensor
comes with user-programmable registers which
provide design flexibility for various temperature
sensing applications. The registers allow
user-selectable settings, such as Low-Power modes
for battery powered applications, adjustable digital filter
for fast transient temperatures and four individually
programmable temperature alert outputs which can be
used to detect multiple temperature zones.
In addition, the MCP9601/L01/RL01 family provides
integrated Thermocouple open-circuit and short-circuit
detection features. An alert signal is asserted when the
thermocouple wire is broken or disconnected. Similarly,
alert signal is asserted when the Thermocouple is
shorted to ground or power.
The temperature alert limits have multiple
user-programmable configurations, such as alert
polarity as either an active-low or active-high push-pull
output, and output function as a Comparator mode
(useful for thermostat-type operation) or Interrupt mode
for microprocessor-based systems. In addition, the
alerts can detect either a rising or a falling temperature
with up to +255°C hysteresis.
This sensor uses an industry standard 2-wire, I2C
compatible serial interface and supports up to eight
devices per bus by setting the device address using the
ADDR pin.
MCP9600/L00/RL00
V
DD
PIC
®
MCU
I
2
C
Alert
4
GND
Types K, J, T,
N, E, B, S, R
V
IN+
V
IN-
T
C+
T
C-
ADDR
Thermocouple EMF to Temperature Converter,
±1.5°C Maximum Accuracy
2015-2019 Microchip Technology Inc. DS20005426F-page 2
MCP960X/L0X/RL0X
Package Types
MCP960X/L0X/RL0X Block Diagram
MCP9600/L00/RL00
5 mm × 5 mm MQFN*
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2
GND
VIN-
GND Alert 4
Alert 3
GND
GND
GND
VDD
GND
Alert 2
SDA
SCL
GND
GND
VIN+
EP
20
1
19 18 17
3
4
15
14
13
12
6789
21
5
10
11
16
GND
GND
Alert 1
ADDR
2
GND
VIN-
GND Alert 4
Alert 3
VSENSE
GND
SC Alert
VDD
OC Alert
Alert 2
SDA
SCL
GND
GND
VIN+
EP
20
1
19 18 17
3
4
15
14
13
12
6789
21
5
10
11
16
GND
GND
Alert 1
ADDR
MCP9601/L01/RL01
5 mm × 5 mm MQFN*
ADC Core
Del Sig
+VIN+
VIN-
Error Correction
User Registers
Device Resolution + Power Modes
Thermocouple Hot-Junction TH
Alert Registers Alert 1 Output
Alert 2 Output
Alert 3 Output
Alert 4 Output
Hysteresis Registers
Device ID
SCL
SDA
ADDR
Open Circuit Alert
Short Circuit Alert
VSENSE
MCP9601/L01/RL01
Only
Open Circuit
& Short Circuit
Detection
Thermocouple
Type Selection
Digital Filter
Alert Config. Registers
Sensor Status
Sensor Configuration
Junctions Delta Temperature T
Thermocouple Cold-Junction TC
I2C Module
2015-2019 Microchip Technology Inc. DS20005426F-page 3
MCP960X/L0X/RL0X
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VDD............................................................................................................................................................................ 6.0V
Voltage at All Input/Output Pins ........................................................................................................ GND – 0.3V to 6.0V
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
Junction Temperature (TJ) .................................................................................................................................... +150°C
ESD Protection on All Pins (HBM:MM) .......................................................................................................... (4 kV:300V)
Latch-up Current at Each Pin............................................................................................................................. ±100 mA
†Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA= -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Thermocouple Sensor Measurement Accuracy — MCP9600/01
TH Hot-Junction Accuracy (VDD =3.3V)
TH=T
C+T
(Note 1)
TH_ACY -1.5 ±0.5 +1.5 °C TA= 0°C to +85°C,
-3.0 ±1 +3.0 TA = -40°C to +125°C
TC Cold-Junction Accuracy (VDD =3.3V) T
C_ACY -1.0 ±0.5 +1.0 °C TA = 0°C to +85°C
-2.0 ±1 +2.0 TA = -40°C to +125°C
T Junctions Temperature Delta Accuracy — MCP9600/01
Type K: T= -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV
T_ACY -0.5 ±0.25 +0.5 °C TA= 0°C to +85°C,
VDD =3.3V (Note 2)
Type J: T = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: T = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: T = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: T = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mV
Type S: T = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
TA=0°C to +85°C,
VDD =3.3V
(Notes 2, Note 3)
Type B: T = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV
Type R: T = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
Note 1
The T
C
and T
summation is implemented in milli-volt (mV) domain. The result, T
H
(mV), is converted to Degree
Celsius using the NIST ITS-90 Conversion database.
2The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature differ-
ence between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C.
3
The device measures temperature below the specified range, however, the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226 mV
EMF
and -0.235 mV
EMF
, respectively.
Type B measures down to 500°C or 1.242 mV
EMF
(see Figures 2-7,2-8,2-10,2-11,2-14 and 2-17).
4
Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
2015-2019 Microchip Technology Inc. DS20005426F-page 4
MCP960X/L0X/RL0X
Thermocouple Sensor Measurement Accuracy — MCP96L00/L01
TH Hot-Junction Accuracy (VDD =3.3V)
TH=T
C+T
(Note 1)
TH_ACY -4.0 ±2 +4.0 °C TA= 0°C to +85°C,
-6.0 ±4 +6.0 TA = -40°C to +125°C
TC Cold-Junction Accuracy (VDD =3.3V) T
C_ACY -1.0 ±0.5 +1.0 °C TA = 0°C to +85°C
-2.0 ±1 +2.0 TA = -40°C to +125°C
T Junctions Temperature Delta Accuracy — MCP96L00/L01
Type K: T= -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV
T_ACY -3.0 ±1.5 +3.0 °C TA= 0°C to +85°C,
VDD =3.3V (Note 2)
Type J: T = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: T = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: T = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: T = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mV
Type S: T = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
TA=0°C to +85°C,
VDD =3.3V
(Notes 2, Note 3)
Type B: T = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV
Type R: T = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA= -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Note 1
The T
C
and T
summation is implemented in milli-volt (mV) domain. The result, T
H
(mV), is converted to Degree
Celsius using the NIST ITS-90 Conversion database.
2The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature differ-
ence between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C.
3
The device measures temperature below the specified range, however, the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226 mV
EMF
and -0.235 mV
EMF
, respectively.
Type B measures down to 500°C or 1.242 mV
EMF
(see Figures 2-7,2-8,2-10,2-11,2-14 and 2-17).
4
Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
TA Junctions Temperature Delta Accuracy — MCP 98RLO0I01
2015-2019 Microchip Technology Inc. DS20005426F-page 5
MCP960X/L0X/RL0X
Thermocouple Sensor Measurement Accuracy — MCP96RL00/01
TH Hot-Junction Accuracy (VDD =3.3V)
TH=T
C+T
(Note 1)
TH_ACY -8.0 ±4 +8.0 °C TA= 0°C to +85°C,
-10.0 ±6 +10.0 TA = -40°C to +125°C
TC Cold-Junction Accuracy (VDD =3.3V) T
C_ACY -2.0 ±1 +2.0 °C TA = -40°C to +125°C
T Junctions Temperature Delta Accuracy — MCP96RL00/01
Type K: T= -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV
T_ACY -6.0 ±3.0 +6.0 °C TA= 0°C to +85°C,
VDD =3.3V (Note 2)
Type J: T = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: T = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: T = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: T = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mV
Type S: T = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
TA=0°C to +85°C,
VDD =3.3V
(Notes 2, Note 3)
Type B: T = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV
Type R: T = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA= -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Note 1
The T
C
and T
summation is implemented in milli-volt (mV) domain. The result, T
H
(mV), is converted to Degree
Celsius using the NIST ITS-90 Conversion database.
2The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature differ-
ence between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C.
3
The device measures temperature below the specified range, however, the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226 mV
EMF
and -0.235 mV
EMF
, respectively.
Type B measures down to 500°C or 1.242 mV
EMF
(see Figures 2-7,2-8,2-10,2-11,2-14 and 2-17).
4
Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
2015-2019 Microchip Technology Inc. DS20005426F-page 6
MCP960X/L0X/RL0X
Sensor Characteristics
TC and TH Temperature Resolution TRES ±0.0625 °C With max. resolution
Sampling Rate (TA=+25°C) t
CONV —320—
ms
18-bit resolution
80 16-bit resolution
20 14-bit resolution
5 12-bit resolution
Temperature Calculation Time tCALC —12msT
A=+25°C
Thermocouple Input
Offset Error
V
OERR
—±2—µV
Offset Error Drift
V
OE_DR
—50—nV/°C
Full-Scale Gain Error — MCP9600/01
G
ERR
——±0.04
%FS
TA= 0°C to +85°C
Full-Scale Gain Error — MCP96L00/L01 ±0.12 TA= -40°C to +125°C
Full-Scale Gain Error — MCP96RL00/RL01 ±0.24
Full-Scale Gain Error Drift
G
ER_DR
±0.01 — %FS
Full-Scale Integral Nonlinearity INL 10 ppm
Voltage Resolution VRES 2 µV 18-bit resolution
Differential Mode Range VIN_DF -250 +250 mV ADC input range
Differential Mode Impedance ZIN_DF 300 — k
Common-Mode Range VIN_CM VDD – 0.3 VDD + 0.3 V (Note 4)
Common-Mode Impedance ZIN_CM —25—M
Common-Mode Rejection Ratio CMRR 105 dB
Power Supply Rejection Ratio PSRR 60 dB
Line Regulation VLine_R —0.2—°C/V
Voltage Sense Input (VSENSE) for Thermocouple Open and Short-Circuit Detection (MCP9601/L01/RL01)
VSENSE Input Range VSiRNG 0—100
%VDD
(see Figure 1-1)
- Range: Short Circuit to VDD VSiSC 90 100 SC Alert asserts
- Range: Short Circuit to GND 0 10
- Range: Open Circuit VSiOC 58 75 OC Alert asserts
- Range: Normal Operation VSiNOR 40 58 OC Alert deasserts
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA= -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Note 1
The T
C
and T
summation is implemented in milli-volt (mV) domain. The result, T
H
(mV), is converted to Degree
Celsius using the NIST ITS-90 Conversion database.
2The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature differ-
ence between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C.
3
The device measures temperature below the specified range, however, the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226 mV
EMF
and -0.235 mV
EMF
, respectively.
Type B measures down to 500°C or 1.242 mV
EMF
(see Figures 2-7,2-8,2-10,2-11,2-14 and 2-17).
4
Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
+
2015-2019 Microchip Technology Inc. DS20005426F-page 7
MCP960X/L0X/RL0X
FIGURE 1-1: Open and Short Circuit Detection Configuration.
VSENSE Input Leakage ISiLEAK —0.1 1µA
Alert 1, 2, 3, 4 Outputs, SC Alert and OC Alert Outputs (MCP9601/L01/RL01)
Low-Level Voltage VOL ——0.4VI
OL= 3 mA
High-Level Voltage VOH
V
DD
– 0.5
——VI
OH= 3 mA
Operating Voltage and Current
Operating Voltage VDD 2.7 5.5 V
I2C Inactive Current IDD —0.30.5mAV
DD = 3.3V,
TA = +85°C
I2C Active Current or During tCALC —1.52.5mA
Shutdown Current ISHDN —2 5µAI
2C inactive,
TA = +85°C
Power-on Reset (POR) Thresholds VPOR 1.0 2.1 2.6 V Rising/Falling VDD
Thermal Response
Package Thermal Response
(Time to 63% of Final Temperature)
tRSP 3 s +25°C (air) to +125°C
(oil bath), 2x2” PCB
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA= -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Note 1
The T
C
and T
summation is implemented in milli-volt (mV) domain. The result, T
H
(mV), is converted to Degree
Celsius using the NIST ITS-90 Conversion database.
