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Educational Books

Supplier: Texas Instruments

Subtitle: Maker and DIY Educational Books
Description:

Category: Test, Tools, Other ProductsMaker/DIY, EducationalBooks

Robotics System Lab kit MAX (TI-RSLK MAX)

Supplier: Texas Instruments

Subtitle: TIRSLK-EVM - Robotics System Lab kit MAX (TI-RSLK MAX)
Description: The TI Robotics System Lab kit MAX (TI-RSLK MAX) accelerates the learning and building of robotics systems, leading students to explore real-world applications. The TI-RSLK MAX is the fast track to getting students up and running with their own solderless robotic kit, providing hardware and curri...

Category: Test, Tools, Other ProductsMaker/DIY, EducationalEducational, Robotics Kits

14-24-LOGIC-EVM Generic Logic Evaluation Module

Texas Instruments 14-24-LOGIC-EVM

Supplier: Texas Instruments

Subtitle: Generic Logic Evaluation Module Supporting 14 through 24 Pin PW, DB, D, DW, NS, P, N, and DGV Packages
Description: This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

16-Pin QFN to DIP Adapter Evaluation Module

Texas Instruments QFN16-DIP-EVM

Supplier: Texas Instruments

Subtitle: QFN16-DIP-EVM - 16-Pin QFN to DIP Adapter Evaluation Module
Description: The QFN16-DIP-EVM provides a fast and easy platform for prototyping TI's RUM16 package parts. This tool is targeted especially for TI's Quad OpAmps but may be used with any device with the same footprint. Scoring allows each device to be separated into individual circuit boards. With included ter...

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

5-8-LOGIC-EVM Generic Logic Evaluation Module

Texas Instruments 5-8-LOGIC-EVM

Supplier: Texas Instruments

Subtitle: Generic Logic Evaluation Module Supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV Packages
Description: Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

DIP Adapter EVM

Texas Instruments DIP-ADAPTER-EVM

Supplier: Texas Instruments

Subtitle: DIP Adapter Evaluation Module
Description: DIP-Adapter-EVM provides an easy, low cost way to prototype small surface mount IC’s. Supports these TI packages: D or U(SOIC-8), PW(TSSOP-8), DGK(MSOP-8), DBV(SOT23-6, SOT23-5 and SOT23-3), DCK(SC70-6 and SC70-5) and DRL(SOT563-6). May be used with terminal strips (Samtec TS-132-G-AA recommended...

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

SMALL-AMP-DIP-EVM Evaluation Module

Texas Instruments SMALL-AMP-DIP-EVM

Supplier: Texas Instruments

Subtitle: For Small Package Op Amp Prototyping
Description: The Small-Amp-DIP-EVM speeds up small package op amp prototyping by providing a fast and easy way to interface with many industry-standard small-size packages. The Small-Amp-DIP-EVM supports 8 small package options including: DPW-5 (X2SON), DSG-8 (WSON), DCN-8 (SOT), DDF-8 (SOT), RUG-10 (X2QFN), ...

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

Surface Mount to DIP Header Adapter for Quick Testing

Texas Instruments EVM-LEADED1

Supplier: Texas Instruments

Subtitle: EVM-LEADED1 Surface Mount to DIP Header Adapter for Quick Testing of TI's 5,8,10,16, and 24 pin Leaded Packages
Description: The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT, DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards

Surface Mount to DIP Header Adapter for Testing of TI's

Texas Instruments EVM-LEADLESS1

Supplier: Texas Instruments

Subtitle: EVM-LEADLESS1 Surface Mount to DIP Header Adapter for Testing of TI's 6,8,10,12,14,16, & 20 Pin Leadless Packages
Description: The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.

Category: Test, Tools, Other ProductsPrototyping, Fabrication ProductsPrototype BoardsAdapter, Breakout Boards