2The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature differ-
ence between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C.
3
The device measures temperature below the specified range, however, the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226 mV
EMF
and -0.235 mV
EMF
, respectively.
Type B measures down to 500°C or 1.242 mV
EMF
(see Figures 2-7,2-8,2-10,2-11,2-14 and 2-17).
4
Exceeding the V
IN_CM
input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
Del Sig
VIN+
VIN-
MCP9601/L01/RL01
Thermocouple
+
RA
RB
RB
Where:
RA=1 M ± 5% Tolerance (Max.)
RB=2 M ± 20% Range
C=0.1 µF
VDD
VSENSE
C
2015-2019 Microchip Technology Inc. DS20005426F-page 8
MCP960X/L0X/RL0X
INPUT/OUTPUT PIN DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C
(where: TA=T
C, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Units Conditions
Serial Input/Output and I2C Slave Address Input (ADDR)
Input (SCL, SDA, ADDR)
High-Level Voltage VIH 0.7 × VDD ——V
Low-Level Voltage VIL ——0.3 × V
DD V
Input Current ILEAK —— ±2µA
Hysteresis VHYST 0.05 × VDD —VV
DD > 2V
Spike Suppression TSP —50 —ns
Output (SDA)
Low-Level Voltage VOL ——0.4VI
OL= 3 mA
High-Level Current (leakage) IOH —— 1µAV
OH = VDD
Low-Level Current IOL 6——mAV
OL = 0.6V
Capacitance CIN —5 —pF
I2C Slave Address Selection Levels (Note 1)
Command Byte [1100 000x]V
ADDR GND V Address = 0
Command Byte [1100 001x]V
ADDR_L
(Note 2)
VADDR_TYP
(Note 2)
VADDR_H
(Note 2)
Address = 1
Command Byte [1100 010x]Address = 2
Command Byte [1100 011x]Address = 3
Command Byte [1100 100x]Address = 4
Command Byte [1100 101x]Address = 5
Command Byte [1100 110x]Address = 6
Command Byte [1100 111x]—V
DD Address = 7
Note 1 The ADDR pin can be tied to VDD or VSS. For additional slave addresses, a resistive divider network can
be used to set voltage levels that are rationed to VDD. The device supports up to eight levels (see
Section 6.3.1 “I2C Addressing” for recommended resistor values).
2VADDR_TYP =Address * V
DD/8 + VDD/16,
VADDR_L =V
ADDR_TYP –V
DD/32 and
VADDR_H =V
ADDR_TYP +V
DD/32 (where: Address = 1, 2, 3, 4, 5, 6).
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 +125 °C (Note 1)
Operating Temperature Range TA-40 — +125 °C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, MQFN JA — 38.8 — °C/W
Note 1 Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).
2015-2019 Microchip Technology Inc. DS20005426F-page 9
MCP960X/L0X/RL0X
FIGURE 1-2: Timing Diagram.
SENSOR SERIAL INTERFACE TIMING SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, GND = Ground, TA= -40°C to +125°C, VDD = 2.7V to 5.5V
and CL=80pF (Note 1).
Parameters Sym. Min. Max. Units
2-Wire I2C Interface
Serial Port Frequency fSCL 10 100 kHz
Low Clock (Note 2)tLOW 4700 — ns
High Clock tHIGH 4000 — ns
Rise Time (Note 3)tR 1000 ns
Fall Time (Note 3)tF20 300 ns
Data in Setup Time (Note 2) t
SU:DAT 250 — ns
Data in Hold Time tHD:DAT 0—ns
Start Condition Setup Time tSU:STA 4700 — ns
Start Condition Hold Time tHD:STA 4000 — ns
Stop Condition Setup Time tSU:STO 4000 — ns
Bus Idle/Free tB-FREE 10 — µs
Bus Capacitive Load Cb—400pf
Clock Stretching (Note 4)tSTRETCH 60 — µs
Note 1 All values referred to VIL MAX and VIH MIN levels.
2This device can be used in a Standard mode I2C bus system, but the requirement, tSU:DAT 250 ns, must
be met.
3Characterized, but not production tested.
4Master controllers without features to detect clock stretching by Slave devices, should reduce fSCL for
proper I2C communication for Read commands. See Figure 2-29 for a typical tSTRETCH performance.
t
SU-START
t
HD-START
t
SU-DATA
t
SU-STOP
t
B-FREE
SCL
SDA
t
HIGH
t
LOW
t
R
, t
F
Start Condition Data Transmission Stop Condition
t
HD-DI
t
STRETCH
ACK
IA Sensitivity (A
2015-2019 Microchip Technology Inc. DS20005426F-page 10
MCP960X/L0X/RL0X
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA= -40°C to +125°C.
FIGURE 2-1: Typical Temperature
Accuracy from NIST ITS-90 Database, Type K.
FIGURE 2-2: Typical Temperature
Accuracy from NIST ITS-90 Database, Type J.
FIGURE 2-3: Typical Temperature
Accuracy from NIST ITS-90 Database, Type N.
FIGURE 2-4: Temperature Sensitivity with
18-Bit Resolution, Type K.
FIGURE 2-5: Temperature Sensitivity with
18-Bit Resolution, Type J.
FIGURE 2-6: Temperature Sensitivity with
18-Bit Resolution, Type N.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
-0.50
-0.25
0.00
0.25
0.50
-200 300 800 1300 1800
Temperature Accuracy (°C)
TA(°C)
Type K
MCP9600
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0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type K
MCP9600/L00/RL00
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type J
MCP9600/L00/RL00
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type N
MCP9600/L00/RL00
n n <1 r.="" t.="" s="">
2015-2019 Microchip Technology Inc. DS20005426F-page 11
MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA= -40°C to +125°C.
FIGURE 2-7: Typical Temperature
Accuracy from NIST ITS-90 Database, Type S.
FIGURE 2-8: Typical Temperature
Accuracy from NIST ITS-90 Database, Type R.
FIGURE 2-9: Typical Temperature
Accuracy from NIST ITS-90 Database, Type E.
FIGURE 2-10: Temperature Sensitivity with
18-Bit Resolution, Type S.
FIGURE 2-11: Temperature Sensitivity with
18-Bit Resolution, Type R.
FIGURE 2-12: Temperature Sensitivity with
18-Bit Resolution, Type E.
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-0.50
-0.25
0.00
0.25
0.50
-200 300 800 1300 1800
Temperature Accuracy (°C)
TA(°C)
Type E
MCP9600
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type S
MCP9600/L00/RL00
Specified Range
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type R
MCP9600/L00/RL00
Specified Range
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type E
MCP9600/L00/RL00
(A
2015-2019 Microchip Technology Inc. DS20005426F-page 12
MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA= -40°C to +125°C.
FIGURE 2-13: Typical Temperature
Accuracy from NIST ITS-90 Database, Type T.
FIGURE 2-14: Typical Temperature
Accuracy from NIST ITS-90 Database, Type B.
FIGURE 2-15: Input Offset Error Voltage
(VIN+, VIN-).
FIGURE 2-16: Temperature Sensitivity with
18-Bit Resolution, Type T.
FIGURE 2-17: Temperature Sensitivity with
18-Bit Resolution, Type B.
FIGURE 2-18: Full-Scale Gain Error.
-0.50
-0.25
0.00
0.25
0.50
-200 300 800 1300 1800
Temperature Accuracy (°C)
TA(°C)
Type T
MCP9600
-0.50
-0.25
0.00
0.25
0.50
-200 300 800 1300 1800
Temperature Accuracy (°C)
TA(°C)
Type B
MCP9600
Specified Range
-10
-5
0
5
10
-40-20 0 20406080100120
Offset Error (µV)
Temperature (°C)
MCP9600
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type T
MCP9600/L00/RL00
0.000
0.250
0.500
-200 300 800 1300
1800
Sensitivity (''°C/LSb)
TA(°C)
Type B
MCP9600/L00/RL00
Specified Range
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
-40-200 20406080100120
Gain Error (% of FSR)
Temperature (°C)
VDD = 3.3V
MCP9600
Wm Tn \\ _ \ s\ \\\ \ E \
2015-2019 Microchip Technology Inc. DS20005426F-page 13
MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA= -40°C to +125°C.
FIGURE 2-19: Input Noise,% of Full Scale.
FIGURE 2-20: Cold-Junction Sensor
Temperature Accuracy.
FIGURE 2-21: SDA and Alert Outputs, VOL
Across VDD.
FIGURE 2-22: Integral Nonlinearity Across
VDD.
FIGURE 2-23: Cold-Junction Sensor
Temperature Accuracy Distribution.
FIGURE 2-24: Alert Outputs, VOH Across
VDD.
0.0
2.5
5.0
7.5
10.0
-100 -75 -50 -25 0 25 50 75 100
Noise (µV, rms)
Input Voltage (% of Full-Scale)
TA= +25°C
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0
100
200
300
400
2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
OL
(µA)
V
DD
(V)
-40C
35C
85C
125C
SDA, and Alert 1, 2, 3, 4 outputs
TA= +125°C
TA= -40°C
TA= +35°C
TA= +85°C
0.000
0.001
0.002
0.003
0.004
0.005
2.53.03.54.04.55.05.5
V
DD
(V)
Integral Nonlinearity
(% of FSR)
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100
200
300
400
500
2.53.03.54.04.55.05.5
VDD -V
OH (µA)
VDD (V)
-40C
35C
85C
125C
Alert 1, 2, 3, 4 outputs TA= -40°C
TA= +35°C
TA= +85°C
TA= +125°C
H\ll \ V — n — n: .3s~c
2015-2019 Microchip Technology Inc. DS20005426F-page 14
MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA= -40°C to +125°C.
FIGURE 2-25: I2C Inactive, IDD Across VDD.
FIGURE 2-26: I2C Active, IDD Across VDD.
FIGURE 2-27: Shutdown Current, ISHDN
Across VDD.
FIGURE 2-28: SDA, SCL and ADDR Input
Pins Leakage Current, ILEAK Across VDD.
FIGURE 2-29: I2C Interface Clock Stretch
Duration, tSTRETCH Across VDD.
FIGURE 2-30: Temperature Calculation
Duration, tCALC Change Across VDD.
100
200
300
400
500
2.5 3.0 3.5 4.0 4.5 5.0 5.5
I2C Inactive, IDD (µA)
VDD (V)
-40C
35C
85C
125C
TA= -40°C
TA= +35°C
TA= + 85°C
TA= +125°C
500
1000
1500
2000
2500
2.5 3.0 3.5 4.0 4.5 5.0 5.5
I2C Active, IDD (µA)
VDD (V)
-40C
35C
85C
125C
TA= -40°C
TA= +35°C
T
A
= + 85°C
TA= +125°C
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0.0
1.0
2.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
ILEAK (µA)
VDD (V)
-40C
35C
85C
125C
ADDR/SDA/SCL pins TA= -40°C
TA= +35°C
TA= +85°C
TA= +125°C
0.0
20.0
40.0
60.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
tSTRETCH (µs)
VDD (V)
-40C
35C
85C
125C
TA= -40°C
TA= +125°C
TA= +85°C
TA= +35°C
-2.0%
-1.0%
0.0%
1.0%
2.0%
2.5 3.0 3.5 4.0 4.5 5.0 5.5
ΔtCALC (%)
VDD (V)
-40C
35C
85C
125C
Conditions:
tCALC = 12ms (typical)
VDD = 3.3V
TA= Room Temperature
TA= -40°C
TA= +35°C
TA= + 85°C
TA= +125°C
2015-2019 Microchip Technology Inc. DS20005426F-page 15
MCP960X/L0X/RL0X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Tab l e 3 - 1.
3.1 Ground Pin (GND)
The GND pin is the system ground pin. Pins 1, 3, 5, 13
and 17 are system ground pins and they are at the
same potential. However, pins 6, 7, 9, 10 and 18 must
be connected to ground for normal operation.
3.2 Thermocouple Input (VIN+, VIN-)
The thermocouple wires are directly connected to
these inputs. The positive node is connected to the
VIN+ pin, while the negative node connects to the VIN-
node. The thermocouple voltage is converted to degree
Celsius.
3.3 Power Pin (VDD)
VDD is the power pin. The operating voltage range, as
specified in the DC Characteristics table, is applied on
this pin.
3.4 Push-Pull Alert Outputs
(Alert 1, 2, 3, 4 and OC/SC Alert)
The Alert pins are user-programmable push-pull outputs
which can be used to detect rising or falling
temperatures. The device outputs signal when the
ambient temperature exceeds the user-programmed
temperature alert limit.
The OC Alert and the SC Alert outputs are also
active-high push-pull outputs (MCP9601/L01/RL01).
These outputs are asserted when Open-Circuit and
Short-Circuit conditions are detected on the VSENSE pin.
3.5 I2C Slave Address Pin (ADDR)
This pin is used to set the I2C slave address. This pin
can be tied to VDD, GND, or a ratio of VDD can be
selected to set up to eight address levels using a
resistive voltage divider network.
3.6 Serial Clock Line (SCL)
The SCL is a clock input pin. All communication and
timing is relative to the signal on this pin. The clock is
generated by the host or master controller on the bus
(see Section 4.0 “Serial Communication”).
3.7 Serial Data Line (SDA)
SDA is a bidirectional input/output pin used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor (see Section 4.0 “Serial
Communication”).
3.8 Thermocouple Open/Short
Detection Input (VSENSE)
The VSENSE pin is a thermocouple detection input pin
(MCP9601/L01/RL01) and the voltage level on this pin
is used to determine whether the thermocouple is oper-
ating normally, shorted to VDD/VSS, or it is discon-
nected from the VIN+ and VIN- pins (see Figure 1-1).
TABLE 3-1: PIN FUNCTION TABLE
MCP9600/L00/RL00 MCP9601/L01/RL01 Symbol Pin Function
1, 3, 5,13, 17 1, 3, 5, 13, 17 GND Electrical Ground
22V
IN+ Thermocouple Positive Terminal Input
44V
IN- Thermocouple Negative Terminal Input
6, 7, 9, 10, 18 10, 18 GND Not Electrical Ground; must be tied to Ground
—6V
SENSE Thermocouple Open and Short Circuit detection input
7 SC Alert Thermocouple Short Circuit Alert Output
88V
DD Power
9 OC Alert Thermocouple Open Circuit Alert Output
11 11 Alert 1 Alert Output 1
12 12 Alert 2 Alert Output 2
14 14 Alert 3 Alert Output 3
15 15 Alert 4 Alert Output 4
16 16 ADDR I2C Save Address Selection Voltage Input
19 19 SCL I2C Clock Input
20 20 SDA I2C Data Input
21 21 EP Exposed Thermal Pad (EP); must be connected to GND
2015-2019 Microchip Technology Inc. DS20005426F-page 16
MCP960X/L0X/RL0X
4.0 SERIAL COMMUNICATION
4.1 2-Wire Standard Mode I2C
Protocol-Compatible Interface
The MCP960X/L0X/RL0X Serial Clock Input (SCL) and
the bidirectional Serial Data Line (SDA) form a 2-wire
bidirectional data communication line (refer to the
Input/Output Pin DC Characteristics table and
Sensor Serial Interface Timing Specifications
table).
The following bus protocol has been defined:
4.1.1 DATA TRANSFER
Data transfers are initiated by a Start condition
(START), followed by a 7-bit device address and a
read/write bit. An Acknowledge (ACK) from the slave
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).
Repeated communication is initiated after tB-FREE.
This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP960X/L0X/RL0X
retains the previously selected register. Therefore, it
outputs data from the previously-specified register
(repeated pointer specification is not necessary).
4.1.2 MASTER/SLAVE
The bus is controlled by a master device (typically a
microcontroller) that controls the bus access, and
generates the Start and Stop conditions. The
MCP960X/L0X/RL0X is a slave device and does not
control other devices in the bus. Both master and slave
devices can operate as either transmitter or receiver.
However, the master device determines which mode is
activated.
4.1.3 START/STOP CONDITION
A high-to-low transition of the SDA line (while SCL is
high) is the Start condition. All data transfers must be
preceded by a Start condition from the master. A
low-to-high transition of the SDA line (while SCL is
high) signifies a Stop condition.
If a Start or Stop condition is introduced during data
transmission, the MCP960X/L0X/RL0X releases the
bus. All data transfers are ended by a Stop condition
from the master.
4.1.4 ADDRESS BYTE
Following the Start condition, the host must transmit an
8-bit address byte to the MCP960X/L0X/RL0X. The
address for the MCP960X/L0X/RL0X temperature sensor
is ‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 and
A0 bits are set externally by connecting the corresponding
VADDR voltage levels on the ADDR pin (see the
“Input/Output Pin DC Characteristics” section). The
7-bit address transmitted in the serial bit stream must
match the selected address for the MCP960X/L0X/RL0X
to respond with an ACK. Bit 8 in the address byte is a
read/write bit. Setting this bit to ‘1’ commands a read oper-
ation, while 0’ commands a write operation (see
Figure 4-1).
FIGURE 4-1: Device Addressing.
TABLE 4-1: MCP9600/L00/RL00
SERIAL BUS PROTOCOL
DESCRIPTIONS
Term Description
Master The device that controls the serial bus,
typically a microcontroller
Slave The device addressed by the master,
such as the MCP960X/L0X/RL0X
Transmitter Device sending data to the bus
Receiver Device receiving data from the bus
START A unique signal from master to initiate
serial interface with a slave
STOP A unique signal from the master to
terminate serial interface from a slave
Read/Write A read or write to the
MCP960X/L0X/RL0X registers
ACK A receiver Acknowledges (ACK) the
reception of each byte by polling the
bus
NAK A receiver Not Acknowledges (NAK) or
releases the bus to show End-of-Data
(EOD)
Busy Communication is not possible
because the bus is in use
Not Busy The bus is in the Idle state, both SDA
and SCL remain high
Data Valid SDA must remain stable before SCL
becomes high in order for a data bit to
be considered valid. During normal
data transfers, SDA only changes state
while SCL is low.
123456789
SCL
SDA 11 0 0A2 A1 A0
Start
Command Byte
Slave
R/W
MCP960X/L0X/RL0X Response
Address
A
C
K
2015-2019 Microchip Technology Inc. DS20005426F-page 17
MCP960X/L0X/RL0X
4.1.5 DATA VALID
After the Start condition, each bit of data in
transmission needs to be settled for a time specified by
tSU-DATA before SCL toggles from low-to-high (see the
“Sensor Serial Interface Timing Specifications”
section).
4.1.6 ACKNOWLEDGE (ACK/NAK)
Each receiving device, when addressed, is expected to
generate an ACK bit after the reception of each byte.
The master device must generate an extra clock pulse
for ACK to be recognized.
The Acknowledging device pulls down the SDA line for
tSU-DATA before the low-to-high transition of SCL from
the master. SDA also needs to remain pulled down for
tHD-DAT after a high-to-low transition of SCL.
During read, the master must signal an End-of-Data
(EOD) to the slave by not generating an ACK bit (NAK)
once the last bit has been clocked out of the slave. In
this case, the slave will leave the data line released to
enable the master to generate the Stop condition.
4.1.7 CLOCK STRETCHING
During the I2C read operation, this device will hold the
I2C clock line low for tSTRECH after the falling edge of
the ACK signal. In order to prevent bus contention, the
master controller must release or hold the SCL line low
during this period.
In addition, the master controller must provide eight
consecutive clock cycles after generating the ACK bit
from a read command. This allows the device to push
out data from the SDA Output Shift registers. Missing
clock cycles could result in bus contention. At the end
of one or more data transmission, the master controller
must provide the NAK bit, followed by a Stop Condition
to terminate communication (see Figure 4-3).
FIGURE 4-2: Clock Stretching.
4.1.8 SEQUENTIAL READ
During a sequential read, the device transmits data
bytes starting from the previously set Register Pointer.
The MCP960X/L0X/RL0X increments an internal
address pointer each time a byte transmission is suc-
cessfully completed with an ACK bit from the master
controller. Therefore, the device can sequentially out-
put the entire register values shown in Table 5-1 (see
Figure 4-6). A Stop Condition terminates the sequen-
tial read.
Note: If the master controller does not provide
the adequate delay as specified by
tSTRECH, then the device will output the
previously transmitted data.
A
C
Kxxxx
A
C
K
A
0
78 12345678
x
R
MCP960X/L0X/RL0X Master
xxx
MCP9600/L00/RL00
Clock Stretching – t
STRETCH
T
H
MSB Data
ACK A‘ 5678 ACK A‘
2015-2019 Microchip Technology Inc. DS20005426F-page 18
MCP960X/L0X/RL0X
FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two-Byte Data.
SDA A
C
K
1100A0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte Slave*
W000 P
A
C
K
1100A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345 678
Address Byte LSB Data
R
Master
SDA
SCL
00000001 10010100
TABLE 4-2: POINTERS
Read-Only
Registers Pointer
TH0000 0000
T0000 0001
TC0000 0010
Note: this is an example pseudo routine:
i2c_start(); // send START command
i2c_write(b’1100 0000’); // WRITE Command
// also, make sure bit 0 is cleared ‘0
i2c_write(b’0000 00XX’); // Write TH, T, or TC registers
i2c_stop(); // send STOP command
i2c_start(); // send START command
i2c_write(b’1100 0001’); // READ Command
// also, make sure bit 0 is set ‘1
UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay)
// and Send ACK bit
LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay)
// and Send NAK bit
i2c_stop(); // send STOP command
//Convert the temperature data
if ((UpperByte & 0x80) == 0x80){ //Temperature 0°C
Temperature = (UpperByte x 16 + LowerByte / 16) - 4096;
}else //Temperature 0°C
Temperature = (UpperByte x 16 + LowerByte / 16);
//TH, TD, or TC Temperature (°C) depending on the register pointer value shown in Table 4-2.
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
Slave* Master
Pointer
(Table 4-2)
Slave*
*MCP960X/L0X/RL0X
7\\\\_
2015-2019 Microchip Technology Inc. DS20005426F-page 19
MCP960X/L0X/RL0X
FIGURE 4-4: Timing Diagram to Set a Register Pointer, Write One Byte, and Read the Data.
SDA A
C
K
1100A0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
W101 P
A
C
K
1100AN
A
K
S P
2
A
1
A
0
12345678 12345678
Address Byte LSB Data
R
Master
SDA
SCL
xxxxxxxx
TABLE 4-3: POINTERS
Read/Write
Registers Pointer
STATUS 0000 0100
Configuration 0000 0101
0000 0110
xxxx
A
C
K
12345678
xxxx
Register Data
Note: this is an example pseudo routine:
i2c_start(); // send START command
i2c_write(b’1100 0000’); // WRITE Command
// also, make sure bit 0 is cleared ‘0
i2c_write(b’0000 0101’); // Write Status or Configuration registers
i2c_write(b’XXXX XXXX’); // Write register data
i2c_stop(); // send STOP command
i2c_start(); // send START command
i2c_write(b’1100 0001’); // READ Command
// also, make sure bit 0 is set 1
Data = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay)
// and Send NAK bit
i2c_stop(); // send STOP command
Slave* Slave*
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
Slave*
Configuration
(Table 4-3)
*MCP960X/L0X/RL0X
1\\\7 7 7 ? T7 7 7 7 f 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 x 7 ‘m f A? 7 + 7 a T r\\L 7 7 7 s 7 s 7 7 7 7 a 7 ACK? f 7 7 7 7 7 7 7
2015-2019 Microchip Technology Inc. DS20005426F-page 20
MCP960X/L0X/RL0X
FIGURE 4-5: Timing Diagram to Set a Register Pointer, Write Two Bytes, and Read the Data.
SDA A
C
K
1100A
Alert 1 MSB
0001
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
W000 xxxx
A
C
K
12345678
xxxx
xxxx
A
C
K
12345678
xxxx P
TABLE 4-4: POINTERS
Alert Limit
Registers Pointer
Alert 1 0001 0000
Alert 2 0001 0001
Alert 3 0001 0010
Alert 4 0001 0011
Alert 1 LSB
Note: this is an example pseudo routine:
i2c_start(); // send START command
i2c_write(b’1100 0000’); //WRITE Command
//also, make sure bit 0 is cleared ‘0
i2c_write(b’0001 00XX’); // Write Alert registers
i2c_write(b’XXXX XXXX’); // Write register Upper Byte
i2c_write(b’XXXX XXXX’); // Write register Lower Byte
i2c_stop(); // send STOP command
i2c_start(); // send START command
i2c_write(b’1100 0001’); //READ Command
//also, make sure bit 0 is set ‘1
UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay)
//and Send ACK bit
LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay)
//and Send NAK bit
i2c_stop(); // send STOP command
Alert Limit 1
(Table 4-4)
Slave*
A
C
K
1100A
Alert 1 MSB
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte Alert 1 LSB
R
Master
SDA
SCL
xxxxxxxx xxxxxxxx
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
Slave* Master
*MCP960X/L0X/RL0X
Slave* Slave*
Slave*
2015-2019 Microchip Technology Inc. DS20005426F-page 21
MCP960X/L0X/RL0X
FIGURE 4-6: Timing Diagram to Sequential Read All Registers Starting from TH Register.
A
C
K
12345678 12345678
xxxxxxxx xxxxxxxx xxx xxx
A
C
K
N
A
K
P
TC MSB Data TC LSB Data T MSB Data
Device ID LSB
Note: this is an example pseudo routine:
i2c_start(); // send START command
i2c_write(b’1100 0000’); // WRITE Command
// also, make sure bit 0 is cleared ‘0
i2c_write(b’0000 0000’); // Write TH register to set the starting register for sequential read
i2c_stop(); // send STOP command
i2c_start(); // send START command
i2c_write(b’1100 0001’); // READ Command
// also, make sure bit 0 is set ‘1’
for (i=0; i<29, i++){
Data_Buffer[i] = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay)
// and Send ACK bit
}
Data_Buffer[i] = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay)
// and Send NAK bit
i2c_stop(); // send STOP command
SDA A
C
K
1100A0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte Slave*
W000 P
Pointer to
TH Register
A
C
K
1100A
TH MSB Data
A
C
K
A
C
K
S2
A
1
A
0
12345678 12345678 12345678
Address Byte TH LSB Data
R
Master
SDA
SCL
xxxxxxxx xxxxxxxx
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
Slave* Master
Slave*
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
Master Master Master
*MCP960X/L0X/RL0X
\\\\\\\\\
2015-2019 Microchip Technology Inc. DS20005426F-page 22
MCP960X/L0X/RL0X
5.0 FUNCTIONAL DESCRIPTION
The MCP960X/L0X/RL0X temperature sensor consists
of an 18-bit Delta-Sigma Analog-to-Digital Converter
(ADC), which is used to measure the thermocouple
voltage or EMF, a digital temperature sensor used to
measure cold-junction or ambient temperature and a
processor core which is used to compute the EMF to
degree Celsius conversion using coefficients derived
from the NIST ITS-90 coefficients. Figure 5-1 shows a
block diagram of how these functions are structured in
the device.
FIGURE 5-1: Functional Block Diagram.
Del Sig
VIN+
VIN-
ADC Core
Error Correction
Thermocouple Hot-Junction, TH
Thermocouple
Thermocouple Junctions Delta, T
Thermocouple Cold-Junction, TC
User Registers:
Sensor Configuration
Digital
Filter
Thermocouple
Type
Selection
Device Resolution and Power Modes
Sensor Status
Alert 1 Limit
Hysteresis
Configuration
Alert 2 Limit
Hysteresis
Configuration
Alert 3 Limit
Hysteresis
Configuration
Alert 4 Limit
Hysteresis
Configuration
Device ID
+
Alert 1 Output
Alert 2 Output
Alert 3 Output
Alert 4 Output
SCL
SDA
ADDR
I2C Module
Open Circuit and
Short Circuit
Detection
OC Alert
SC Alert
VSENSE
MCP9601/L01/RL01 Only
2015-2019 Microchip Technology Inc. DS20005426F-page 23
MCP960X/L0X/RL0X
The MCP960X/L0X/RL0X device has several registers
that are user-accessible. These registers include the
Thermocouple Temperature (cold-junction compen-
sated), Hot-Junction Temperature, Cold-Junction Tem-
perature, Raw ADC Data, user-programmable Alert
Limit registers, and STATUS and Configuration regis-
ters.
The Temperature and the Raw ADC Data registers are
read-only registers, used to access the thermocouple
and the ambient temperature data. In addition, the four
Alert Temperature registers are individually controlled,
and can be used to detect a rising and/or a falling
temperature change. If the ambient temperature drifts
beyond the user-specified limits, the
MCP960X/L0X/RL0X device outputs an alert flag at the
corresponding pin (refer to Section 5.3.3 “Alert Con-
figuration Registers”). The alert limits can also be
used to detect critical temperature events.
The MCP960X/L0X/RL0X also provides STATUS and
Configuration registers, which allow users to detect
device statuses. The Configuration registers provide
various features, such as adjustable temperature
measurement resolution and Shutdown modes. The
thermocouple types can also be selected using the
Configuration registers.
The registers are accessed by sending a Register
Pointer to the MCP960X/L0X/RL0X using the serial
interface. This is an 8-bit write-only pointer.
Register 5-1 describes the pointer definitions.
REGISTER 5-1: REGISTER POINTER
U-0 U-0 W-0 W-0 W-0 W-0 W-0 W-0
— P[5:0]
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 P[5:0]: Pointer bits
0000 0000 = Thermocouple Hot-Junction register, TH
0000 0001 = Junctions Temperature Delta register, T
0000 0010 = Cold-Junction Temperature register, TC
0000 0011 = Raw ADC Data register
0000 0100 = STATUS register
0000 0101 = Thermocouple Sensor Configuration register
0000 0110 = Device Configuration register
0000 1000 = Alert 1 Configuration register
0000 1001 = Alert 2 Configuration register
0000 1010 = Alert 3 Configuration register
0000 1011 = Alert 4 Configuration register
0000 1100 = Alert 1 Hysteresis register, THYST1
0000 1101 = Alert 2 Hysteresis register, THYST2
0000 1110 = Alert 3 Hysteresis register, THYST3
0000 1111 = Alert 4 Hysteresis register, THYST4
0001 0000 = Temperature Alert 1 Limit register, TALERT1
0001 0001 = Temperature Alert 2 Limit register, TALERT2
0001 0010 = Temperature Alert 3 Limit register, TALERT3
0001 0011 = Temperature Alert 4 Limit register, TALERT4
0010 0000 = Device ID/Revision register
2015-2019 Microchip Technology Inc. DS20005426F-page 24
MCP960X/L0X/RL0X
TABLE 5-1: SUMMARY OF REGISTERS AND BIT ASSIGNMENTS
Register Pointer bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
Hot-Junction
Temperature – TH
00000000 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
Junctions Temperature
Delta – T
00000001 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
Cold-Junction
Temperature – TC
00000010 SIGN 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
Raw Data ADC 00000011 SIGN bit 17 bit 16
bit 15 bit 8
bit 7 bit 0
STATUS
MCP9600/L00/RL00
00000100 Burst
Complete
TH
Update
Input Range Alert 4
Status
Alert 3
Status
Alert 2
Status
Alert 1
Status
STATUS
MCP9601/L01/RL01
Short Circuit
(SC)
Open Circuit
(OC)/Input
Range
Thermocouple
Sensor Configuration
00000101 Thermocouple Type Select
Type K, J, T, N, S, E, B, R
Filter Coefficients
Device
Configuration
00000110 Cold-Junc.
Resolution
ADC Resolution Burst Mode Temperature Samples Shutdown Modes
Alert 1 Configuration 00001000 Interrupt
Clear
Monitor TH
or TC
Detect Ris-
ing or Fall-
ing Temps
Active- High
or
Active-Low
Output
Comparator
or
Interrupt
Mode
Enable
Alert
Output
Alert 2 Configuration 00001001
Alert 3 Configuration 00001010
Alert 4 Configuration 00001011
Alert 1 Hysteresis 00001100 128°C 64°C 32°C 16°C 8°C 4°C 2°C 1°C
Alert 2 Hysteresis 00001101
Alert 3 Hysteresis 00001110
Alert 4 Hysteresis 00001111
Alert 1 Limit 00010000 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C — —
Alert 2 Limit 00010001 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C
Alert 3 Limit 00010010 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C — —
Alert 4 Limit 00010011 SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
8°C 4°C 2°C 1°C 0.5°C 0.25°C
Device ID/Revision 00100000 0 1 0 0 0 0 0 0
Revision ID Major Revision ID Minor
2015-2019 Microchip Technology Inc. DS20005426F-page 25
MCP960X/L0X/RL0X
5.1 Thermocouple Temperature
Sensor Registers
This device integrates three Temperature registers that
are used to read the cold and hot-junction temperatures,
and the sum of the two junctions to output the absolute
thermocouple temperature. In addition, the Raw ADC
Data register, which is used to derive the thermocouple
temperature, is available. The following sections
describe each register in detail.
5.1.1 THERMOCOUPLE TEMPERATURE
REGISTER (TH)
This register contains the cold-junction compensated and
error-corrected thermocouple temperature in degree
Celsius. The temperature data from this register is the
absolute Thermocouple Hot-Junction temperature, TH, to
the specified accuracy (see Section 1.0 “Electrical
Characteristics”. TH is the sum of the values in the T
and TC registers, as shown in Figure 5-2.
EQUATION 5-1: TEMPERATURE
CONVERSION
The temperature bits are in two’s complement format;
therefore, positive temperature data and negative
temperature data are computed differently.
Equation 5-1 shows how to convert the binary data to
temperature in degree Celsius.
FIGURE 5-2: Thermocouple Temperature
Register Block Diagram.
Temperature 0°C
TH = (UpperByte x 16 + LowerByte/16)
Temperature 0°C
TH = (UpperByte x 16 + LowerByte/16) – 4096
VIN+
VIN-
Temperature
Sensor Core
ADC Core
Delta-Sigma
18-Bit
Error Corrected
Temperature
ADC
Thermocouple
Temperature
TCTH
T
REGISTER 5-2: THERMOCOUPLE TEMPERATURE REGISTER - TH (READ-ONLY)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 TH: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data is
less than 0°C.
This register contains the error corrected and cold-junction compensated thermocouple temperature.
2015-2019 Microchip Technology Inc. DS20005426F-page 26
MCP960X/L0X/RL0X
5.1.2 THERMOCOUPLE JUNCTIONS
DELTA TEMPERATURE
REGISTER (T)
This register contains the error corrected
Thermocouple Hot-Junction temperature without the
Cold-Junction compensation. The error correction
methodology uses several coefficients to convert the
digitized Thermocouple EMF voltage to degree
Celsius. Each Thermocouple type has a unique set of
coefficients as specified by NIST, and these
coefficients are available in the configuration register
for user selection as shown in Figure 5-3.
EQUATION 5-2: TEMPERATURE
CONVERSION
The temperature bits are in two’s complement format,
therefore, positive temperature data and negative
temperature data are computed differently, as shown
in Equation 5-2.
FIGURE 5-3: Thermocouple Hot-Junction
Register (T) Block Diagram.
Temperature 0°C
T = (UpperByte x 16 + LowerByte / 16)
Temperature 0°C
T = (UpperByte x 16 + LowerByte / 16) - 4096
VIN+
VIN-
ADC code to
degree Celsius
conversion using
coefficients derived
from NIST look-up
table database
User-Selectable,
Thermocouple Types:
- Type K
- Type J
- Type T
- Type N
- Type S
- Type E
- Type B
- Type R
(see Register 5-6)Thermocouple
Junctions Delta
Temperature – T
Check if the ADC
code is within range
for the selected
thermocouple type
T
Delta-Sigma
18-Bit
ADC Core
ADC
REGISTER 5-3: HOT-JUNCTION TEMPERATURE REGISTER -T (READ-ONLY)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
SIGN 1024°C 512°C 256°C 128°C 64°C 32°C 16°C
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 T: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data is
less than 0°C.
This register contains Thermocouple Hot-Junction temperature data without the cold-junction
compensation.
2015-2019 Microchip Technology Inc. DS20005426F-page 27
MCP960X/L0X/RL0X
5.1.3 COLD-JUNCTION/AMBIENT
TEMPERATURE REGISTER (TC)
The MCP960X/L0X/RL0X integrates an ambient
temperature sensor which can be used to measure the
thermocouple cold-junction temperature. For accurate
measurement, the device will have to be placed at close
proximity to the thermocouple cold-junction to detect the
junction ambient temperature. This is a 16-bit
double-buffered, read-only register. The temperature
resolution is user-selectable to 0.0625°C/LSb or
0.2C/LSb resolutions and setting the resolution
determines the temperature update rate, as shown in
Table 5-2.
EQUATION 5-3: TEMPERATURE
CONVERSION
The temperature bits are in two’s complement format;
therefore, positive temperature data and negative
temperature data are computed differently, as shown
in Equation 5-3.
FIGURE 5-4: Thermocouple
Cold-Junction Register (TC) Block Diagram.
Temperature 0°C
TC = (UpperByte x 16 + LowerByte/16)
Temperature 0°C
TC = (UpperByte x 16 + LowerByte/16) – 4096
TABLE 5-2: RESOLUTION vs.
CONVERSION TIME
Resolution
Conversion
Time
(typical)
Register Bits
(Note 1)
0.0625°C 250 ms ssss xxxx xxxx xxxx
0.25°C 63 ms ssss xxxx xxxx xx00
Note 1: s’ is Sign and ‘x’ is unknown bit.
Ambient Temperature
Sensor Core
TC
Selectable Resolution:
- 0.0625°C
-0.25°C
(see Register 5-8)
Thermocouple
Cold-Junction
Temperature –TC
REGISTER 5-4: COLD-JUNCTION TEMPERATURE REGISTER - TC (READ ONLY)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
SIGN 128°C 64°C 32°C 16°C
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
8°C 4°C 2°C 1°C 0.5°C 0.25°C 0.125°C 0.0625°C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 TC: Data in Two’s Complement Format. Bits 15-12 are sign bits and the bits are set when the
temperature data is less than 0°C.
This register contains the thermocouple cold-junction temperature or the device ambient temperature
data. Bits 1 and 0 may remain clear (‘0’) depending on the status of the Resolution setting, bit 7 of
Register 5-8.
2015-2019 Microchip Technology Inc. DS20005426F-page 28
MCP960X/L0X/RL0X
5.1.4 ANALOG-TO-DIGITAL
CONVERTER (ADC)
The MCP960X/L0X/RL0X uses an 18-bit Delta-Sigma
Analog-to-Digital Converter to digitize the Thermocouple
EMF voltage and the data is available in the ADC register.
The ADC measurement resolution is selectable, which
enables the user to choose faster conversion times with
reduced resolution. This feature is useful to detect fast
transient temperatures.
FIGURE 5-5: Delta-Sigma
Analog-to-Digital Converter, ADC Core Block
Diagram.
TABLE 5-3: ADC RESOLUTION(28)
Resolution/
Sensitivity
(typical)
Conversion
Time
(typical)
Raw ADC Register
Bit Format
(Note 1)
18-bit/2 µV 320 ms ssss sssx xxxx xxxx
xxxx xxxx
16-bit/8 µV 80 ms ssss sssx xxxx xxxx
xxxx xx00
14-bit/3V 20ms ssss sssx xxxx xxxx
xxxx 0000
12-bit/128 µV 5 ms ssss sssx xxxx xxxx
xx00 0000
Note 1: s’ is the Sign bit and ‘x’ is the ADC data bit.
2: See Section 6.2.2 “Conversion Time vs.
Self-Heat.
VIN+
VIN-
Selectable Resolutions:
- 18-bit
- 16-bit
- 14-bit
- 12-bit
(see Register 5-7)
Raw ADC
Code Register
ADC Core
ADC
Delta-Sigma
REGISTER 5-5: 24-BIT ADC REGISTER (READ-ONLY)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
SIGN ADC Data
bit 23 bit 16
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
ADC Data
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
ADC Data
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR 1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 23-0 ADC Data: Raw ADC Raw ADC data in Two's Compliment Format. Bits 23-18 are sign bits and the
bits are set when the ADC data is less than 0 micro-volt.
2015-2019 Microchip Technology Inc. DS20005426F-page 29
MCP960X/L0X/RL0X
5.2 Sensor STATUS and Configuration
Registers
This device provides various temperature and
measurement Status bits which can be monitored
regularly by the master controller. In addition, this
device integrates various user-programmable features
which can be useful to develop complex thermal
management applications. The following sections
describe each feature in detail.
5.2.1 STATUS REGISTER
The STATUS register contains several flag bits that
indicate statuses, such as temperature alert, the ADC
input range status for the selected thermocouple type
and the Temperature register update status for both
single conversion or Burst mode conversions.
REGISTER 5-6: STATUS REGISTER
R/W-0 R/W-0 U-0 R-0 R-0 R-0 R-0 R-0
Burst Complete
TH Update Input Range Alert 4 Status Alert 3 Status Alert 2 Status Alert 1 Status
Short Circuit
(SC) (1)
Open Circuit
(OC)/Input
Range (1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Burst Complete: Burst Mode Conversions Status Flag bit
1 =T
register Burst mode conversions complete
0 = Writing ‘0’ has no effect
Once Burst mode is enabled, this bit is normally set after the first burst is complete. User can clear it and
poll the bit periodically until the next burst of temperature conversions is complete (see Register 5-8).
bit 6 TH Update: Temperature Update Flag bit
1 = Temperature conversion complete
0 = Writing ‘0’ has no effect
This bit is normally set. User can clear it and poll the bit until the next temperature conversion is complete.
bit 5 Unimplemented: Read as ‘0’ for the MCP9600/L00/RL00 only.
Short Circuit (SC): Short Circuit Detection bit for the MCP9601/L01/RL01 only (read-only)
1 = Thermocouple Shorted to VDD or VSS
0 = Normal operation
The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA and RB
resistors.
Note 1: MCP9601/L01/RL01 only.
2015-2019 Microchip Technology Inc. DS20005426F-page 30
MCP960X/L0X/RL0X
bit 4 Input Range: Temperature Range Detection bit (read-only)
1 = The ADC input Voltage (EMF) or the temperature data from the TH register exceeds the measure-
ment range for the selected thermocouple type
0 = The ADC input Voltage (EMF) or the temperature data from the TH register is within the measure-
ment range for the selected thermocouple type
If this bit is set, then the MCP960X/L0X/RL0X input voltage (EMF) to Degree Celsius conversion may be
bypassed under these conditions:
- If the thermocouple EMF exceeds the specified range, then the TH and T registers are not
updated, but the TC register is updated with valid temperature data at the specified interval,
or tCONV
.
- If the thermocouple EMF is within the specified range, but the sum with the Cold-Junction
EMF exceeds the specified range, then the TH register is not updated, but the T and TC
registers are updated with valid temperature data at the specified interval, or tCONV
. In this
case, the value of the T and TC registers can be used to calculate valid Hot-Junction
Temperature data using the NIST ITS-90 conversion look-up table or polynomial equation.
- To identify date code for devices with this feature, refer to “MCP9600 Rev. A Silicon Errata
and Data Sheet Clarification”, DS80000741.
For the MCP9601/L01/RL01, this bit indicates whether the Thermocouple is disconnected from the
inputs. The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA and
RB resistors. When the Thermocouple is disconnected, the voltage at the inputs exceeds the voltage
range for the selected Thermocouple due to the RA and RB resistors.
bit 3 Alert 4: Status bit (read-only)
1 =T
X TALERT4
0 =T
X TALERT4
Where: TX is either TH or TC (user-selectable, see Register 5-10).
bit 2 Alert 3: Status bit (read-only)
1 =T
X TALERT3
0 =T
X TALERT3
Where: TX is either TH or TC (user-selectable, see Register 5-10).
bit 1 Alert 2: Status bit (read-only)
1 =T
X TALERT2
0 =T
X TALERT2
Where: TX is either TH or TC (user-selectable, see Register 5-10).
bit 0 Alert 1: Status bit (read-only)
1 =T
X TALERT1
0 =T
X TALERT1
Where: TX is either TH or TC (user-selectable, see Register 5-10).
Note 1: MCP9601/L01/RL01 only.
REGISTER 5-6: STATUS REGISTER (CONTINUED)
2015-2019 Microchip Technology Inc. DS20005426F-page 31
MCP960X/L0X/RL0X
5.2.2 THERMOCOUPLE SENSOR
CONFIGURATION REGISTER
The MCP960X/L0X/RL0X Sensor Configuration
register is used to select the thermocouple sensor
types and to select the digital filter options. This device
supports eight thermocouple types. Each type has a
unique set of error correction coefficients that are
derived from the NIST Thermocouple EMF Voltage
Conversion database.
In addition, this device integrates a first order. recursive
Infinite Impulse Response (IIR) filter, also known as
Exponential Moving Average (EMA). The filter uses the
current new temperature sample and the previous filter
output to calculate the next filter output. It also adds more
weight to the current temperature data, allowing a faster
filter response to the immediate change in temperature.
This feature can be used to filter out fast thermal
transients or thermal instability at the thermocouple
hot-junction temperature. Writing this register resets the
filter.
The filter equation is shown in Equation 5-4 and the
Filter Coefficient n is user-selectable, from Level 0 to 7.
A coefficient of 0 disables the filter function and a 7
coefficient provides a maximum digital filter. Figure 5-6
shows the filter response to a step function, which can
be used to extrapolate the filter performance to various
temperature changes.
EQUATION 5-4: DIGITAL FILTER
FIGURE 5-6: Filter Step Response.
YkX
1kY1
+=
Where:
Y= New filtered temperature in T
X= Current, unfiltered hot-junction
temperatures
Y-1 =Previous
filtered temperature
n= User-selectable filter coefficient
k22
n1+
=
0.0
0.5
1.0
0.0 32.0 64.0 96.0 128.0
Filter Output (°C)
Number of Temperature Samples
n=0
n=1
n=2
n=3
n=4
n=5
n=6
n=7
REGISTER 5-7: SENSOR CONFIGURATION REGISTER
U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
Thermocouple Type Select, Type K, J, T, N, S, E, B, R Filter Coefficients
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 Thermocouple Type: Thermocouple Type Select bits
000 = Type K
001 = Type J
010 = Type T
011 = Type N
100 = Type S
101 = Type E
110 = Type B
111 = Type R
bit 3 Unimplemented: Read as ‘0
bit 2-0 Filter Coefficient – n: Filter Coefficient bits
000 = n = 0: Filter off
001 = n = 1: Minimum filter
010 = n = 2
011 = n = 3
100 = n = 4: Mid filter
101 = n = 5
110 = n = 6
111 = n = 7: Maximum filter
2015-2019 Microchip Technology Inc. DS20005426F-page 32
MCP960X/L0X/RL0X
5.2.3 DEVICE CONFIGURATION
REGISTER
The device Configuration register allows the user to
configure various functions, such as sensor
measurement resolutions and Power modes. The
Resolution register is used to select the sensor
resolution for the desired temperature conversion time.
When resolutions are changed, the change takes effect
when the next measurement cycle begins.
This device integrates two Low-Power Operating
modes: Shutdown mode and Burst mode, which can be
selected using bit 0 and bit 1. When the Shutdown
mode is executed, all power consuming activities are
disabled and the operating current remains at ISHDN.
During the Shutdown mode, all registers are
accessible; however, I2C activity on the bus increases
the current.
The Burst mode enables users to execute a given
number of temperature samples (defined by bits[4-2])
before entering Shutdown mode. Each temperature
sample is compared to the user-settable alert
temperature limits, and if the alert conditions are true,
then the device asserts the corresponding alert output.
In addition, if the filter option is enabled, then the filter
engine is applied to each temperature sample. The alert
thresholds are also compared to the filtered temperature
data. This feature is useful for battery power
applications, where temperature is sampled upon
request from the master controller.
FIGURE 5-7: Burst Mode Operation.
1Samples128
Burst Mode Command
Shutdown ModeShutdown Mode
Normal Operation
REGISTER 5-8: DEVICE CONFIGURATION REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
Cold-Junction
Resolution
ADC Measurement Resolution Burst Mode Temperature Samples Shutdown Modes
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Cold-Junction/Ambient Sensor Resolution: Cold-Junction Resolution bit (see Tab l e 5 -2):
0 = 0.0625°C
1 = 0.25°C
bit 6-5 ADC Measurement Resolution: ADC Resolution bits (see Tab l e 5 - 3):
00 =18-bit Resolution
01 =16-bit Resolution
10 =14-bit Resolution
11 =12-bit Resolution
bit 4-2 Burst Mode Temperature Samples: Number of Temperature Samples bits
000 = 1 sample
001 = 2 samples
010 = 4 samples
011 = 8 samples
100 = 16 samples
101 = 32 samples
110 = 64 samples
111 = 128 samples
bit 1-0 Shutdown Modes: Shutdown Mode bits
00 = Normal operation
01 = Shutdown mode
10 = Burst mode
11 = Unimplemented: this setting has no effect
TALERT3
2015-2019 Microchip Technology Inc. DS20005426F-page 33
MCP960X/L0X/RL0X
5.3 Temperature Alert Registers
This device provides four Temperature Alert registers
that are individually configured, which allow users to
monitor multiple temperature zones with a single
device. The following sections describe each alert
feature in detail.
5.3.1 ALERT LIMIT REGISTERS
This device integrates four individually controlled
Temperature Alert Limit registers. Each alert limit is
individually set to detect a rising or falling temperature,
or either the Thermocouple Temperature (TH) register
or the Cold-Junction (TC) register. The corresponding
alert limit outputs can also be enabled for temperature
status indicators. All alert functions are configured using
the Alert Limit Configuration registers (Register 5-11)
and the alert output hysteresis function is set using the
Alert Hysteresis registers (Register 5-10).
TABLE 5-4: ALERT LIMIT REGISTERS
Register Register Pointer
Alert 1 Limit – TALERT1 0001 0000
Alert 2 Limit – TALERT2 0001 0001
Alert 3 Limit – TALERT3 0001 0010
Alert 4 Limit – TALERT4 0001 0011
REGISTER 5-9: ALERT LIMITS 1, 2, 3 AND 4 REGISTERS
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SIGN 1024°C 512°C 255°C 128°C 64°C 32°C 16°C
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
8°C 4°C 2°C 1°C 0.5°C 0.25°C — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 Alert 1, 2, 3 and 4: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the
temperature data is less than 0°C. Bits 1 and 0 are unimplemented, therefore, writing these bits has
no effect.
2015-2019 Microchip Technology Inc. DS20005426F-page 34
MCP960X/L0X/RL0X
FIGURE 5-8: Alert Limits Set to Detect TH and TC.
FIGURE 5-9: Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.
TH
TC
Alert Limit
Alert Hysteresis
0
1
TH/TC
+/–
Rise/Fall
Digital Comparator
0
1
Output Mode Control
Comparator/Interrupt Mode
Int. Clear
0
1Alert Output
Active High/Low
Comparator
Interrupt
TALERT2
TALERT3
TALERT1
TH
TALERT1THYST1
T
ALERT3
+ T
HYST3
TALERT4
T
ALERT4
+ T
HYST4
TALERT1
TALERT2
Alert 1 Output
(Active-Low)
Alert 4 Output
(Active-Low)
Alert 2 Output
(Active-Low)
Alert 3 Output
(Active-Low)
TALERT4
TALERT3
T
ALERT2
– T
HYST2
Comparator
Interrupt
Interrupt Clear
Comparator
Interrupt
Interrupt Clear
Comparator
Interrupt
Interrupt Clear
Comparator
Interrupt
Interrupt Clear
K #4 V 53.322 9‘ 1% 3o._‘w>_5<>
2015-2019 Microchip Technology Inc. DS20005426F-page 35
MCP960X/L0X/RL0X
5.3.2 ALERT HYSTERESIS REGISTER
This device integrates four individually controlled
temperature Alert Hysteresis registers for each alert
output, with a range of 0°C to +255°C.
The alert hysteresis directions are set using bit 3 of
the corresponding Alert Configuration registers
(Register 5-10) to detect rising or falling temperatures.
For rising temperatures, the hysteresis range is below
the alert limit where, as for falling temperatures, the
hysteresis range is above the alert limit, as shown in
Figure 5-10.
FIGURE 5-10: Graphical Description of Alert Output Hysteresis Direction.
TABLE 5-5: ALERT HYSTERESIS
REGISTERS
Register Register Pointer
Alert 1 Hysteresis – THYST1 0000 1100
Alert 2 Hysteresis – THYST2 0000 1101
Alert 3 Hysteresis – THYST3 0000 1110
Alert 4 Hysteresis – THYST4 0000 1111
REGISTER 5-10: THYSTx: ALERT 1, 2, 3 AND 4 HYSTERESIS REGISTERS
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-0
128°C 64°C 32°C 16°C 8°C 4°C 2°C 1°C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 Alert Hysteresis: Alert Hysteresis Range 0x00 to 0xFF bits (which represents +1°C to +255°C)
Cold Hot
Hysteresis
Cold Hot
Hysteresis
TALERT
THYST TALERT THYST
Rising Temperature Falling Temperature
Alert Output
Cold Hot
Hysteresis
TALERT
THYST
Rising Temperature
Cold Hot
Hysteresis
TALERT THYST
Falling Temperature
Alert Output
Alert Output Alert Output
Active-Low
Active-Low
Active-High
Active-High
2015-2019 Microchip Technology Inc. DS20005426F-page 36
MCP960X/L0X/RL0X
5.3.3 ALERT CONFIGURATION
REGISTERS
This device integrates four individually controlled
temperature alert outputs. Each output is configured for
the corresponding alert output using the Alert Output
Configuration registers.
The Configuration registers are used to enable each
output, select the Alert Function mode as Comparator
or Interrupt mode, active-high or active-low output,
detect rising or falling temperatures and detect TH or
TC Temperature registers.
The Comparator mode is useful for thermostat-type
applications, such as on/off switches for fan controllers,
buzzer or LED indicators. The alert output asserts and
deasserts when the temperature exceeds the
user-specified limit, and the user-specified hysteresis
limit. The Interrupt mode is useful for interrupt driven
microcontroller-based systems. The alert outputs are
asserted each time the temperature exceeds the
user-specified alert limit and hysteresis limits.
The microcontroller will have Acknowledged the
interrupt signal from the corresponding alert output by
clearing the interrupt using bit 7 of the corresponding
Configuration register.
The Rise/Fall bit (bit 3) and the Monitor TH/TC bit (bit 4)
can be used to detect and maintain the thermocouple
temperature or the cold-junction temperature to the
desired temperature window.
TABLE 5-6: ALERT CONFIGURATION
REGISTERS
Register Register Pointer
Alert 1 Configuration 0000 1000
Alert 2 Configuration 0000 1001
Alert 3 Configuration 0000 1010
Alert 4 Configuration 0000 1011
REGISTER 5-11: ALERT 1, 2, 3 AND 4 CONFIGURATION REGISTER
R/W-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0
Interrupt Clear Monitor TH/TCRise/Fall Active-High/Low Comp/Int. Alert Enable
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Interrupt Clear: Interrupt Clear bit
1 = Clears Interrupt flag (forced ‘0’ by device)
0 = Normal state or cleared state
bit 6-5 Unimplemented: Read as ‘0
bit 4 Monitor TH or TC: Temperature Maintain/Detect bit
1 = Alert monitor for TC cold-junction sensor
0 = Alert monitor for TH thermocouple temperature
bit 3 Rise/Fall: Alert Temperature Direction bit
1 = Alert limit for rising or heating temperatures
0 = Alert limit for falling or cooling temperatures
bit 2 Active-High/Low: Alert State bit
1 = Active-high
0 = Active-low
bit 1 Comp./Int.: Alert Mode bit
1 = Interrupt mode: Interrupt clears bit (bit 7) – must be set to deassert the alert output
0 = Comparator mode
bit 0 Alert Enable: Alert Output Enable bit
1 = Alert output is enabled
0 = Alert output is disabled
2015-2019 Microchip Technology Inc. DS20005426F-page 37
MCP960X/L0X/RL0X
5.3.4 DEVICE ID AND REVISION ID
REGISTER
The Device ID (Identification) and Revision ID register
is a 16-bit read-only register, which can be used to
identify this device among other devices on the I2C
bus. The upper 8 bits indicate the Device ID of 0x40 for
the MCP9600/L00/RL00 and 0x41 for the
MCP9601/L01/RL01 respectively, while the lower 8 bits
indicate the device revision. The device revision byte is
divided into nibbles, where the upper nibble indicates
the major revision and the lower nibble indicates minor
revisions for each major revision. The initial release is
indicated by a major revision of ‘1’ and a minor revision
of ‘0’ or 0x4010 for the MCP9600/L00/RL00 and
0x4110 for the MCP9601/L01/RL01. (Refer to
“MCP9600 Rev. A Silicon Errata and Data Sheet
Clarification”, DS80000741, for changes and revision
IDs).
REGISTER 5-12: MCP9600/L00/RL00 DEVICE ID AND REVISION ID REGISTER
R-0 R-1 R-0 R-0 R-0 R-0 R-0 R-0
Device ID
bit 15 bit 8
R-0 R-0 R-0 R-1 R-0 R-0 R-0 R-0
Major Minor
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Device ID: Device ID bits (0x40)
bit 7-0 Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the
Silicon Errata, DS80000741, for change date codes and revision IDs).
REGISTER 5-13: MCP9601/L01/RL01 DEVICE ID AND REVISION ID REGISTER
R-0 R-1 R-0 R-0 R-0 R-0 R-0 R-1
Device ID
bit 15 bit 8
R-0 R-0 R-0 R-1 R-0 R-0 R-0 R-0
Major Minor
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Device ID: Device ID bits (0x41)
bit 7-0 Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the
Silicon Errata, DS80000741, for change date codes and revision IDs).
2015-2019 Microchip Technology Inc. DS20005426F-page 38
MCP960X/L0X/RL0X
6.0 APPLICATION INFORMATION
6.1 Layout Considerations
The MCP960X/L0X/RL0X does not require any
additional components to digitize thermocouples.
However, it is recommended that a decoupling
capacitor of 0.1 µF to 1 µF be used between the VDD
and GND pins. A high-frequency ceramic capacitor is
recommended. It is necessary for the capacitor to be
located as close as possible to the VDD and ground
pins of the device in order to provide effective noise
protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. The PCB provides thermal conduction from the die
to the thermocouple cold-junction; therefore, the
component placement positioning and the copper
layout techniques are key for optimum cold-junction
compensation. The recommended implementation for
optimum temperature sensitivity is to extend a copper
ground pad around the device pins, as shown in
Figure 6-1.
FIGURE 6-1: Recommended PCB Layout.
6.1.1 COLD-JUNCTION COMPENSATION
Copper provides better thermal conductivity than PCB
FR4 to the ambient temperature. It also provides better
thermal conduction than the 5 mm x 5 mm MQFN plastic
package, which houses the temperature sensor die.
Therefore, when connecting the thermocouple wire to
the PCB, it is recommended to place the ground copper
between the thermocouple connector footprint, where
dissimilar conductive material is attached to the PCB
and the MCP960X/L0X/RL0X exposed pad. This allows
temperature to stabilize to the local ambient temperature
(between the thermocouple connector junction and the
PCB copper) and the copper trace conducts the
temperature to the package exposed pad where the
temperature sensor die is placed. The placement of the
sensor exposed pad to the thermocouple connector
junction greatly determines the temperature sensor’s
sensitivity to the local junction temperature changes.
Figure 6-2 demonstrates the recommended techniques.
FIGURE 6-2: Recommended Component
Placement.
6.2 Thermal Considerations
The potential for self-heating errors exist if the
MCP960X/L0X/RL0X SDA, SCL and alert outputs are
heavily loaded (high current) with pull-up resistors and
circuits, such as high-current LEDs or buzzer loads.
The temperature rise due to self-heat increases the
ambient temperature sensor output, resulting in an
increased temperature offset error compared to the
thermocouple cold-junction ambient temperature.
6.2.1 SELF-HEAT DURING OPERATION
During normal operation, the typical self-heating error
is negligible due to the relatively small current
consumption of the MCP960X/L0X/RL0X. However,
this device integrates a processor to compute the
equations necessary to convert the thermocouple EMF
voltage to degrees Celsius. The processor also
maintains the I2C bus. During I2C communication, the
device operating current increases to IDD = 1.5 mA
(typical), I2C Active specification. If the bus is
continually polled for data at frequent intervals, then the
processor power dissipates heat to the temperature
sensor and the effect of self-heat can be detected.
Therefore, the recommended implementation is to
maintain polling to no more than three times per
temperature conversion period of 320 ms or use the
Burst mode feature to manage self-heat (refer to
Section 6.2.3 “Using Burst Mode to Manage
Self-Heat”). Equation 6-1 can also be used to
determine the effect of self-heat.
Thermal Pad
VIN+/VIN-
2015-2019 Microchip Technology Inc. DS20005426F-page 39
MCP960X/L0X/RL0X
EQUATION 6-1: EFFECT OF
SELF-HEATING
At room temperature (TA = +25°C) with IDD = 2.5 mA
(maximum) and VDD = 3.3V, the self-heating due to
power dissipation, T, is 0.32°C for the MQFN package.
6.2.2 CONVERSION TIME vs. SELF-HEAT
Once the ADC completes digitization, the processor
initiates the data computation routine for tCALC, which
also increases IDD. During the 18-bit ADC conversion
time (3 SPS, Samples per Second), the increased
current lasts for approximately 5% of the one-second
period. The effect of self-heat for the total power
consumed per second, including the 5% tCALC period, is
negligible. However, as the ADC resolution is reduced
from 18-bit to 16-bit, the power consuming tCALC period
increases to 20% per second. This change in resolution
adds approximately 0.04°C (typical) temperature error
due to self-heat. Tab l e 6 - 1 provides an estimate for
self-heat for all resolutions using Equation 6-1.
In order to reduce the effects of self-heat for lower
resolution settings, the Burst mode feature is
recommended to manage the effects of self-heat.
6.2.3 USING BURST MODE TO MANAGE
SELF-HEAT
The Burst mode feature is useful to manage power
dissipation while maintaining the device sensitivity to
changes in temperature (see Section 5.2.3 “Device
Configuration Register”). While the device is in
Low-Power or Shutdown mode, the master controller
executes Burst mode to sample temperature. The
number of temperature samples and the measurement
resolution settings are selected while executing the
command. While in Burst mode, if the temperature data
exceeds the alert limits, the device asserts the corre-
sponding alert output. The alert outputs are used so the
master controller does not need to continually poll the
latest temperature data and potentially increase the
temperature error.
In addition, with some applications monitoring several
hundred degrees of temperature changes, 18-bit
resolution may not be necessary. In this case, a fewer
number of burst samples reducing the resolution
enables the user to monitor fast transient temperatures
at the burst intervals. The 12-bit ADC resolution
provides approximately 3°C resolution (for Type K) and
a new sample of temperature data is computed at
approximately 20 ms intervals. Therefore, the number
of Burst mode Samples per Second can be selected to
manage the effects of self-heat using these estimates.
The temperature conversion status during Burst mode
can also be momentarily polled (using bit 7 of
Register 5-6) to detect whether the on-going sample
bursts are completed. The master controller may
terminate an on-going burst by executing a shutdown
command or resetting the Burst mode by sending
another burst command.
6.2.4 ALERT OUTPUTS
The alert outputs are intended to drive high-impedance
loads. Typically, the outputs are connected to a
microcontroller input pin. However, if the outputs are
used to drive indicators, such as LEDs or buzzers, then
a buffer circuit is recommended in order to minimize the
effects of self-heat due to the applied load (see
Figure 6-3).
FIGURE 6-3: Alert Output Buffer for LED
Indicator.
TABLE 6-1: ADC RESOLUTION vs.
SELF-HEAT
Resolution SPS
(typ.)
tCALC Duration
per Second T
18-bit 3 5% 0.0096°C
16-bit 15 20% 0.0384°C
14-bit 60 80% 0.1536°C
12-bit 240 100% 0.1920°C
Note: VDD = 3.3V and IDD = 1.5 mA (typical).
T
JA VDD IDD
=
Where:
TJ= Junction Temperature
TA= Ambient Temperature
JA = Package Thermal Resistance:
- Junction to Ambient
JC = Package Thermal Resistance:
Junction to Case
T
JC VDD IDD
=
T
TJTA
=
Alert Output
NPN
Active-High
VDD
2015-2019 Microchip Technology Inc. DS20005426F-page 40
MCP960X/L0X/RL0X
6.3 Device Features
6.3.1 I2C ADDRESSING
The MCP960X/L0X/RL0X supports up to eight devices
on the I2C bus. Applications, such as large thermal
management racks with several thermocouple sensor
interfaces, are able to monitor various temperature
zones with minimal pin count microcontrollers. This
reduces the total solution cost, while providing a highly
accurate thermal management solution using the
MCP960X/L0X/RL0X.
FIGURE 6-4: I2C Address Selection
Implementation.
6.3.2 INPUT IMPEDANCE
The MCP960X/L0X/RL0X uses a switched capacitor
amplifier input stage to gain the input signal to a
maximum resolution of 2 µV/LSb at an 18-bit ADC
setting. An internal input capacitor is used for charge
storage. The differential input impedance, ZIN_DF
, is
dominated by the sampling capacitor and the switched
capacitor amplifier sampling frequency. During a
sampling period, the charging and discharging of the
sampling capacitor creates dynamic input currents at the
input pins. Adding a 10-100 nF capacitor between the
inputs can improve stability.
Since the sampling capacitor is only switching to the
input pins during a conversion process, the input
impedance is only valid during conversion periods.
During Low-Power or Shutdown mode, the input
amplifier stage is disabled; therefore, the input
impedance is ZIN_CM, which is due to the leakage
current from ESD protection diodes, as shown in
Figure 6-5.
FIGURE 6-5: Thermocouple Input Stage.
MCP960X/L0X/RL0X
PIC®
I2C
Alert
4
GND Types K, J, T, N,
E, B, S, R
VDD
Alert
4
GND
VDD
MCP960X/L0X/RL0X
R7A R7B
R2A R2B
TABLE 6-2: RECOMMENDED
RESISTOR VALUES FOR
I2C ADDRESSING
Device # Command
Byte
Values
RXA (k)R
XB (k)
11100 000x ADDR Pin Tied to GND
21100 001x R2A = 10 R2B = 2.2
31100 010x R3A = 10 R3B = 4.3
41100 011x R4A = 10 R4B = 7.5
51100 100x R5A = 10 R5B = 13
61100 101x R6A = 10 R6B = 22
71100 110x R7A = 10 R7B = 43
81100 111x ADDR Pin Tied to VDD
Note: Standard 5% tolerance resistors are used in
the table; however, 1% tolerance resistors
provide better ratio matching.
ADDR
ADDR
VIN+
VIN-
VIN+
VIN-
Microcontroller
Unit 2/8
Unit 7/8
Ty p e s K, J , T, N ,
E, B, S, R
Up to Eight Devices
on the I2C Bus
RSS VIN+,VIN-
Sampling
Switch
SS RS
C
SAMPLE
(3.2 pF)
V
2015-2019 Microchip Technology Inc. DS20005426F-page 41
MCP960X/L0X/RL0X
6.3.3 OPEN AND SHORT DETECTION
CIRCUITS
The MCP9601/L01/RL01 has a Thermocouple open
and short circuit detection mechanism, which is imple-
mented using a Sense-Input pin (VSENSE), as shown in
Figure 1-1. The VSENSE pin and RA and RB resistors
must be connected as indicated in Figure 1-1. For
proper operation, the resistor values must also be
within the specified range. When open circuit or short
circuit conditions are detected, the OC Alert and SC
Alert Active-High Push-Pull outputs are asserted,
respectively.
For the MCP9600/L00/RL00, external circuits can be
added to detect the thermocouple status as open
(physically disconnected) or as short (thermocouple
wire in contact with the system ground or VDD). If a
passive circuit is added to the input stage, then the
circuit loading effect to the MCP9600/L00/RL00 ADC
inputs must be considered. System calibration is also
required to ensure proper accuracy. In addition,
external loads can degrade the device performance,
such as input offset, gain and Integral Nonlinearity
(INL) errors. If a low-impedance active circuit is added,
then both offset and gain errors must be calibrated.
6.3.3.1 Open-Circuit Detection Technique
For MCP9600/L00/RL00 open-circuit detection, the
Input Range bit (bit 4) of the STATUS register
(Register 5-6), can be used to detect open-circuit
conditions. This would require a few external resistors,
as shown in Figure 6-6. The passive circuit does not
affect the MCP9600/L00/RL00 accuracy (the
recommended value for RB is set to 1 M. When the
thermocouple is connected, the input Common-mode
voltage is 0.5 × VDD. When the thermocouple is
disconnected, the voltage at the VIN+ input is
0.66 × VDD and the voltage at the VIN- input is pulled
down to VSS. This change forces the Input Range bit to
be set.
The MCP9601/L01/RL01 open-circuit detection
mechanism operates similarly (see Figure 6-7), and
the detection thresholds are specified as VSiOC and
VSiNOR (see DC Characteristics).
The master controller can momentarily poll the Status
bit to detect the Open-Circuit condition. For the
MCP9601/L01/RL01, the OC Alert pin can are used as
hardware indicator.
FIGURE 6-6: Adding Open-Circuit
Detection Resistors (MCP9600/L00/RL00).
FIGURE 6-7: Adding Open-Circuit
Detection Resistors (MCP9601/L01/RL01).
Del Sig
VIN+
VIN-
MCP9600/L00/RL00
Thermocouple
+
RB
VDD
2 RB
2 RB
RB=1M
Del Sig
VIN+
VIN-
MCP9601/L01/RL01
Thermocouple
+
RA
VDD
RB
RB
VSENSE
RA= 1 M ±5% Tolerance (Max.)
RB= 2 M ±20% Range
”b + “”1
2015-2019 Microchip Technology Inc. DS20005426F-page 42
MCP960X/L0X/RL0X
6.3.4 ALIASING AND ANTI-ALIASING
FILTER
Aliasing occurs when the input signal contains time
varying signals with frequency greater than half the
sample rate. In the aliasing conditions, the ADC can
output unexpected codes. The ADC integrates a first
order sync filter; however, an external anti-aliasing filter
can provide an added filter for high noise applications.
This can be done with a simple RC low-pass filter at the
inputs, as shown in Figure 6-8. Open-circuit detection
resistors can also be added, as shown in Figure 6-9.
FIGURE 6-8: Adding a Low-Pass Filter.
FIGURE 6-9: Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter (MCP9600/L00/RL00, see Section 6.3.3
“Open and Short Detection Circuits).
FIGURE 6-10: Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter (MCP9601/L01/RL01).
6.3.5 ESD PROTECTION USING FERRITE
BEADS
Ferrite beads are highly recommended to protect the
MCP960X/L0X/RL0X and other circuits from ESD dis-
charge through the thermocouple wire. The beads sup-
press fast transient signals, such as ESD, and can be
added in-line to the ADC inputs. In addition, protection
diodes are also recommended, as shown in
Figure 6-11.
FIGURE 6-11: Adding Ferrite Beads
(MCP9600/L00/RL00).
FIGURE 6-12: Adding Ferrite Beads
(MCP9601/L01/RL01).
Del Sig
VIN+
VIN-
Thermocouple
+
C
RA
RA
RA= 100
C=0.1µF
ADC Core
Del Sig
VIN+
VIN-
Thermocouple
+
C
RA
RB
VDD
2 R
B
2RB
RA
RB=1M
RA= 100
C=0.1µF
MCP9600/L00/RL00
Del Sig
VIN+
VIN-
Thermocouple
+
C
RC
RA
VDD
R
B
RB
RC
MCP9601/L01/RL01
RA= 1 M ±5% Tolerance (Max.)
RB= 2 M ±20% Range
RC= 100
C=0.1µF
VSENSE
Del Sig
VIN+
VIN-
Thermocouple
+
C
RA
RBVDD
2RB
RA
RB= 1 M
RA= 100
C = 0.1 µF
L = Ferrite Bead
D = Diode
L
L
VDD
2RB
D
D
D
D
MCP9600/L00/RL00
Del Sig
VIN+
VIN-
Thermocouple
+
C
RC
RAVDD
RB
RC
L
L
VDD
RB
D
D
D
D
MCP9601/L01/RL01
RA= 1 M ±5% Tolerance (Max.)
RB= 2 M ±20% Range
RC= 100
C=0.1µF
L = Ferrite Bead
D = Diode
VSENSE
F/kh ,r \ F/kh r \ { 15‘ yxxxxxxx xxxxxxx xxxxxxx YYWWNNN Fri 1/ : NNN
2015-2019 Microchip Technology Inc. DS20005426F-page 43
MCP960X/L0X/RL0X
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
20-Lead MQFN (5 × 5 × 1.0 mm) Examples
PIN 1
(
PIN 1
(
MCP9600
E/MX
1932256
PIN 1
(
96L00
1932256
3
e
PIN 1
(
96RL00
1932256
PIN 1
(
9601
1932256
PIN 1
(
96L01
1932256
PIN 1
(
96RL01
1932256
SIDE VIEW g 0% W L w , ‘ E , Em ilfiw «mo 38 N am
2015-2019 Microchip Technology Inc. DS20005426F-page 44
MCP960X/L0X/RL0X
B
A
0.10 C
0.10 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C
0.08 C
Microchip Technology Drawing C04-186B Sheet 1 of 2
2X
20X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
D
E
D2
E2
K
20X b
e
L
(A3)
A
A1
2015-2019 Microchip Technology Inc. DS20005426F-page 45
MCP960X/L0X/RL0X
Microchip Technology Drawing C04-186B Sheet 2 of 2
Number of Pins
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.65 BSC
0.20 REF
0.35
0.25
0.90
0.00
0.30
0.40
0.95
0.02
MILLIMETERS
MIN NOM
20
0.45
0.35
1.00
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Exposed Pad Length
D
D2 3.15
5.00 BSC
3.25 3.35
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
3.15
5.00 BSC
3.25 3.35
DD$DE 5% JM L ——_.J_ \ a El Ermo El El «’ ‘OOO ;—DflDD
2015-2019 Microchip Technology Inc. DS20005426F-page 46
MCP960X/L0X/RL0X
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-186B
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
SILK SCREEN
1
2
20
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1
Optional Center Pad Width
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
C2
Y2
X2
3.35
3.35
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.50
4.50
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.55
0.40
GDistance Between Pads 0.20
NOM
[MQFN] - (Also called VQFN)
C1
C2
EV
EV
E
X2
Y2
ØV
G
Y1
X1
2015-2019 Microchip Technology Inc. DS20005426F-page 48
MCP960X/L0X/RL0X
APPENDIX A: REVISION HISTORY
Revision F (August 2019)
The following is the list of modifications:
1. Added the MCP9601/L01/RL01 device family
and related information throughout the
document.
Revision E (January 2019)
The following is the list of modifications:
1. Added the MCP96RL00/RL01 device and
related information throughout the document.
Revision D (August 2018)
The following is the list of modifications:
1. Added the MCP96L00 device and related
information throughout the document.
Revision C (September 2017)
The following is the list of modifications:
1. Updated Figure 4-3, Equation 5-1,
Equation 5-2 and Equation 5-3.
2. Updated Section 6.3.3.1 “Open-Circuit
Detection Technique”.
3. Various typographical edits.
Revision B (June 2016)
The following is the list of modifications:
1. Corrected the pin description error for pins 19
and 20 on page 1.
2. Added the MCP9600 Evaluation Board picture
on page 2.
3. Added Section 6.3.3.1 “Open-Circuit
Detection Technique” and updated
Section 6.3.4 “Aliasing and Anti-Aliasing
Filter” and Section 6.3.5 “ESD Protection
Using Ferrite Beads”.
4. Updated the Product Identification System
section.
Revision A (August 2015)
Original release of this document.
PART No. V BE] lxx
2015-2019 Microchip Technology Inc. DS20005426F-page 49
MCP960X/L0X/RL0X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP9600: Signal Conditioning IC(1)
MCP9600T: Signal Conditioning IC(1) (Tape and Reel)
MCP96L00: Signal Conditioning IC(1)
MCP96L00T: Signal Conditioning IC(1) (Tape and Reel)
MCP96RL00: Signal Conditioning IC(1)
MCP96RL00T: Signal Conditioning IC(1) (Tape and Reel)
MCP9601: Signal Conditioning IC(1)
MCP9601T: Signal Conditioning IC(1) (Tape and Reel)
MCP96L01: Signal Conditioning IC(1)
MCP96L01T: Signal Conditioning IC(1) (Tape and Reel)
MCP96RL01: Signal Conditioning IC(1)
MCP96RL01T: Signal Conditioning IC(1) (Tape and Reel)
Tape and Reel
Option:
T = Tape and Reel(2)
Temperature Range: E = -40°C to +125°C
Package: MX = More Thin Plastic Quad Flat, MQFN, 20-Lead
Note 1: For custom thermocouple types or custom
features, please contact your local Microchip
sales office. Minimum purchase volumes are
required.
2: Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
Examples:
a) MCP9600-E/MX: Extended temperature,
20-lead MQFN package
b) MCP9600T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
c) MCP96L00-E/MX: Extended Temperature,
20-lead MQFN package
d) MCP96L00T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
e) MCP96RL00-E/MX: Extended temperature,
20-lead MQFN package
f) MCP96RL00T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
g) MCP9601-E/MX: Extended temperature,
20-lead MQFN package
h) MCP9601T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
i) MCP96L01-E/MX: Extended Temperature,
20-lead MQFN package
j) MCP96L01T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
k) MCP96RL01-E/MX: Extended temperature,
20-lead MQFN package
l) MCP96RL01T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
PART NO.(1) X/XX
PackageTemperature
Range
Device
[X](2)
Tape and Reel
Option
2015-2019 Microchip Technology Inc. DS20005426F-page 50
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4976-8
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
6‘ MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
2015-2019 Microchip Technology Inc. DS20005426F-page 51
AMERICAS
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